JP2006305685A - Wire saw device, guide bar for wire saw device and slurry supplying device for wire saw device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce warp and improve quality of a wafer cutting surface, while maintaining quality of kerf loss, TTV and surface roughness to the same level quality as conventional ones by making abrasive grain of required amount to improve warp quality enter into the wafer cutting surface, while preventing run-out of a wire by a guide bar in a wire saw device. <P>SOLUTION: Slurry is supplied to the wire 6 between the guide bars 41 and 42 and ingot 1 by the slurry supply means (a flow B) separated from clearances 43a (slurry gates; a flow D) of grooves 43 of the guide bars 41 and 42. A slurry supply passage 64 is formed in the existing guide bars 41 and 42. In an existing pipe 5 for supplying slurry, a slurry introducing plate 60 is fixed via a fixture 61. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  INDUSTRIAL APPLICABILITY The present invention is used for a wire saw device that cuts a workpiece such as a single crystal silicon ingot, a magnetic material, ceramic, glass, etc. into a thin plate shape with a wire such as a piano wire or a steel wire, a guide bar used in the wire saw device, and a wire saw device. The present invention relates to a slurry supply device.

(Prior art 1)
As shown in Patent Document 1 to be described later, the present applicant has already filed a patent application for an invention related to a wire saw device, and the contents of the invention are publicly known.

  FIG. 1 shows the configuration of the wire saw device. FIG. 1 is a view of a single crystal silicon ingot (hereinafter referred to as an ingot) 1 that is a workpiece to be cut, as viewed from the cut surface direction.

  As shown in FIG. 1, the three rollers 7, 8, 9 are arranged at a predetermined distance so that the longitudinal axis directions of the rollers 7, 8, 9 coincide with the longitudinal axis direction of the ingot 1. A wire 6 is wound around each of the rollers 7, 8, 9. The wire 6 is fed to the rollers 7, 8 and 9 by the feeding bobbin and wound by the winding bobbin. A wire 6 is wound around each roller 7, 8, 9 at a constant pitch along the longitudinal direction of the roller, and a constant tension is applied to the wire 6 by a tension adjusting mechanism (not shown).

  In the present specification, the pair of rollers 7 and 8 on which the wire 6 against which the ingot 1 is pressed are bridged are referred to as “processing rollers”. The ingot 1 is cut by a wire 6 spanned between the pair of processing rollers 7 and 8. The rollers 9 other than the processing rollers 7 and 8 are referred to as “adjustment rollers”.

  A rotating shaft of a wire driving motor (not shown) is connected to any one of the rollers 7, 8, 9. When the wire driving motor is rotationally driven, for example, the processing roller 7 is rotationally driven, so that the other rollers 8 and 9 are driven to rotate and the wire 6 travels. As the rollers 7, 8 and 9 rotate leftward in the drawing, the wire 6 runs counterclockwise in the drawing. As the wire 6 travels in one direction, the wire 6 is wound up by the winding-side bobbin. When a predetermined amount of the wire 6 wound on the winding side bobbin is fed, the wire driving motor is driven to rotate in the reverse direction, and the winding side bobbin functions as the feeding side bobbin so that the wire 6 runs in the reverse direction. .

  The ingot 1 is bonded to a work plate 2 made of graphite. The work plate 2 is bonded to the set plate 3. When the ingot 1 is bonded to the work plate 2 and the work plate 2 is bonded to the set plate 3, the posture of the ingot 1 is adjusted so that the cutting direction of the ingot 1 coincides with the crystal plane. That is, the direction of the central axis of the ingot 1 is adjusted so that the crystal orientation of the ingot 1 is perpendicular to the cutting direction of the wire 6. The set plate 3 is attached to the lifting base 4. The lifting base 4 is moved up and down in the figure by a lifting motor (not shown).

  Between the pair of processing rollers 7 and 8, the pair of guide bars 41 and 42 are positioned such that their longitudinal axes (axis perpendicular to the paper surface) coincide. The pair of guide bars 41 and 42 are provided at positions where the ingot 1 is sandwiched.

  As shown in FIG. 4A, grooves 43 are formed in the guide bars 41 and 42 at intervals corresponding to the pitch of the wires 6. As shown in FIG. 4B, the width of the groove 43 is slightly larger than the diameter of the wire 6. For example, if the diameter of the wire 6 is 160 μm, the width of the groove 43 is about 200 μm.

  As shown in FIG. 4B, when the wire driving motor is rotationally driven in a state where the wire 6 is positioned in the groove 43 of the pair of guide bars 41 and 42, the wire 6 is guided and moved to the groove 43. The vehicle travels in the left-right direction in FIG. 1 and FIG. At this time, the wire 6 vibrates in the width direction of the groove 43 according to the cutting of the ingot 1, but the deflection of the wire 6 is restricted by the groove 43. That is, the guide bars 41 and 42 have a function of restricting wire shake.

  A slurry supply pipe 5 is disposed between the processing roller 7 and the guide bar 41 and between the processing roller 8 and the guide bar 42 and above the wire 6.

In the slurry supply pipe 5, a supply port 5a is opened below the pipe along the longitudinal direction of the pipe. From the supply port 5a of the slurry supply pipe 5, a slurry made of a mixed liquid of abrasive grains and a dispersant is discharged and dropped according to gravity.

  When the wire 6 is caused to travel by rotating the wire driving motor and the elevating base 4 is lowered in the direction indicated by the arrow H, the ingot 1 is pressed against the traveling wire 6.

  Then, as shown in FIG. 4B, the slurry discharged from the supply port 5a of the slurry supply pipe 5 is a gap 43a between the wire 6 and the groove 43 of the pair of guide bars 41 and 42 (this is the slurry 43a). And supplied to the cutting site of the ingot 1 via the gate). For this reason, the ingot 1 is gradually cut by the lapping action. Since the wires 6 are wound at a predetermined pitch in the longitudinal axis direction of the processing rollers 7 and 8, cutting at a predetermined pitch is performed simultaneously. Thus, a plurality of wafers are generated from the ingot 1.

(Prior art 2)
In FIG. 1 described later, when FIG. 1 is used, the wire 6 between the ingot 1 and the processing roller 7 (or 8) is sandwiched between two upper and lower felts, and the wire 6 is shaken. The invention of preventing is described. Further, in this Patent Document 2, a slurry supply pipe 5 is arranged between two upper and lower felts and an ingot 1 and above a wire 6, and two upper and lower felts and an ingot 1 are arranged from the slurry supply pipe 5. An invention is described in which slurry is supplied to the wire 6 between the two.
Japanese Patent Laid-Open No. 2004-74401 JP 2002-307283 A

  FIGS. 2A and 2B are diagrams for explaining the difference in the number of abrasive grains 30 that enter the cut surface of the wafer 1 a depending on the presence or absence of the guide bars 41 and 42. FIG. 2A is a cross-sectional view schematically showing how the ingot 1 is cut when the guide bars 41 and 42 are not provided, and FIG. 2B shows the case where the guide bars 41 and 42 are provided. It is sectional drawing which shows a mode that the ingot 1 is cut | disconnected typically.

  In general, the slurry is set to a flow rate that should flow through the wire 6 in consideration of cooling of the processing rollers 7 and 8. For this reason, when the guide bars 41 and 42 are not provided (FIG. 2A), the slurry is supplied to the processing rollers 7 and 8 at an appropriate flow rate, while the gap between the wire 6 and the cut surface of the wafer 1a. In this case, the abrasive grains 30 of slurry enter excessively.

  If the guide bars 41 and 42 are not provided, the swing of the wire 6 is not restricted.

  As described above, excessive abrasive grains 30 (slurry) enter between the wire 6 and the wafer cutting surface, and the fluctuation of the wire 6 is not regulated, so that the difference between the thickness of the wafer center and the thickness of the outer periphery of the wafer is reduced. It becomes large and TTV (thickness variation) becomes large. Further, the kerf loss (cutting allowance) increases and the surface roughness also deteriorates.

  On the other hand, when the guide bars 41 and 42 are present (FIG. 2B), the slurry is supplied to the processing rollers 7 and 8 at an appropriate flow rate, while the guide bars 41 and 42 as described above. Is supplied to the cutting portion of the ingot 1 through the gap 43a (slurry gate) of the groove 43 (FIG. 4 (b)), the slurry flow rate is regulated by the gap 43a of the guide bars 41 and 42, and excessive grinding is performed. The grains 30 do not enter between the wire 6 and the wafer cutting surface.

  In addition, the swing of the wire 6 is regulated by the guide bars 41 and 42. As described above, excessive abrasive grains 30 (slurry) do not enter between the wire 6 and the wafer cutting surface, and the fluctuation of the wire 6 is restricted, so that the thickness of the wafer center portion and the thickness of the wafer outer peripheral portion can be reduced. The difference is suppressed to a small value and TTV (thickness variation) is reduced. Further, the kerf loss (cutting allowance) is reduced and the surface roughness is also improved.

  However, since the guide bars 41 and 42 have a function of restricting the supply of slurry to the wafer cutting surface as described above, the abrasive grains 30 do not enter between the wire 6 and the wafer cutting surface. The cutting resistance increased, warp (warp) increased, and the quality of the wafer cut surface deteriorated.

  The warp (warp) increases in proportion to the distance L between the guide rollers, and increases in proportion to the cutting resistance P. The guide bars 41 and 42 substantially reduce the distance between the guide rollers, but the slurry flow rate supplied to the wafer cutting surface is restricted, so that the cutting resistance P increases, which reduces the distance between the guide rollers. As a result, the warp becomes larger than the case where the guide bars 41 and 42 are not provided (FIG. 2A).

  The present invention has been made in view of such a situation, and in a wire saw apparatus, the guide bar allows the guide bar to prevent the wire from swinging, and allows a necessary amount of abrasive grains to enter the wafer cut surface while improving the warp quality. Thus, the problem to be solved is to reduce the warp and improve the quality of the wafer cut surface while maintaining the kerfloss, TTV, and surface roughness at the same level as conventional ones.

  The configuration in which the wire 6 is sandwiched between the two felts in the prior art 2 is essentially different from the “guide bar” of the present invention in that there is no groove for allowing the slurry to pass therethrough. Further, in the prior art 2, the slurry supply pipe 5 is disposed between the two felts and the ingot 1 and above the wire 6, but when such a layout is taken, the slurry supply pipe 5 is provided. It is necessary to increase the distance between the ingot 1 and the two felts only by the field integration. For this reason, the “guide roller distance L” is substantially increased, and the effect of reducing the warp cannot be expected from the related art 2.

The first invention is
A pair of processing rollers around which wires are wound at a predetermined pitch;
Wire driving means for running the wire;
A workpiece relative movement means for cutting the workpiece by relatively moving the workpiece in a direction in which the workpiece is pressed against the wire between the pair of processing rollers;
A groove having a groove depth in the workpiece pressing direction and restricting the movement of the wire in the groove width direction and not in the groove depth direction is formed at intervals corresponding to the wire pitch. A pair of guide bars positioned so that the wire between the processing roller and the workpiece is positioned therein;
It is a wire saw device provided with slurry supply means for supplying slurry to the wire between the guide bar and the workpiece.

The second invention is
A pair of processing rollers around which wires are wound at a predetermined pitch;
Wire driving means for running the wire;
A workpiece relative movement means for cutting the workpiece by relatively moving the workpiece in a direction in which the workpiece is pressed against the wire between the pair of processing rollers;
A pair of guide bars formed such that the grooves are formed at intervals corresponding to the pitch of the wires, and the wire between the processing roller and the workpiece is positioned in the grooves;
First slurry supply means for supplying slurry to the wire between the guide bar and the processing roller;
A wire saw device comprising a second slurry supply means for supplying slurry to the wire between the guide bar and the workpiece.

The third invention is
A pair of processing rollers around which wires are wound at a predetermined pitch;
Wire driving means for running the wire;
A workpiece relative movement means for cutting the workpiece by relatively moving the workpiece in a direction in which the workpiece is pressed against the wire between the pair of processing rollers;
A groove is formed at intervals corresponding to the pitch of the wire, and a pair of guide bars are provided so that the wire between the processing roller and the workpiece is positioned in the groove,
The guide bar is a wire saw device in which a slurry supply path for supplying slurry to the wire between the guide bar and the workpiece is formed.

The fourth invention is
A pair of processing rollers around which wires are wound at a predetermined pitch;
Wire driving means for running the wire;
A workpiece relative movement means for cutting the workpiece by relatively moving the workpiece in a direction in which the workpiece is pressed against the wire between the pair of processing rollers;
A groove is formed at intervals corresponding to the pitch of the wire, and a pair of guide bars are provided so that the wire between the processing roller and the workpiece is positioned in the groove,
The guide bar is provided with a slurry supply path for supplying slurry to the wire between the guide bar and the workpiece.
Further, the present invention is characterized in that the wire saw device is provided with slurry supply means for supplying slurry to the wire between the guide bar and the processing roller and supplying slurry to the slurry supply path of the guide bar.

The fifth invention is the first invention, the second invention or the fourth invention,
The slurry supply means includes a slurry supply pipe disposed between the guide bar and the processing roller and disposed above the wire.

A sixth invention is the third invention,
In the slurry supply path of the guide bar,
Slurry dropped from a slurry supply pipe disposed between the guide bar and the processing roller and disposed above the wire is supplied.

A seventh invention is the fourth invention,
The slurry supply means
A slurry supply pipe disposed between the guide bar and the processing roller and above the wire, and into which slurry is dropped; and
It is characterized by comprising a diversion means for diverting the slurry dropped from the slurry supply pipe and guiding it to the wire between the guide bar and the processing roller and to the slurry supply path of the guide bar.

The eighth invention is the fourth invention or the seventh invention,
A flow rate adjusting means for adjusting the slurry flow rate supplied to the wire between the guide bar and the processing roller and the slurry flow rate guided to the slurry supply path of the guide bar is further provided.

A ninth invention is the first invention to the eighth invention,
When supplying slurry to the wire between the guide bar and the workpiece,
Slurry is supplied to at least the wire corresponding to the longitudinal end of the workpiece.

The tenth invention is the first invention to the ninth invention,
Guide bar moving means for moving the pair of guide bars in the depth direction of the groove is further provided.

The eleventh invention is the first invention to the tenth invention,
Guide bar moving means for moving the distance between the pair of guide bars is further provided.

The twelfth invention
A guide bar used in a wire saw device,
A plurality of grooves spaced according to the wire pitch;
A slurry supply path for supplying the slurry to the wire between the guide bar and the workpiece is formed.

The thirteenth invention
A slurry supply device used in a wire saw device provided with a slurry supply pipe,
A guide bar in which a plurality of grooves with intervals according to the pitch of the wire are formed and a slurry supply path for supplying slurry to the wire between the guide bar and the workpiece is formed,
A slurry introduction plate for diverting the slurry dropped from the slurry supply pipe and guiding it to the wire between the guide bar and the processing roller, and leading to the slurry supply path of the guide bar,
The slurry introduction plate includes a fixing member for fixing the slurry introduction plate to the slurry supply pipe so that the inclination angle thereof can be adjusted.

  According to the present invention, as shown in FIG. 6, between the guide bars 41 and 42 and the ingot 1 by the slurry supply means different from the gap 43a (slurry gate; flow D) of the grooves 43 of the guide bars 41 and 42. Slurry is supplied to the wire 6 (flow B). For this reason, a sufficient amount of abrasive grains 30 to improve the warp quality can enter the cutting portion of the ingot 1. This reduces the cutting resistance and improves the quality of the warp.

  In addition, the swing of the wire 6 is regulated by the guide bars 41 and 42. For this reason, the quality of the same level as the conventional can be maintained also about the quality of TTV, kerf loss (cutting allowance), and surface roughness.

  As described above, according to the present invention, an amount of abrasive grains necessary for improving the warp quality is allowed to enter the wafer cutting surface while preventing the wire swing by the guide bar. While maintaining the same level of surface roughness as before, the warp can be reduced and the quality of the wafer cut surface can be improved.

  The first invention is provided with a slurry supply means (flow B) for supplying slurry to the wire 6 between the guide bars 41, 42 and the ingot 1. In the second invention and the fourth invention, this slurry is provided. In addition to the supply means, slurry supply means (flow C) for supplying slurry to the wire 6 between the guide bars 41 and 42 and the processing rollers 7 and 8 is provided (second invention, fourth invention). For this reason, in addition to the effect of improving the quality of the wafer cut surface, effects such as cooling of the processing rollers 7 and 8 can be obtained at the same time.

  The slurry supply means can be configured to include a slurry supply pipe 5 disposed between the guide bars 41 and 42 and the processing rollers 7 and 8 and disposed above the wire 6 (fifth invention).

  In the third, fourth, twelfth and thirteenth inventions, a slurry supply passage 64 for supplying slurry (flow B) to the wire 6 between the guide bars 41 and 42 and the ingot 1 is provided with a guide bar. 41 and 42 are formed. As a result, the slurry dropped from the slurry supply pipe 5 is removed from the guide bars 41, 42 while the slurry supply pipe 5 remains in the existing arrangement (between the guide bars 41, 42 and the processing rollers 7, 8). The slurry can be supplied between the opposite guide bars 41 and 42 and the ingot 1 via the slurry supply path 64 (flow B). For this reason, it is not necessary to newly provide components necessary for supplying the slurry between the guide bars 41, 42 and the ingot 1, and the distance between the guide bars 41, 42 and the ingot 1 ( "Distance L between guide rollers") can be maintained at a short distance. That is, if the slurry supply pipe 5 is to be disposed between the guide bars 41 and 42 and the ingot 1 (above the wire 6), the ingot 1 and the guide bar 41 are only integrated by the field integration of the slurry supply vip 5. , 42 needs to be increased. For this reason, the “distance L between the guide rollers” is substantially increased, and the effect of reducing the warp cannot be sufficiently obtained. According to the present invention, since the slurry supply path 64 is formed in the guide bars 41 and 42, the slurry supply pipe 5 is located between the existing arrangement (the guide bars 41 and 42 and the processing rollers 7 and 8 and the wire 6 (Upper) and the “distance L between the guide rollers” can be maintained at a short distance.

  In the seventh invention, the slurry dropped from the slurry supply pipe 5 (flow A) is divided and supplied to the wire 6 between the guide bars 41 and 42 and the processing rollers 7 and 8 (flow C). ), Slurry is supplied to the wire 6 between the guide bars 41 and 42 and the ingot 1 via the slurry supply path 64 formed in the guide bars 41 and 42 (flow B).

  In the eighth invention, for example, as shown in FIGS. 7A and 7B, the flow rate ratio of the flow B and the flow C is adjusted by adjusting the inclination angle θ of the slurry introduction plate 60.

  In the ninth invention, as shown in FIG. 12, an outlet side opening 64b 'having a length corresponding to the longitudinal end 1E of the ingot 1 is formed, and only the wire 6 corresponding to the longitudinal end 1E of the ingot 1 is formed. Slurry is supplied.

  The quality of the warp tends to be lower at the end 1E than at the central portion of the ingot 1 in the longitudinal direction. Therefore, if the slurry is supplied to at least the wire 6 corresponding to the longitudinal end portion 1E of the ingot 1 to improve the warp quality of the wafer 1a obtained from the end portion 1E, the wafer cutting surface as the entire ingot 1 is obtained. Improvement of quality is expected.

  In the tenth invention, as shown in FIGS. 13A and 13B, the movement in the depth direction of the groove 43 of the guide bars 41 and 42 is controlled, which is optimal for improving the quality of the cut surface of the wafer 1a. Is adjusted to the correct depth direction position.

  In the eleventh invention, as shown in FIGS. 14A and 14B, the distance between the guide bars 41 and 42 is controlled to be adjusted to an optimum distance for improving the quality of the cut surface of the wafer 1a. .

  As shown in FIGS. 5 and 6, the slurry supply apparatus 10 according to the thirteenth aspect of the present invention forms a slurry supply path 64 in the existing guide bars 41 and 42, and a fixing member 61 in the existing slurry supply pipe 5. The slurry can be constructed only by fixing the slurry introduction plate 60 via the intermediate plate. For this reason, it is only necessary to process the guide bars 41 and 42 of the existing wire saw device (FIG. 1) or to add retrofitted parts (fixing member 61, slurry introduction plate 60), and there is no need for significant modification or modification. . For this reason, in implementing the present invention, the cost of the wire saw device can be kept low.

  Embodiments of a wire saw device, a guide bar for the wire saw device, and a slurry supply device for the wire saw device according to the present invention will be described below with reference to the drawings.

(First embodiment)
FIG. 3 shows the configuration of the wire saw device of the first embodiment. FIG. 3 is a view of the single crystal silicon ingot 1 which is a work to be cut, seen from the cut surface direction. FIG. 4A is a view showing the lower surfaces of guide bars 41 and 42 to be described later when FIG. 3 is viewed from the direction of arrow T1. FIG. 4B is a side view of the guide bar 41 when FIG. 3 is viewed from the direction of the arrow T2.

  As shown in FIG. 3, the three processing rollers 7 and 8 and the adjustment roller 9 are arranged so that the longitudinal axes of the processing rollers 7 and 8 and the adjustment roller 9 coincide with the longitudinal axis of the ingot 1. They are spaced apart by a predetermined distance. A wire 6 is wound around each of the processing rollers 7 and 8 and the adjustment 9. The wire 6 is fed to the rollers 7, 8 and 9 by the feeding bobbin and wound by the winding bobbin. A wire 6 is wound around each of the processing rollers 7 and 8 and the adjustment roller 9 at a constant pitch along the longitudinal direction of the roller, and a constant tension is applied to the wire 6 by a tension adjustment mechanism (not shown).

  The ingot 1 is cut by a wire 6 spanned between the pair of processing rollers 7 and 8.

  A rotating shaft of a wire driving motor (not shown) is connected to any one of the rollers 7, 8, 9. When the wire driving motor is rotationally driven, for example, the processing roller 7 is rotationally driven, so that the other rollers 8 and 9 are driven to rotate and the wire 6 travels. As the rollers 7, 8 and 9 rotate leftward in the drawing, the wire 6 runs counterclockwise in the drawing. As the wire 6 travels in one direction, the wire 6 is wound up by the winding-side bobbin. When a predetermined amount of the wire 6 wound on the winding side bobbin is fed, the wire driving motor is driven to rotate in the reverse direction, and the winding side bobbin functions as the feeding side bobbin so that the wire 6 runs in the reverse direction. .

  The ingot 1 is bonded to a work plate 2 made of graphite. The work plate 2 is bonded to the set plate 3. When the ingot 1 is bonded to the work plate 2 and the work plate 2 is bonded to the set plate 3, the posture of the ingot 1 is adjusted so that the cutting direction of the ingot 1 coincides with the crystal plane. That is, the direction of the central axis of the ingot 1 is adjusted so that the crystal orientation of the ingot 1 is perpendicular to the cutting direction of the wire 6. The set plate 3 is attached to an ingot feed shaft 46 as a lifting base.

  The ingot feed shaft 46 is screwed to the ball screw 45 so as to be movable up and down in the vertical direction P in the drawing. The ingot feed shaft 46 is guided and moved in the vertical direction P by a linear guide 47.

  The ball screw 45 is connected to the rotating shaft of the servo motor 44 for driving the ingot. When the servo motor 44 for driving the ingot is driven, the ball screw 45 is rotated and the ingot feed shaft 46 is guided and moved by the linear guide 47 to move up and down in the vertical direction P in the figure. To do. When the ingot 1 is lowered, the ingot 1 comes into contact with the wire 6 between the pair of processing rollers 7 and 8, and the ingot 1 is cut at a cutting depth corresponding to the lowered position.

  Between the pair of processing rollers 7 and 8, the pair of guide bars 41 and 42 are positioned such that their longitudinal axes (axis perpendicular to the paper surface) coincide. The pair of guide bars 41 and 42 are provided at positions where the ingot 1 is sandwiched.

  As shown in FIG. 4A, grooves 43 are formed in the guide bars 41 and 42 at intervals corresponding to the pitch of the wires 6. As shown in FIG. 4B, the width of the groove 43 is slightly larger than the diameter of the wire 6. For example, if the diameter of the wire 6 is 160 μm, the width of the groove 43 is about 200 μm.

  The pair of guide bars 41, 42 has a groove depth in the pressing direction of the ingot 1, and a groove 43 that restricts the movement of the wire 6 in the groove width direction and does not restrict the movement of the wire 6 in the groove depth direction. The wires 6 are formed at intervals corresponding to the pitch of the wires 6, and are positioned so that the wires 6 between the processing rollers 7, 8 and the ingot 1 are positioned in the grooves 43.

  A slurry supply pipe 5 is disposed between the processing roller 7 and the guide bar 41 and between the processing roller 8 and the guide bar 42 and above the wire 6.

In the slurry supply pipe 5, a supply port 5a is opened below the pipe along the longitudinal direction of the pipe. From the supply port 5a of the slurry supply pipe 5, a slurry made of a mixed liquid of abrasive grains and a dispersant is discharged and dropped according to gravity.

  The guide bar 41 is formed with a slurry supply path 64 for supplying slurry to the wire 6 between the guide bar 41 and the ingot 1. Similarly, a slurry supply path 64 that supplies slurry to the wire 6 between the guide bar 42 and the ingot 1 is formed in the guide bar 42.

  The slurry supply path 64 of the guide bars 41 and 42 is formed so as to communicate the inlet side opening 64a on the side where the slurry supply pipe 5 is disposed and the outlet side opening 64b on the side where the ingot 1 is located. Has been.

  The guide bars 41 and 42 are connected to guide bar vertical drive shafts 57 and 58, respectively. The guide bar vertical drive shafts 57 and 58 are screwed into ball screws 55 and 56 so as to be movable up and down in the vertical direction Q in FIG. The ball screws 55 and 56 are connected to the rotation shafts of the guide bar vertical drive servomotors 53 and 54, respectively. When the guide bar vertical drive servomotor 53 is driven, the ball screw 55 rotates and the guide bar vertical drive shaft 57 moves up and down in the vertical direction Q in the drawing, and the guide bar 41 moves up and down in the vertical direction P accordingly. When the guide bar 41 is lowered, the wire 6 between the processing roller 7 and the ingot 1 is positioned in the groove 43 of the guide bar 41.

  Similarly, when the guide bar up-and-down drive servomotor 54 is driven, the ball screw 56 rotates and the guide bar up-and-down drive shaft 58 moves up and down in the up-and-down direction Q in the figure. Go up and down. When the guide bar 42 is lowered, the wire 6 between the processing roller 8 and the ingot 1 is positioned in the groove 43 of the guide bar 42. As described above, the pair of guide bars 41 and 42 move in the depth direction of the groove 43 (downward in the drawing), and the wire 6 is positioned in the groove 43.

  As shown in FIG. 4B, when the wire driving motor is rotationally driven in a state where the wire 6 is positioned in the groove 43 of the pair of guide bars 41 and 42, the wire 6 is guided and moved to the groove 43. Travel in the left-right direction in the figure indicated by the arrow V. At this time, the wire 6 vibrates in the width direction of the groove 43 according to the cutting of the ingot 1, but the deflection of the wire 6 is restricted by the groove 43. On the other hand, the movement of the wire 6 in the depth direction of the groove 43 is not restricted. That is, the guide bars 41 and 42 have a function of restricting wire runout in a direction perpendicular to the cut surface of the wafer 1a but not restricting movement of the wire in a direction parallel to the cut surface of the wafer 1a. As a result, no tension other than the constant tension applied by the tension adjusting mechanism described above is not applied to the wire 6.

  Each of the guide bar drive servomotors 53 and 54 is provided with a load detector (not shown) that detects a load applied to the wire 6 by the guide bars 41 and 42 by detecting a drive current. In addition, a controller is provided that drives and controls the guide bar up-and-down drive servo motors 53 and 54 when the wire load detected by the load detector exceeds a predetermined value, so that the wire load is reduced to a predetermined value or less.

  The pair of guide bars 41, 42 move through the guide bar horizontal drive shaft 48 in the outer side direction (the direction away from the ingot 1) or the inner side direction (the direction toward the ingot 1) indicated by arrows S 1, S 2. The guide bar horizontal drive shaft 48 is provided integrally with the ingot feed shaft 46 described above.

  A drive shaft of a servo motor for driving a guide bar (not shown) is connected to the pinion gear 49. The pinion gear 49 meshes with the rack 50 and the rack 51. The rack 50 is connected to a base member 52 that fixes a guide bar vertical drive servomotor 53. The rack 51 is connected to a base member 53 that fixes a guide bar driving servomotor 54.

  Therefore, when the guide bar horizontal drive servo motor is driven, the pinion gear 49 rotates clockwise or counterclockwise on the paper surface, and the rack 50 and the rack 51 are in the S1 direction (outward direction in the figure) or S2 direction. Move (inward direction in the figure). When the racks 50 and 51 are moved in the S1 direction, the base members 52 and 53 are moved in the S1 direction, and accordingly, the pair of guide bars 41 and 42 are moved in the outer direction S1 away from the ingot 1. Further, when the racks 50 and 51 are moved in the S2 direction, the base members 52 and 53 are moved in the S2 direction, and accordingly, the pair of guide bars 41 and 42 are moved in the inner direction S2 toward the ingot 1.

  As described above, the distance between the pair of guide bars 41 and 42 can be changed, and the play of the wire 6 (distance between the guide bars 41 and 42 and the wire 6) can be adjusted.

  Since the guide bar horizontal drive shaft 48 is provided integrally with the ingot feed shaft 46, the pair of guide bars 41, 42 can be moved together with the ingot 1 when the ingot feed shaft 46 moves in the vertical direction. By moving the guide bar vertical drive shafts 57 and 58 in the vertical direction, the guide bars 41 and 42 can be moved independently of the ingot 1.

  The material of the pair of guide bars 41 and 42 is desirably a material that is the same as the ingot 1 in terms of workability and thermal expansion coefficient. For example, if the ingot 1 is a silicon ingot, it is desirable that the guide bars 41 and 42 be made of silicon.

  Further, the grooves 43 of the guide bars 41 and 42 are preferably formed by cutting in advance to a predetermined depth using the wire 6 of the same wire saw device before cutting the ingot 1. If the groove 43 is formed by the same wire saw device used for cutting the ingot 1, the machine difference of the wire saw device can be canceled and the processing accuracy is improved.

  Here, if the material of the guide bars 41, 42 is the same material (silicon) as that of the ingot 1, the groove 43 can be formed with good workability by the wire 6.

  Further, if the material of the guide bars 41 and 42 is the same material (silicon) as the ingot 1, the cutting portion of the ingot 1 by the wire 6 is thermally expanded at the same thermal expansion coefficient as the grooves of the guide bars 41 and 42 during the cutting process. Cutting quality is reduced and cutting accuracy is improved.

  The cross-sectional shape of the guide bars 41 and 42 is desirably a shape in which the length of the groove 43 that regulates the wire 6 varies according to the relative vertical position of the guide bars 41 and 42 with respect to the wire 6.

  The cross-sectional shape of the guide bars 41 and 42 may be a circle or an ellipse, or may be a wedge shape as shown in FIG.

  FIG. 3 shows guide bars 41 and 42 formed in a shape that inclines toward the ingot 1 as the ridge line on the slurry supply pipe 5 side of the ridge line of the cross section of the guide bar goes downward.

  Next, the configuration of the slurry supply device 10 used in the wire saw device of FIG. 3 will be described with reference to the assembly diagram of FIG. Since the slurry supply apparatus 10 has the same configuration on the left and right in FIG. 3, the slurry supply apparatus 10 including the guide bar 42 on the right side in the figure will be described as a representative.

  As shown in FIG. 5, the slurry supply device 10 is provided with a plurality of grooves 43 with intervals corresponding to the pitch of the wires 6 and supplies the slurry to the wires 6 between the guide bar 42 and the ingot 1. The guide bar 42 in which the slurry supply path 64 is formed and the slurry dropped from the slurry supply pipe 5 are diverted and guided to the wire 6 between the guide bar 42 and the processing roller 8, and the guide bar 42 The slurry introduction plate 60 for guiding to the slurry supply path 64 and a fixing member 61 for fixing the slurry introduction plate 60 to the slurry supply pipe 5 so that the inclination angle thereof can be adjusted.

  The fixing member 61 includes block-shaped fixing members 61a and 61b divided into two parts. The fixing members 61 a and 61 b have a semicircular inner circumferential surface 61 d corresponding to the outer diameter of the slurry supply pipe 5.

  The fixing members 61 a and 61 b are positioned so that the inner peripheral surface 61 d abuts on the outer peripheral surface of the slurry supply pipe 5, and the fixing members 61 a and 61 b are fastened to each other by the bolts 62. When the fixing members 61 a and 61 b are fastened by the bolt 62, the fixing member 61 is pressed against the outer periphery of the slurry supply pipe 5 and fixed to the slurry supply pipe 5.

  The fixing members 61 are fixed to both ends of the slurry supply pipe 5 by being separated by a distance corresponding to the length of the slurry introduction plate 60.

  The slurry introduction plate 60 can receive the slurry dropped from the supply port 5 a of the slurry supply pipe 5, and has a length and width that can be inserted into the slurry supply path 64 (inlet side opening 64 a) of the guide bar 42. Is formed.

  The slurry introduction plate 60 is formed with a screw hole 60a for fastening and fixing the slurry introduction plate 60 to the fixing member 61b. The fixing member 61b has a screw hole 61c for fastening and fixing the slurry introduction plate 60 to the fixing member 61b.

  The slurry introduction plate 60 is inserted into the slurry supply path 64 (inlet side opening 64a) of the guide bar 42, and is positioned so that the screw hole 60a of the slurry introduction plate 60 and the screw hole 61c of the fixing member 61b are coaxial. The At the time of this positioning, the slurry introduction plate 60 is adjusted so that the inclination angle θ becomes a desired angle. The bolt 63 is screwed into the screw hole 61c through the screw hole 60a in a state where the slurry introduction plate 60 is held at a desired inclination angle. As a result, the slurry introduction plate 60 is fastened and fixed to the fixing member 61b.

  The slurry supply apparatus 10 is configured as described above. Although the slurry supply device 10 including one guide bar 42 has been described with reference to FIG. 5, the slurry supply device 10 including the other guide bar 41 is configured in the same manner.

  FIG. 6 is a diagram for explaining the operation of the slurry supply apparatus 10.

  Next, the operation of the wire saw device and the operation of the slurry supply device 10 will be described with reference to FIGS. 3 and 4 together with FIG. In the following description, the slurry supply apparatus 10 has the same configuration on the left and right in FIG. 3, and therefore, the slurry supply apparatus 10 including the right guide bar 42 in the figure will be described as a representative.

  When the wire driving motor is rotated to drive the wire 6 and the ingot feed shaft 46 is lowered, the ingot 1 is pressed against the traveling wire 6.

  Further, slurry is supplied into the slurry supply pipe 5 from a slurry supply source (not shown).

  For this reason, the slurry is dripped onto the slurry introduction plate 60 as indicated by the arrow A from the supply port 5 a of the slurry supply pipe 5. The slurry is adjusted to a flow rate ratio corresponding to the inclination angle θ of the slurry introduction plate 60 and is divided into a flow B toward the inlet side opening 64a of the guide bar 42 and a flow C toward the processing roller 8 side.

  As shown by an arrow B, the slurry is introduced into the inlet side opening 64a of the guide bar 42 by flowing on the slurry introduction plate 60 toward the inlet side opening 64a of the guide bar 42, and passes through the slurry supply path 64. Then, it is discharged from the outlet side opening 64 b of the guide bar 42, is dropped on the wire 6 between the guide bar 42 and the ingot 1 through the wall surface of the guide bar 42.

  On the other hand, the slurry is dropped onto the wire 6 between the guide bar 42 and the processing roller 8 by flowing on the slurry introducing plate 60 toward the processing roller 8 as indicated by an arrow C. For this reason, the processing roller 8 is cooled by the slurry. Further, the slurry dropped on the wire 6 between the guide bar 42 and the processing roller 8 passes through a gap 43a (slurry gate) of the groove 43 of the guide bar 42 as shown in FIG. A flow D toward the ingot 1 is formed.

  In FIG. 6, the slurry supply apparatus 10 including one guide bar 42 has been described, but the slurry supply apparatus 10 including the other guide bar 41 operates in the same manner.

  As described above, according to the wire saw device and the slurry supply device 10 of this embodiment, in addition to the slurry flow D passing through the groove 43, the slurry flow B passing through the slurry supply path 64 is formed. For this reason, slurry having a larger flow rate is supplied to the cutting portion of the ingot 1 than in the case of only the slurry flow D passing through the groove 43. Thereby, more abrasive grains 30 can be inserted between the cut surface of the wafer 1a and the wire 6 than in the case of the prior art 1 (FIG. 2B).

  The slurry is supplied to the cutting site of the ingot 1, and the ingot 1 is gradually cut by the lapping action. Since the wires 6 are wound at a predetermined pitch in the longitudinal axis direction of the processing rollers 7 and 8, cutting at a predetermined pitch is performed simultaneously. Thus, a plurality of wafers 1a are generated from the ingot 1.

  7A and 7B show the slurry flow rate of the flow B toward the inlet side opening 64a of the guide bars 41 and 42 and the processing rollers 7 and 8 by adjusting the inclination angle θ of the slurry introduction plate 60. FIG. It is a figure explaining a mode that the ratio with the slurry flow volume of the flow C which goes to the side is adjusted.

  As shown in FIG. 7A, if the slurry introduction plate 60 is adjusted to be substantially horizontal, the slurry flow rate of the flow B toward the inlet side opening 64a of the guide bars 41, 42 and the processing rollers 7, 8 are adjusted. The ratio of the flow C toward the side with the slurry flow rate can be adjusted to a ratio of approximately 50% to 50%.

  As shown in FIG. 7B, if the slurry introduction plate 60 is inclined so that the processing rollers 7 and 8 side is positioned downward and the inlet side opening 64a side of the guide bars 41 and 42 is positioned upward, the guide bar The ratio of the slurry flow rate of the flow B toward the inlet side opening 64a of 41, 42 is adjusted to be smaller than the slurry flow rate of the flow C toward the processing rollers 7, 8 side, for example, a ratio of 10% to 90%. be able to.

  As described above, according to the present embodiment, the gap between the guide bars 41 and 42 and the ingot 1 is different from the gap 43a (slurry gate; flow D) of the grooves 43 of the guide bars 41 and 42 by the slurry supply means. Slurry is supplied to the wire 6 (flow B). For this reason, a sufficient amount of abrasive grains 30 to improve the warp quality can enter the cutting portion of the ingot 1. This reduces the cutting resistance and improves the quality of the warp.

  In addition, the swing of the wire 6 is regulated by the guide bars 41 and 42. For this reason, the quality of the same level as the conventional can be maintained also about the quality of TTV, kerf loss (cutting allowance), and surface roughness.

  Further, in this embodiment, the slurry 6 dropped from the slurry supply pipe 5 is passed through the slurry supply path 64 formed in the guide bars 41 and 42, and the wire 6 between the guide bars 41 and 42 and the ingot 1. (Flow B). As a result, the slurry dropped from the slurry supply pipe 5 is removed from the guide bars 41, 42 while the slurry supply pipe 5 remains in the existing arrangement (between the guide bars 41, 42 and the processing rollers 7, 8). The slurry can be supplied between the opposite guide bars 41 and 42 and the ingot 1 via the slurry supply path 64 (flow B). For this reason, it is not necessary to newly provide components necessary for supplying the slurry between the guide bars 41, 42 and the ingot 1, and the distance between the guide bars 41, 42 and the ingot 1 ( "Distance L between guide rollers") can be maintained at a short distance. That is, if the slurry supply pipe 5 is to be disposed between the guide bars 41 and 42 and the ingot 1 (above the wire 6), the ingot 1 and the guide bar 41 are only integrated by the field integration of the slurry supply vip 5. , 42 needs to be increased. For this reason, the “distance L between the guide rollers” is substantially increased, and the effect of reducing the warp cannot be sufficiently obtained. According to the present embodiment, since the slurry supply path 64 is formed in the guide bars 41 and 42, the slurry supply pipe 5 is located between the existing arrangement (the guide bars 41 and 42 and the processing rollers 7 and 8 and the wire 6 The “distance L between the guide rollers” can be maintained at a short distance.

  As described above, according to this embodiment, the guide bar prevents the wire from swinging and allows the amount of abrasive grains necessary to improve the warp quality to enter the wafer cutting surface. In addition, while maintaining the surface roughness at the same level as the conventional quality, the warp can be reduced and the quality of the wafer cut surface can be improved.

  Further, as shown in FIGS. 5 and 6, the slurry supply apparatus 10 of the present embodiment forms a slurry supply path 64 in the existing guide bars 41 and 42, and a fixing member is provided in the existing slurry supply pipe 5. The slurry can be constructed simply by fixing the slurry introduction plate 60 via 61. For this reason, it is only necessary to process the guide bars 41 and 42 of the existing wire saw device (FIG. 1) or to add retrofitted parts (fixing member 61, slurry introduction plate 60), and there is no need for significant modification or modification. . For this reason, in implementing the present invention, the cost of the wire saw device can be kept low.

(Second embodiment)
Various modifications can be made to the first embodiment described above. Each example will be described below.

  In the first embodiment, the slurry dropped from the slurry supply pipe 5 (flow A) is divided to supply slurry to the wire 6 between the guide bars 41 and 42 and the processing rollers 7 and 8 (flow C). ), Slurry is supplied to the wire 6 between the guide bars 41, 42 and the ingot 1 (flow B). As shown in FIG. 8A, a weir 60b is provided on the slurry introduction plate 60. Without shunting, for example, by blocking the slurry flow C toward the processing rollers 7 and 8, or by providing an introduction passage 60 'for guiding the slurry only to the slurry supply passage 64 as shown in FIG. 8B. It is also possible to supply the slurry only to the wire 6 between the guide bars 41, 42 and the ingot 1 (only the flow B). In this case, if a slurry supply pipe 5 ′ is provided separately from the slurry supply pipe 5, the slurry is supplied independently to the wire 6 between the guide bars 41 and 42 and the processing rollers 7 and 8. The processing rollers 7 and 8 can be cooled.

(Third embodiment)
In the first embodiment, the slurry supply path 64 is formed inside the guide bars 41 and 42. As the slurry supply path 64, the slurry is supplied to the wire 6 between the guide bars 41 and 42 and the ingot 1. As long as it can be performed, it may be provided outside the guide bars 41 and 42. For example, as shown in FIG. 9, the slurry supply pipe 5 is disposed above the guide bars 41 and 42, and the slurry dropped from the slurry supply pipe 5 is guided through the wall surfaces of the guide bars 41 and 42. You may supply to the wire 6 between 41 and 42 and the ingot 1. FIG.

(Fourth embodiment)
In the first embodiment, the slurry supply pipe 5 is disposed outside the guide bars 41 and 42. However, as shown in FIGS. 10A and 10B, the slurry supply pipe 5 is replaced with the guide bar. It is also possible to incorporate it in 41 and 42.

  In the case of the configuration shown in FIG. 10A, the slurry dropped from the built-in slurry supply pipe 5 passes through the slurry supply path 64 and is applied to the wire 6 between the guide bars 41 and 42 and the ingot 1. Supplied. In this case, if a slurry supply pipe 5 ′ is provided separately from the built-in slurry supply pipe 5, the slurry is independently applied to the wire 6 between the guide bars 41 and 42 and the processing rollers 7 and 8. By supplying, the processing rollers 7 and 8 can be cooled.

  In the case of the configuration of FIG. 10B, the slurry dropped from the built-in slurry supply pipe 5 is divided into the slurry supply path 64 and the slurry supply path 65. The slurry passes through the slurry supply path 64 and is supplied to the wire 6 between the guide bars 41 and 42 and the ingot 1. Further, the slurry passes through the slurry supply path 65 and is supplied to the wire 6 between the guide bars 41 and 42 and the processing rollers 7 and 8.

  The slurry supply pipe 5 communicates with a slurry supply source 68 through a supply path 67. On the supply path 67, a flow rate adjusting valve 69 is provided. By adjusting the flow rate adjusting valve 69, the flow rate of the slurry dropped from the slurry supply pipe 5 is adjusted, and the wire 6 between the guide bars 41, 42 and the processing rollers 7, 8 and the guide bars 41, 42 The flow rate of the slurry supplied to the wire 6 between the ingot 1 and the ingot 1 is adjusted.

(5th Example)
In the first embodiment, the slurry introduction plate 60 performs the diversion from the flow A to the flow B and the flow C, and the flow rate (ratio) adjustment of the flow B and the flow C. It is also possible to have a component other than the introduction plate 60.

  That is, as in FIG. 10, as shown in FIG. 11, the slurry supply pipe 5 communicates with a slurry supply source 68 through a supply path 67, and a flow rate adjusting valve 69 is provided on the supply path 67. Is provided. By adjusting the flow rate adjusting valve 69, the flow rate (original flow rate) of the slurry dropped from the slurry supply pipe 5 is adjusted in the range of 0 to 100%.

  On the other hand, the flow rate ratio of the flow B and the flow C is adjusted by adjusting the inclination angle θ of the slurry introduction plate 60 as in FIG. For example, if the slurry introduction plate 60 is adjusted to be approximately horizontal, the slurry flow rate of the flow B toward the inlet side opening 64a of the guide bars 41 and 42 and the processing rollers 7 and 8 when the original flow rate is 100%. The ratio of the flow C toward the slurry to the slurry flow rate can be adjusted to a ratio of 50% of the original flow rate to 50% of the original flow rate.

  Here, if the flow rate adjusting valve 69 is adjusted to change the slurry original flow rate dropped from the slurry supply pipe 5 from 100% to 40%, the flow toward the inlet side opening 64a of the guide bars 41, 42 The slurry flow rate of B is reduced from 50% of the original flow rate to 20% of the original flow rate.

  As described above, the inclination angle θ of the slurry introduction plate 60 is provided with an independent flow rate adjustment function, so that the flow rate of the flow B can be finely adjusted without adjusting the inclination angle θ of the slurry introduction plate 60. Is possible.

(Sixth embodiment)
In the first embodiment, as shown in FIG. 6, when slurry is supplied to the wire 6 between the guide bars 41, 42 and the ingot 1, the outlet side opening 64 b having a length corresponding to the entire longitudinal direction of the ingot 1. Is formed so that slurry is supplied to the wire 6 in the entire longitudinal direction of the ingot 1. As shown in FIG. 12, the outlet side of the length corresponding to the longitudinal end 1 </ b> E of the ingot 1 is provided. It is also possible to form the opening 64 b ′ and supply the slurry only to the wire 6 corresponding to the longitudinal end 1 </ b> E of the ingot 1.

  The quality of the warp tends to be lower at the end 1E than at the central portion of the ingot 1 in the longitudinal direction. Therefore, if the slurry is supplied to at least the wire 6 corresponding to the longitudinal end portion 1E of the ingot 1 to improve the warp quality of the wafer 1a obtained from the end portion 1E, the wafer cutting surface as the entire ingot 1 is obtained. Improvement of quality is expected.

(Seventh embodiment)
As shown in FIGS. 13A and 13B, the position in the depth direction optimum for improving the quality of the cut surface of the wafer 1a by controlling the movement of the grooves 43 of the guide bars 41 and 42 in the depth direction. You may adjust it.

  As shown in FIGS. 13A and 13B, when the position of the guide bars 41 and 42 in the groove depth direction, that is, the vertical position is adjusted, the length l that the groove 43 regulates the wire 6 changes. The distance m from the outlet side opening 64b of the guide bars 41 and 42 to the wire 6 changes.

  Here, the distance m defines the amount of slurry that can reach the ingot 1 out of the amount of slurry discharged from the outlet side openings 64b of the guide bars 41 and 42. If the distance m is large, the amount of slurry that can reach the ingot 1 decreases, and if the play of the wire 6 is small, the amount of slurry that can reach the ingot 1 increases.

  Therefore, the position of the guide bar 41, 42 in the depth direction of the groove 43 is adjusted, and the wire regulation length l and the distance m are adjusted to a size suitable for improving the quality of the wafer cut surface.

(Eighth embodiment)
As shown in FIGS. 14A and 14B, the distance between the guide bars 41 and 42 may be controlled to be adjusted to an optimum distance for improving the quality of the cut surface of the wafer 1a.

  14A and 14B show a case where the distance between the pair of guide bars 41 and 42 is changed in accordance with the cutting depth of the ingot 1. FIG. 14A shows the positional relationship between the ingot 1 and the pair of guide bars 41 and 42 in the initial stage of cutting, and FIG. 14B shows the positional relationship between the ingot 1 and the pair of guide bars 41 and 42 in the middle stage of cutting. Show.

  As the cutting of the ingot 1 proceeds and the ingot 1 descends in the direction indicated by the arrow H, the distance between the pair of guide bars 41 and 42 increases, and the play of the wire 6 is constant regardless of the cutting depth of the ingot 1. Retained. Adjustment of the distance between the pair of guide bars 41 and 42 is performed by driving and controlling the above-described guide bar horizontal drive servomotor.

  Here, the size of the play of the wire 6 corresponds to the distance from the outlet side opening 64 b of the guide bars 41 and 42 to the ingot 1. This distance defines the amount of slurry that can reach the ingot 1 among the amount of slurry discharged from the outlet side openings 64b of the guide bars 41 and 42. If the play of the wire 6 is large, the amount of slurry that can reach the ingot 1 decreases, and if the play of the wire 6 is small, the amount of slurry that can reach the ingot 1 increases.

  Therefore, the distance between the pair of guide bars 41 and 42 is controlled, and the play of the wire 6 is adjusted to a size suitable for improving the quality of the wafer cut surface.

  In the above description, it is assumed that the single crystal silicon ingot 1 is cut. However, the present invention can be applied to a case where an arbitrary workpiece such as a magnetic material or ceramic is cut into slices.

FIG. 1 is a diagram illustrating the configuration of a conventional wire saw device. FIGS. 2A and 2B are diagrams for explaining the difference in the number of abrasive grains entering the wafer cutting surface depending on the presence or absence of a guide bar. FIG. 3 is a diagram showing the configuration of the wire saw device of the first embodiment. 4A and 4B are a bottom view and a side view of the guide bar. FIG. 5 is an assembly view of a slurry supply device used in the wire saw device. FIG. 6 is a perspective view for explaining the operation of the slurry supply device used in the wire saw device. FIGS. 7A and 7B are views for explaining adjustment of the inclination angle of the slurry introduction plate. FIGS. 8A and 8B are views for explaining the second embodiment. FIG. 9 is a diagram for explaining the third embodiment. FIGS. 10A and 10B are diagrams for explaining the fourth embodiment. FIG. 11 is a diagram for explaining the fifth embodiment. FIG. 12 is a diagram for explaining the sixth embodiment. FIGS. 13A and 13B are diagrams for explaining the seventh embodiment. FIGS. 14A and 14B are views for explaining an eighth embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Ingot (workpiece) 5 Slurry supply pipe 6 Wire 7, 8 Processing roller 10 Slurry supply device 41, 42 Guide bar 60 Slurry introduction plate 61 Fixing member 64 Slurry supply path

Claims (13)

A pair of processing rollers around which wires are wound at a predetermined pitch;
Wire driving means for running the wire;
A workpiece relative movement means for cutting the workpiece by relatively moving the workpiece in a direction in which the workpiece is pressed against the wire between the pair of processing rollers;
A groove having a groove depth in the workpiece pressing direction and restricting the movement of the wire in the groove width direction and not in the groove depth direction is formed at intervals corresponding to the wire pitch. A pair of guide bars positioned so that the wire between the processing roller and the workpiece is positioned therein;
A wire saw device comprising: a slurry supply means for supplying slurry to the wire between the guide bar and the workpiece. A pair of processing rollers around which wires are wound at a predetermined pitch;
Wire driving means for running the wire;
A workpiece relative movement means for cutting the workpiece by relatively moving the workpiece in a direction in which the workpiece is pressed against the wire between the pair of processing rollers;
A pair of guide bars formed such that the grooves are formed at intervals corresponding to the pitch of the wires, and the wire between the processing roller and the workpiece is positioned in the grooves;
First slurry supply means for supplying slurry to the wire between the guide bar and the processing roller;
And a second slurry supply means for supplying slurry to the wire between the guide bar and the workpiece. A pair of processing rollers around which wires are wound at a predetermined pitch;
Wire driving means for running the wire;
A workpiece relative movement means for cutting the workpiece by relatively moving the workpiece in a direction in which the workpiece is pressed against the wire between the pair of processing rollers;
A groove is formed at intervals corresponding to the pitch of the wire, and a pair of guide bars are provided so that the wire between the processing roller and the workpiece is positioned in the groove,
A wire saw device characterized in that a slurry supply path for supplying slurry to a wire between the guide bar and the workpiece is formed in the guide bar. A pair of processing rollers around which wires are wound at a predetermined pitch;
Wire driving means for running the wire;
A workpiece relative movement means for cutting the workpiece by relatively moving the workpiece in a direction in which the workpiece is pressed against the wire between the pair of processing rollers;
A groove is formed at intervals corresponding to the pitch of the wire, and a pair of guide bars are provided so that the wire between the processing roller and the workpiece is positioned in the groove,
The guide bar is provided with a slurry supply path for supplying slurry to the wire between the guide bar and the workpiece.
The wire saw device further comprises slurry supply means for supplying slurry to the wire between the guide bar and the processing roller and supplying the slurry to the slurry supply path of the guide bar. The wire saw device according to claim 1, 2, or 4, wherein the slurry supply means includes a slurry supply pipe disposed between the guide bar and the processing roller and disposed above the wire. In the slurry supply path of the guide bar,
The wire saw device according to claim 3, wherein a slurry dropped from a slurry supply pipe disposed between the guide bar and the processing roller and disposed above the wire is supplied. The slurry supply means
A slurry supply pipe disposed between the guide bar and the processing roller and above the wire, and into which slurry is dropped; and
5. A wire saw according to claim 4, further comprising: a diverter for diverting the slurry dropped from the slurry supply pipe to guide the wire between the guide bar and the processing roller and the slurry supply path of the guide bar. apparatus. The flow rate adjusting means for adjusting the slurry flow rate supplied to the wire between the guide bar and the processing roller and the slurry flow rate guided to the slurry supply path of the guide bar is further provided. Or the wire saw apparatus of 7. When supplying slurry to the wire between the guide bar and the workpiece,
The wire saw device according to claim 1, wherein slurry is supplied to at least a wire corresponding to an end portion in a longitudinal direction of the workpiece. The wire saw device according to any one of claims 1 to 9, further comprising guide bar moving means for moving the pair of guide bars in the depth direction of the groove. The wire saw device according to claim 1, further comprising guide bar moving means for moving a distance between the pair of guide bars. A guide bar used in a wire saw device,
A plurality of grooves spaced according to the wire pitch;
A guide bar for a wire saw device, characterized in that a slurry supply path for supplying the slurry to the wire between the guide bar and the workpiece is formed. A slurry supply device used in a wire saw device provided with a slurry supply pipe,
A guide bar in which a plurality of grooves with intervals according to the pitch of the wire are formed and a slurry supply path for supplying slurry to the wire between the guide bar and the workpiece is formed,
A slurry introduction plate for diverting the slurry dropped from the slurry supply pipe, leading to the wire between the guide bar and the processing roller, and leading to the slurry supply path of the guide bar,
A slurry supply device for a wire saw device, comprising: a fixing member for fixing the slurry introduction plate to the slurry supply pipe so that the inclination angle thereof can be adjusted.

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