JP2008213103A - Working fluid feeding device of wire saw - Google Patents

Working fluid feeding device of wire saw Download PDF

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JP2008213103A
JP2008213103A JP2007055567A JP2007055567A JP2008213103A JP 2008213103 A JP2008213103 A JP 2008213103A JP 2007055567 A JP2007055567 A JP 2007055567A JP 2007055567 A JP2007055567 A JP 2007055567A JP 2008213103 A JP2008213103 A JP 2008213103A
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wire
machining
machining fluid
working fluid
wire saw
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Yoshiaki Tanaka
義明 田中
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YASUNAGA WIRE SAW SYSTEMS CO L
YASUNAGA WIRE SAW SYSTEMS CO Ltd
Yasunaga Corp
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YASUNAGA WIRE SAW SYSTEMS CO L
YASUNAGA WIRE SAW SYSTEMS CO Ltd
Yasunaga Corp
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Priority to JP2007055567A priority Critical patent/JP2008213103A/en
Publication of JP2008213103A publication Critical patent/JP2008213103A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a working fluid feeding device of a wire saw, which reduces the amount of working fluid usage and improves the machining ability and machining accuracy of the wire saw, by making the working fluid efficiently adhere to a wire. <P>SOLUTION: The wire saw functions to cut a workpiece 5 by pressing the same to the reciprocating wire 2 in a perpendicular direction while feeding the working fluid to the wire 2. The working fluid feeding device is composed of a working fluid introducing guide 13 which is arranged between a working fluid feeding nozzle 11 for ejecting the working fluid and a wire row 4, for introducing the working fluid ejected from the working fluid feeding nozzle 11, on an upper surface of the wire 2 in the vicinity of a machining point 15. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、走行するワイヤに加工液を供給しながら被加工物を押し付けて切断するワイヤソーの加工液供給装置に関する。   The present invention relates to a machining fluid supply device for a wire saw that presses and cuts a workpiece while supplying the machining fluid to a traveling wire.

シリコン等の半導体結晶材料や水晶等の硬脆性材料(ワーク:被加工物)からウェハ状の薄板を製造する手段として、研磨剤を油性又は水性の分散媒に混合した加工液とワイヤとを使用してこれらのワークを切断加工するワイヤソーが知られている。
このワイヤソーは、所定のピッチでワイヤが巻きつけられた溝付きのローラと、ワイヤに加工液を供給する加工液供給装置とを備えており、ローラを回転駆動してワイヤを往復動させ、加工液供給装置によりこの往復動するワイヤに加工液を供給して付着させつつ、ワークを往復動するワイヤに対して垂直方向に押し付けて切断する。
As a means to manufacture wafer-like thin plates from semiconductor crystal materials such as silicon and hard and brittle materials such as quartz (workpiece: work piece), a processing liquid and wire in which abrasive is mixed with an oily or aqueous dispersion medium are used. A wire saw for cutting these workpieces is known.
This wire saw includes a grooved roller around which a wire is wound at a predetermined pitch, and a processing liquid supply device that supplies a processing liquid to the wire. The roller is driven to rotate to reciprocate the wire. While supplying and attaching the machining liquid to the reciprocating wire by the liquid supply device, the workpiece is pressed and cut in the vertical direction against the reciprocating wire.

加工液供給装置として、例えば水平方向に往復動するワイヤの上方に加工液供給ノズルを備え、加工液を貯留するタンクからポンプ等により供給された加工液を加工液供給ノズルからワイヤに向けて下方に噴射供給するものがある。
しかしながら、このような加工液供給装置では、加工液はポンプ等により圧縮されて加工液供給ノズルから噴射されるとともに、ワイヤに対して加工液が垂直方向から供給されるので、加工液がワイヤ列の間を通過してしまいワイヤに効果的に付着することが困難である。
As the machining liquid supply device, for example, a machining liquid supply nozzle is provided above a wire that reciprocates in the horizontal direction, and the machining liquid supplied by a pump or the like from a tank that stores the machining liquid is directed downward from the machining liquid supply nozzle toward the wire. There are those that inject and supply.
However, in such a machining fluid supply apparatus, the machining fluid is compressed by a pump or the like and sprayed from the machining fluid supply nozzle, and the machining fluid is supplied to the wire from the vertical direction. It is difficult to adhere to the wire effectively.

このようにワイヤに対する加工液の付着量が少ないと、ワイヤの切れ味が悪く、加工能力が低下するとともに、切断厚さの不均一や切断面のうねり、表面粗さ等の加工精度が低下する虞がある。
そこで、ワイヤの直近下方に加工液の受け板を設け、この受け板の上に加工液を載せるように供給することで、受け板の上に載った加工液をワイヤが引き込むようにしてワークとの接触部である加工点に供給する方法も知られている(特許文献1)。
特開2005−153031号公報
Thus, when the amount of the processing liquid adhering to the wire is small, the sharpness of the wire is poor, the processing capability is lowered, and the processing accuracy such as non-uniform cutting thickness, waviness of the cut surface, and surface roughness may be reduced. There is.
Therefore, a working fluid receiving plate is provided immediately below the wire, and by supplying the working fluid on the receiving plate, the work fluid placed on the receiving plate is drawn into the wire so that the wire is drawn. There is also known a method of supplying to a processing point that is a contact portion of (Patent Document 1).
Japanese Patent Laying-Open No. 2005-153031

しかしながら、上記の特許文献1に記載されたような構成のワイヤソーであっても、高速走行するワイヤに対して略垂直方向に加工液が供給されるので、加工液がワイヤに弾かれて効率よくワイヤに付着することが困難である。
特に、被加工物を上方からワイヤに押し付けて切断するダウンカット方式のワイヤソーでは、ワイヤの上面が被加工物に接触するので、ワイヤの上面に加工液を多く付着することが望ましいが、上記の特許文献1のようにワイヤの下方に受け板を備えても、ワイヤの下面には加工液は付着し易くなるものの上面には比較的付着し難い。したがって、ダウンカット方式のワイヤソーでは、例え上記のような受け板を備えたとしても、加工液の使用量を増加せざるを得ず、経済性の確保が困難となる虞がある。
However, even with a wire saw configured as described in Patent Document 1 above, since the machining fluid is supplied in a direction substantially perpendicular to the wire traveling at high speed, the machining fluid is repelled by the wire and efficiently. It is difficult to adhere to the wire.
In particular, in a down-cut type wire saw that presses and cuts a workpiece against the wire from above, the upper surface of the wire comes into contact with the workpiece. Even if a receiving plate is provided below the wire as in Patent Document 1, the processing liquid is likely to adhere to the lower surface of the wire, but is relatively difficult to adhere to the upper surface. Accordingly, in the down-cut type wire saw, even if the above-described receiving plate is provided, the amount of machining fluid used must be increased, and it may be difficult to ensure economic efficiency.

本発明は、上述の点に鑑みてなされたもので、加工液を効率よくワイヤに付着させて、加工液の使用量を抑えつつ加工能力及び加工精度が向上するワイヤソーの加工液供給装置を提供することを目的する。   The present invention has been made in view of the above points, and provides a machining fluid supply device for a wire saw in which machining fluid is efficiently attached to a wire and machining capacity and machining accuracy are improved while suppressing the amount of machining fluid used. Aim to do.

上記目的を達成するため、請求項1の発明では、走行するワイヤに加工液を供給しながら被加工物を前記ワイヤに対し垂直方向に押し付けて切断するワイヤソーにおいて、加工液を排出する加工液供給ノズルとワイヤとの間に、加工液供給ノズルから排出した加工液を、ワイヤと被加工物とが接触する加工点の近傍でワイヤの上面に導入する加工液導入ガイドを備えたことを特徴とする。   In order to achieve the above object, according to the first aspect of the present invention, in the wire saw that cuts the workpiece by pressing the workpiece in a direction perpendicular to the wire while supplying the machining fluid to the traveling wire, the machining fluid supply for discharging the machining fluid is provided. A machining fluid introduction guide is provided between the nozzle and the wire to introduce the machining fluid discharged from the machining fluid supply nozzle onto the upper surface of the wire in the vicinity of the machining point where the wire and the workpiece are in contact with each other. To do.

また、請求項2の発明では、請求項1において、加工液導入ガイドは、ワイヤの上方に配置された加工液供給ノズルから、ワイヤに沿って下方に傾斜しつつ加工点に向かって延びるように形成されたことを特徴とする。
また、請求項3の発明では、請求項1または2において、ワイヤは複数列に並んで配置されるとともに、加工液供給ノズルと加工液導入ガイドとの間でワイヤの列方向に延び、加工液供給ノズルから供給された加工液を一時的に溜めて、全ての複数列のワイヤに均一に供給されるように加工液導入ガイドに加工液を排出する加工液貯留槽が更に備えられたことを特徴とする。
According to a second aspect of the present invention, in the first aspect, the machining fluid introduction guide extends from the machining fluid supply nozzle disposed above the wire toward the machining point while being inclined downward along the wire. It is formed.
According to a third aspect of the present invention, in the first or second aspect, the wires are arranged in a plurality of rows and extend in the row direction of the wire between the machining fluid supply nozzle and the machining fluid introduction guide. A processing liquid storage tank is further provided for temporarily storing the processing liquid supplied from the supply nozzle and discharging the processing liquid to the processing liquid introduction guide so as to be uniformly supplied to all the plurality of rows of wires. Features.

請求項1の発明では、加工液供給ノズルから排出された加工液は、加工液導入ガイドにより、加工点の近傍でワイヤに供給されるので、加工点に加工液が効率よく供給され、加工液の使用量を抑えつつ加工能力及び加工精度の向上を図ることができる。また、加工液はワイヤの上面に供給されるので、ワイヤの上面に加工液が付着し易くなる。したがって、特にダウンカット方式のワイヤソーでは、更に効率よく加工点に加工液を供給することができる。   According to the first aspect of the present invention, since the machining liquid discharged from the machining liquid supply nozzle is supplied to the wire in the vicinity of the machining point by the machining liquid introduction guide, the machining liquid is efficiently supplied to the machining point. It is possible to improve the processing capability and processing accuracy while suppressing the amount of use. Further, since the processing liquid is supplied to the upper surface of the wire, the processing liquid is likely to adhere to the upper surface of the wire. Therefore, particularly in a down cut type wire saw, the machining liquid can be supplied to the machining point more efficiently.

請求項2に記載の発明では、加工液導入ガイドは、加工点に向かって下方に傾斜しつつワイヤに沿って延びているので、ワイヤへの供給時の加工液の移動方向とワイヤの移動方向とが略一致し、かつこれらの移動速度の差が低減されるので、加工液がワイヤに弾かれ難くなり、ワイヤに加工液を更に付着し易くすることができる。
請求項3の発明では、加工液が複数列のワイヤに均一に供給されるので、ワイヤ毎の加工能力が均一となり、安定した加工精度を得ることができる。
In the second aspect of the present invention, since the machining fluid introduction guide extends along the wire while being inclined downward toward the machining point, the machining fluid moving direction and the wire moving direction during supply to the wire And the difference between these moving speeds are reduced, making it difficult for the working fluid to be repelled by the wire and making it easier for the working fluid to adhere to the wire.
In the invention of claim 3, since the machining fluid is uniformly supplied to the plurality of rows of wires, the machining capability for each wire becomes uniform, and stable machining accuracy can be obtained.

以下、本発明の実施形態を図面に基づいて説明する。
図1は、本発明に係るワイヤソーの加工部1の構成を示す斜視図である。本実施形態では、ワイヤソーとして、シリコン等のワーク(被加工物)を上方からワイヤ2に押し付けて切断するダウンカット方式のワイヤソーを採用している。
図1に示すように、ワイヤソーの加工部1は、水平方向に間隔を置いて配置された2個のローラ3を備えている。ローラ3には所定のピッチ(スライスすべき板厚+切り代)で複数の溝が形成されており、この溝に新線リール(図示せず)から繰り出されたワイヤ2が螺旋状に巻き付けられてローラ3間にワイヤ列4が形成されている。ローラ3はモータ(図示せず)により回転駆動されて、ワイヤ2を往復動させる機能を有する。また、ワイヤ2の繰出し側には張力調整手段(図示せず)が設けられており、ワイヤ2の張力を所定の値に調整可能とされている。
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a configuration of a processing portion 1 of a wire saw according to the present invention. In the present embodiment, a down-cut type wire saw that presses a workpiece (workpiece) such as silicon against the wire 2 from above is cut as the wire saw.
As shown in FIG. 1, the processing portion 1 of the wire saw includes two rollers 3 arranged at intervals in the horizontal direction. A plurality of grooves are formed on the roller 3 at a predetermined pitch (plate thickness to be sliced + cutting allowance), and a wire 2 fed from a new reel (not shown) is spirally wound around the grooves. A wire row 4 is formed between the rollers 3. The roller 3 is driven to rotate by a motor (not shown) and has a function of reciprocating the wire 2. Further, tension adjusting means (not shown) is provided on the feeding side of the wire 2 so that the tension of the wire 2 can be adjusted to a predetermined value.

図2は、ワイヤソーの加工部1の概略構成を示す正面図である。
図2に示すように、ワーク5は、ベース材6を介してワーク固定具7に接着されて固定される。ワーク固定具7はワーク昇降装置8に着脱自在に固定される。ワーク昇降装置8は、ワーク固定具7を介してワーク5をローラ3間で上下動させる機能を有する。ワイヤ列4の上方には、ワーク5を挟んだ位置に加工液供給装置10が夫々設けられている。
FIG. 2 is a front view showing a schematic configuration of the processing portion 1 of the wire saw.
As shown in FIG. 2, the workpiece 5 is bonded and fixed to a workpiece fixture 7 through a base material 6. The work fixture 7 is detachably fixed to the work lifting device 8. The workpiece lifting / lowering device 8 has a function of moving the workpiece 5 up and down between the rollers 3 via the workpiece fixture 7. Above the wire row 4, machining fluid supply devices 10 are respectively provided at positions sandwiching the workpiece 5.

加工液供給装置10は、ローラ3間で走行するワイヤ列4に加工液を供給する機能を有している。本実施形態のワイヤソーでは、加工液として、研磨剤を油性又は水性の分散媒に混合したものが採用されている。
図3は加工液供給装置の構造を示す斜視図である。
図3に示すように、加工液供給装置10は、加工液を噴射する加工液供給ノズル11、この加工液供給ノズル11から噴射供給された加工液を一時的に溜める加工液供給安定化槽(加工液貯留槽)12、加工液供給安定化槽12の底面からワイヤ列4に向かって延びるガイドプレート(加工液導入ガイド)13を含んで構成されている。
The machining liquid supply device 10 has a function of supplying the machining liquid to the wire row 4 that travels between the rollers 3. In the wire saw of the present embodiment, a processing liquid in which an abrasive is mixed with an oily or aqueous dispersion medium is employed as the processing liquid.
FIG. 3 is a perspective view showing the structure of the machining fluid supply apparatus.
As shown in FIG. 3, the machining fluid supply apparatus 10 includes a machining fluid supply nozzle 11 that ejects a machining fluid, and a machining fluid supply stabilization tank (temporarily storing the machining fluid ejected and supplied from the machining fluid supply nozzle 11. The processing liquid storage tank) 12 and a guide plate (processing liquid introduction guide) 13 extending from the bottom surface of the processing liquid supply stabilization tank 12 toward the wire row 4 are configured.

図4〜図6は、加工液供給ノズル11の形状を示す構造図であり、図4は正面断面図、図5は側面断面図、図6は加工液供給ノズル11の他の実施形態の側面断面図である。
加工液供給ノズル11は、図4に示すように円筒状に形成されており、ワイヤ列4の上方で軸線がワイヤ列4の列方向に延びるように配置されている。図5に示すように、加工液供給ノズル11は、基端11aが開放している一方、先端11bが閉塞して形成されている。加工液供給ノズル11の基端11aは、図示しない供給管の一端に接続されている。供給管の他端は図示しないポンプを介して加工液を貯留するタンクと接続されている。加工液供給ノズル11の下端には加工液を排出する孔11cがローラ3と略同じ幅の間で複数設けられている。なお、加工液供給ノズル11の下端には、複数の孔ではなく、図6に示すようにローラ3と略同じ幅に延びたスリット11dを設けてもよい。
4 to 6 are structural views showing the shape of the machining liquid supply nozzle 11, FIG. 4 is a front sectional view, FIG. 5 is a side sectional view, and FIG. 6 is a side view of another embodiment of the machining liquid supply nozzle 11. It is sectional drawing.
The machining liquid supply nozzle 11 is formed in a cylindrical shape as shown in FIG. 4, and is arranged above the wire row 4 so that the axis extends in the row direction of the wire row 4. As shown in FIG. 5, the machining liquid supply nozzle 11 is formed with the proximal end 11 a being open and the distal end 11 b being closed. The base end 11a of the machining liquid supply nozzle 11 is connected to one end of a supply pipe (not shown). The other end of the supply pipe is connected to a tank for storing the machining fluid via a pump (not shown). At the lower end of the machining liquid supply nozzle 11, a plurality of holes 11 c for discharging the machining liquid are provided between substantially the same width as the rollers 3. In addition, you may provide the slit 11d extended in the substantially the same width as the roller 3 as shown in FIG.

図7は、加工液供給安定化槽12及びガイドプレート13の構造を示す断面図である。
図7に示すように、加工液供給安定化槽12は、ワイヤ列4の列方向に延び上面が開放した槽形状をなしており、加工液供給ノズル11の下方に配置されている。加工液供給安定化槽12の下端部には、ローラ3と略同じ幅に延びたスリット状の孔12aが設けられている。加工液供給安定化槽12には、孔12aを覆うようにメッシュ状の網14が取り付けられている。
FIG. 7 is a cross-sectional view showing the structure of the machining liquid supply stabilization tank 12 and the guide plate 13.
As shown in FIG. 7, the machining liquid supply stabilization tank 12 has a tank shape that extends in the row direction of the wire row 4 and has an open upper surface, and is disposed below the machining liquid supply nozzle 11. A slit-like hole 12 a extending substantially the same width as the roller 3 is provided at the lower end of the machining liquid supply stabilizing tank 12. A mesh-like net 14 is attached to the machining liquid supply stabilization tank 12 so as to cover the holes 12a.

ガイドプレート13は、両側端13aが上方に屈曲して、ローラ3の幅方向と略同じ幅の樋状に形成されている。ガイドプレート13の基端部(上端部)13bは加工液供給安定化槽12の下壁と一体化して形成される一方、先端(下端)13cは下方に傾斜しつつ、ワイヤ列4とワーク5とが接触する加工点15に向かってその近傍まで延びている。ガイドプレート13の先端13cとワイヤ列4との上下間隔Laは1〜5mm、ガイドプレート13の傾斜角θaはワイヤ列4に対して平行に近い角度(10°〜30°)に設定されている。また、加工点15から先端13cまでの距離Lbは例えば5〜30mmに設定されている。   The guide plate 13 is formed in the shape of a bowl having substantially the same width as the width direction of the roller 3 with both side ends 13 a bent upward. The base end portion (upper end portion) 13b of the guide plate 13 is formed integrally with the lower wall of the machining liquid supply stabilizing tank 12, while the front end (lower end) 13c is inclined downward, while the wire row 4 and the workpiece 5 are inclined. It extends to the vicinity of the machining point 15 where it contacts. The vertical distance La between the tip 13c of the guide plate 13 and the wire row 4 is set to 1 to 5 mm, and the inclination angle θa of the guide plate 13 is set to an angle (10 ° to 30 °) that is almost parallel to the wire row 4. . The distance Lb from the processing point 15 to the tip 13c is set to 5 to 30 mm, for example.

このような構成により加工液供給ノズル11から排出されて加工液供給安定化槽12に貯留された加工液は、孔12aからローラ3の幅方向に広がって排出され、ガイドプレート13の上面をカーテン状に伝って流れ落ちる。そして、加工液はガイドプレート13の先端13cからワイヤ列4の幅一杯にワイヤ2の上面に落下する。このようにワイヤ2に加工液を供給しつつワイヤ2を往復動させ、ワーク昇降装置8によりワーク5を降下させてワイヤ2の上面にワーク5を押し付けることにより、加工点15で加工液中の研磨剤が転動し、ラッピング加工が行われ、ワーク5が切断される。   With such a configuration, the processing liquid discharged from the processing liquid supply nozzle 11 and stored in the processing liquid supply stabilization tank 12 is discharged from the hole 12a in the width direction of the roller 3, and the upper surface of the guide plate 13 is curtained. It flows down to the shape. Then, the machining liquid falls from the tip 13 c of the guide plate 13 to the upper surface of the wire 2 to the full width of the wire row 4. In this way, the wire 2 is reciprocated while supplying the machining fluid to the wire 2, the workpiece 5 is lowered by the workpiece lifting device 8, and the workpiece 5 is pressed against the upper surface of the wire 2. The abrasive rolls, lapping is performed, and the workpiece 5 is cut.

本発明では、ガイドプレート13の先端13cがワイヤ列4の上方を加工点15に向かってその近傍まで延びているので、加工点15に加工液が効率よく供給される。したがって、加工液の使用量を抑えつつ、ワイヤ2の切れ味が確保されるとともに切断時の熱の発生量が抑えられ、加工能力及び加工精度の向上を図ることができる。また、加工液はワイヤ2の上面に供給されるので、ワイヤ2の上面に加工液が付着し易くなる。したがって、特にダウンカット方式のワイヤソーでは、更に効率よく加工点15に加工液を供給することができる。   In the present invention, the tip 13c of the guide plate 13 extends above the wire row 4 toward the machining point 15 to the vicinity thereof, so that the machining liquid is efficiently supplied to the machining point 15. Therefore, while reducing the amount of machining fluid used, the sharpness of the wire 2 is ensured and the amount of heat generated at the time of cutting is suppressed, so that the machining capability and machining accuracy can be improved. In addition, since the machining liquid is supplied to the upper surface of the wire 2, the machining liquid easily adheres to the upper surface of the wire 2. Therefore, particularly in a down cut type wire saw, the machining liquid can be supplied to the machining point 15 more efficiently.

更に、本実施形態では、ガイドプレート13は先端13cがワイヤ列4に対して平行に近い角度で延びるように配置されているので、加工点15に向かうワイヤ2の移動方向と加工液の移動方向とが略一致するとともに、加工液の流速とワイヤ2の移動速度との差(相対速度)が小さくなる。したがって、ワイヤ2の上面に加工液をスムーズに載せることができ、ワイヤ2の上面に加工液を効果的に付着させることができる。   Furthermore, in the present embodiment, the guide plate 13 is arranged so that the tip 13c extends at an angle that is nearly parallel to the wire row 4, so the movement direction of the wire 2 toward the machining point 15 and the movement direction of the machining liquid And the difference (relative speed) between the flow rate of the machining fluid and the moving speed of the wire 2 become small. Therefore, the machining liquid can be smoothly placed on the upper surface of the wire 2, and the machining liquid can be effectively adhered to the upper surface of the wire 2.

これにより、加工点15に加工液を効率よく供給することができるので、加工液の使用量を抑制しつつ、加工液の供給不足による加工能力の低下や発熱を抑制することができる。したがって、生産性を向上させるとともに、ワーク5の切断厚さの不均一や切断面のうねり、表面粗さ等が抑制されて加工精度を向上させることができる。
また、加工液供給ノズル11とガイドプレート13との間に加工液供給安定化槽12を設け、加工液供給ノズル11から排出した加工液を一時溜め、ローラ3の幅方向に均一にガイドプレート13の上面を伝ってワイヤ列4に供給するので、ワイヤ2毎の切削能力が均一となり、安定した加工性能を得ることができる。例えば加工液供給ノズル11の孔11cに加工液が詰まり均一に加工液が排出されない場合でも、加工液供給安定化槽12によりローラ3の幅方向に均一に加工液が排出されるので、切断加工前での加工液供給ノズル11の清掃等のメインテナンスを頻繁に行う必要がなくなり、生産性を向上させることができる。
Thereby, since the machining fluid can be efficiently supplied to the machining point 15, it is possible to suppress a decrease in machining ability and heat generation due to insufficient supply of the machining fluid while suppressing the amount of machining fluid used. Therefore, productivity can be improved, and non-uniform cutting thickness of the workpiece 5, waviness of the cut surface, surface roughness, and the like can be suppressed, and processing accuracy can be improved.
Further, a machining liquid supply stabilization tank 12 is provided between the machining liquid supply nozzle 11 and the guide plate 13, and the machining liquid discharged from the machining liquid supply nozzle 11 is temporarily stored, and the guide plate 13 is uniformly distributed in the width direction of the roller 3. Therefore, the cutting ability of each wire 2 becomes uniform, and stable machining performance can be obtained. For example, even when the machining liquid is clogged in the hole 11c of the machining liquid supply nozzle 11 and the machining liquid is not uniformly discharged, the machining liquid is uniformly discharged in the width direction of the roller 3 by the machining liquid supply stabilizing tank 12, so that the cutting process is performed. It is not necessary to frequently perform maintenance such as cleaning of the machining fluid supply nozzle 11 before, and the productivity can be improved.

また、本実施形態として採用されたダウンカット方式のワイヤソーは、切断後のワーク5の倒れこみが発生しないので、切断距離の長いものでも効率よく加工が行われ、ワーク5をワイヤ列4に対して下方から押し付けて切断するアップカット方式のワイヤソーと比較して、生産性を向上させることができる。
なお、本実施形態では、加工液供給安定化槽12とガイドプレート13とが一体化しているが、これらを独立して設けてもよい。この場合、加工液供給安定化槽12の孔12aから落下した加工液を基端部13bに受けるようにガイドプレート13を配置すればよい。
In addition, the down-cut type wire saw adopted as the present embodiment does not cause the workpiece 5 to fall after being cut, so that the workpiece 5 can be efficiently processed even with a long cutting distance. Compared with an up-cut type wire saw that is pressed and cut from below, productivity can be improved.
In addition, in this embodiment, although the process liquid supply stabilization tank 12 and the guide plate 13 are integrated, you may provide these independently. In this case, the guide plate 13 may be disposed so that the machining liquid dropped from the hole 12a of the machining liquid supply stabilization tank 12 is received by the base end portion 13b.

また、本実施形態では、ワイヤ2を往復動させるようにしたが、ワイヤが片方向にのみ走行する形態のワイヤソーに対しても本発明を適用することができる。
また、本実施形態では、ダウンカット方式のワイヤソーに本発明の加工液供給装置を適用したが、アップカット方式のワイヤソーにも本発明を適用することができる。
図8は、本発明の加工液供給装置を適用したアップカット方式のワイヤソーの概略構成図である。図8に示すように、アップカット方式のワイヤソーでは、ローラ3間で水平方向に張ったワイヤ列4に対して下方にベース材6が備えられており、ワイヤ2の下面がワーク5に接触することから、ワイヤ2の下面に加工液をより付着させることが望ましいが、本発明では、少なくとも加工液を加工点15の近傍でワイヤ2上に導入するので、加工液を加工点15に効率よく供給する効果を得ることはできる。
Moreover, in this embodiment, although the wire 2 was reciprocated, this invention is applicable also to the wire saw of the form which a wire drive | works only in one direction.
In this embodiment, the machining fluid supply apparatus of the present invention is applied to a down-cut type wire saw. However, the present invention can also be applied to an up-cut type wire saw.
FIG. 8 is a schematic configuration diagram of an up-cut type wire saw to which the machining fluid supply apparatus of the present invention is applied. As shown in FIG. 8, in the up-cut type wire saw, a base material 6 is provided below the wire row 4 stretched in the horizontal direction between the rollers 3, and the lower surface of the wire 2 contacts the workpiece 5. Therefore, it is desirable that the working fluid is further adhered to the lower surface of the wire 2. However, in the present invention, since the working fluid is introduced onto the wire 2 at least in the vicinity of the working point 15, the working fluid is efficiently applied to the working point 15. The effect of supplying can be obtained.

また、本実施形態では、研磨剤を分散媒に混合した加工液を使用した遊離吐粒方式のワイヤソーについて説明したが、ワイヤに研磨剤を固着させた固定吐粒方式のワイヤソーに対しても本発明を適用することができる。この場合、加工点に冷却用として供給するクーラントの供給装置として、本発明を採用することで、クーラントを均一かつ効率的にワイヤ列に付着させて加工点に供給することができ、クーラントによる冷却性能を向上させることができる。   Further, in this embodiment, a free-spitting type wire saw using a processing liquid in which an abrasive is mixed with a dispersion medium has been described, but the present invention is also applied to a fixed-spouting-type wire saw in which an abrasive is fixed to a wire. The invention can be applied. In this case, by adopting the present invention as a coolant supply device that supplies the processing point for cooling, the coolant can be uniformly and efficiently attached to the wire row and supplied to the processing point. Performance can be improved.

本発明に係るワイヤソーの加工部の構成を示す斜視図である。It is a perspective view which shows the structure of the process part of the wire saw which concerns on this invention. ワイヤソーの加工部の概略構成を示す正面図である。It is a front view which shows schematic structure of the process part of a wire saw. 加工液供給装置の構造を示す斜視図である。It is a perspective view which shows the structure of a process liquid supply apparatus. 加工液供給ノズルの形状を示す正面断面図である。It is front sectional drawing which shows the shape of a process liquid supply nozzle. 加工液供給ノズルの形状を示す側面断面図である。It is side surface sectional drawing which shows the shape of a process liquid supply nozzle. 加工液供給ノズルの他の実施形態の側面断面図であるIt is side surface sectional drawing of other embodiment of a process liquid supply nozzle. 加工液供給安定化槽及びガイドプレートの構造を示す断面図である。It is sectional drawing which shows the structure of a process liquid supply stabilization tank and a guide plate. 本発明に係るアップカット方式のワイヤソーの加工部の概略構成図である。It is a schematic block diagram of the process part of the up-saw type wire saw which concerns on this invention.

符号の説明Explanation of symbols

1 加工部
2 ワイヤ
3 ローラ
4 ワイヤ列
5 ワーク
10 加工液供給装置
11 加工液供給ノズル
12 加工液供給安定化槽
13 ガイドプレート
15 加工点
DESCRIPTION OF SYMBOLS 1 Processing part 2 Wire 3 Roller 4 Wire row 5 Workpiece 10 Processing fluid supply apparatus 11 Processing fluid supply nozzle 12 Processing fluid supply stabilization tank 13 Guide plate 15 Processing point

Claims (3)

走行するワイヤに加工液を供給しながら被加工物を前記ワイヤに対し垂直方向に押し付けて切断するワイヤソーにおいて、
前記加工液を排出する加工液供給ノズルと前記ワイヤとの間に、前記加工液供給ノズルから排出した加工液を、前記ワイヤと前記被加工物とが接触する加工点の近傍で前記ワイヤの上面に導入する加工液導入ガイドを備えたことを特徴とするワイヤソーの加工液供給装置。
In a wire saw for cutting a workpiece by pressing the workpiece in a direction perpendicular to the wire while supplying a machining fluid to the traveling wire,
Between the machining liquid supply nozzle for discharging the machining liquid and the wire, the machining liquid discharged from the machining liquid supply nozzle is disposed on the upper surface of the wire in the vicinity of a machining point where the wire and the workpiece are in contact with each other. A wire saw machining fluid supply device comprising a machining fluid introduction guide for introduction into a wire saw.
前記加工液導入ガイドは、前記ワイヤの上方に配置された前記加工液供給ノズルから、前記ワイヤに沿って下方に傾斜しつつ前記加工点に向かって延びるように形成されたことを特徴とする請求項1に記載のワイヤソーの加工液供給装置。   The machining fluid introduction guide is formed to extend from the machining fluid supply nozzle disposed above the wire toward the machining point while being inclined downward along the wire. Item 2. A wire saw machining fluid supply device according to Item 1. 前記ワイヤは複数列に並んで配置されるとともに、
前記加工液供給ノズルと前記加工液導入ガイドとの間で前記ワイヤの列方向に延び、前記加工液供給ノズルから供給された加工液を一時的に溜めて、全ての前記複数列のワイヤに均一に供給されるよう前記加工液導入ガイドに加工液を排出する加工液貯留槽が更に備えられたことを特徴とする請求項1または2に記載のワイヤソーの加工液供給装置。
The wires are arranged in a plurality of rows,
It extends in the row direction of the wire between the machining fluid supply nozzle and the machining fluid introduction guide, temporarily accumulates the machining fluid supplied from the machining fluid supply nozzle, and is uniform for all the plurality of rows of wires. 3. The wire saw machining fluid supply apparatus according to claim 1, further comprising a machining fluid storage tank for discharging the machining fluid to the machining fluid introduction guide.
JP2007055567A 2007-03-06 2007-03-06 Working fluid feeding device of wire saw Pending JP2008213103A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011083833A (en) * 2009-10-13 2011-04-28 Kyocera Corp Wire saw device and method of manufacturing semiconductor substrate using the same
JP2011183503A (en) * 2010-03-08 2011-09-22 Takatori Corp Wire saw
CN107932762A (en) * 2017-12-11 2018-04-20 中国电子科技集团公司第四十六研究所 A kind of mortar spraying device and implementation method for multi-line cutting machine
CN108943456A (en) * 2017-05-23 2018-12-07 上海新昇半导体科技有限公司 Mortar intake chute, mortar feeding mechanism and wafer diced system

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JPS5827057U (en) * 1981-08-11 1983-02-21 株式会社東芝 Grinding fluid supply device
JP2005153031A (en) * 2003-11-20 2005-06-16 Yasunaga Corp Wire saw and working fluid feed method of wire saw
JP2006326756A (en) * 2005-05-26 2006-12-07 Mitsubishi Electric Corp Slurry supply mechanism of multi-wire saw

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827057U (en) * 1981-08-11 1983-02-21 株式会社東芝 Grinding fluid supply device
JP2005153031A (en) * 2003-11-20 2005-06-16 Yasunaga Corp Wire saw and working fluid feed method of wire saw
JP2006326756A (en) * 2005-05-26 2006-12-07 Mitsubishi Electric Corp Slurry supply mechanism of multi-wire saw

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011083833A (en) * 2009-10-13 2011-04-28 Kyocera Corp Wire saw device and method of manufacturing semiconductor substrate using the same
JP2011183503A (en) * 2010-03-08 2011-09-22 Takatori Corp Wire saw
CN108943456A (en) * 2017-05-23 2018-12-07 上海新昇半导体科技有限公司 Mortar intake chute, mortar feeding mechanism and wafer diced system
CN107932762A (en) * 2017-12-11 2018-04-20 中国电子科技集团公司第四十六研究所 A kind of mortar spraying device and implementation method for multi-line cutting machine
CN107932762B (en) * 2017-12-11 2019-11-15 中国电子科技集团公司第四十六研究所 A kind of mortar spraying device and realization cutting method for multi-line cutting machine

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