JPH0366106B2 - - Google Patents

Info

Publication number
JPH0366106B2
JPH0366106B2 JP24424384A JP24424384A JPH0366106B2 JP H0366106 B2 JPH0366106 B2 JP H0366106B2 JP 24424384 A JP24424384 A JP 24424384A JP 24424384 A JP24424384 A JP 24424384A JP H0366106 B2 JPH0366106 B2 JP H0366106B2
Authority
JP
Japan
Prior art keywords
wire
cut
cutting
workpiece
machining fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP24424384A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61121870A (ja
Inventor
Atsushi Tomizawa
Mitsuo Mitani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP24424384A priority Critical patent/JPS61121870A/ja
Publication of JPS61121870A publication Critical patent/JPS61121870A/ja
Publication of JPH0366106B2 publication Critical patent/JPH0366106B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP24424384A 1984-11-19 1984-11-19 脆性材料の切断方法 Granted JPS61121870A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24424384A JPS61121870A (ja) 1984-11-19 1984-11-19 脆性材料の切断方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24424384A JPS61121870A (ja) 1984-11-19 1984-11-19 脆性材料の切断方法

Publications (2)

Publication Number Publication Date
JPS61121870A JPS61121870A (ja) 1986-06-09
JPH0366106B2 true JPH0366106B2 (enrdf_load_stackoverflow) 1991-10-16

Family

ID=17115861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24424384A Granted JPS61121870A (ja) 1984-11-19 1984-11-19 脆性材料の切断方法

Country Status (1)

Country Link
JP (1) JPS61121870A (enrdf_load_stackoverflow)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH678298A5 (en) * 1988-05-09 1991-08-30 Charles Hauser Slicer for materials used in electronic components
JP4083152B2 (ja) * 2004-07-29 2008-04-30 日本碍子株式会社 ワイヤーソー装置
JP2007021676A (ja) * 2005-07-19 2007-02-01 Asahi Diamond Industrial Co Ltd ノズル装置、ワイヤ加工装置、及びワイヤ加工方法
JP5561194B2 (ja) * 2011-02-04 2014-07-30 株式会社デンソー ワイヤーソー装置
JP6159088B2 (ja) * 2013-01-10 2017-07-05 トーヨーエイテック株式会社 ワイヤソー
CN104029298B (zh) * 2014-05-08 2015-12-02 沈棋 一种多形状手动瓷砖切割机
JP6589744B2 (ja) * 2016-06-07 2019-10-16 株式会社Sumco ワークの切断方法

Also Published As

Publication number Publication date
JPS61121870A (ja) 1986-06-09

Similar Documents

Publication Publication Date Title
JP2673544B2 (ja) 脆性材料の切断方法
US3831576A (en) Machine and method for cutting brittle materials using a reciprocating cutting wire
CN101200102B (zh) 用于从工件中切出多个晶片的方法
TW201228791A (en) Method for cooling a workpiece made of semiconductor material during wire sawing
JPH0366106B2 (enrdf_load_stackoverflow)
JPH10217095A (ja) ワイヤーソーによるワークの切断方法およびワイヤーソー
JP2000288902A (ja) 固定砥粒付ワイヤ及び固定砥粒ワイヤソー
JP2000218504A (ja) 固定砥粒付ワイヤ及び固定砥粒ワイヤソーの切断方法
KR20170049411A (ko) 고정 연마입자 와이어소우 및 고정 연마입자 와이어의 드레싱 방법
JP6719637B2 (ja) ワイヤソーによる溝加工装置とその方法
JP2013539231A (ja) 単結晶インゴット切断装置
JP2003165046A (ja) ワイヤソー及び切断方法
JPH0520227B2 (enrdf_load_stackoverflow)
JPH1128654A (ja) 固定砥粒ワイヤソーのドレッシング方法及び装置
JP2000296455A (ja) 固定砥粒マルチワイヤソー
JP2000153517A (ja) ワイヤソー
JP6395497B2 (ja) ウェーハの製造方法
JPH09300343A (ja) マルチワイヤソーによる切断方法
JP2674207B2 (ja) 脆性材料の切断加工方法
KR101275923B1 (ko) 단결정 잉곳 절단장치
JPH07205141A (ja) ワイヤーソーのウェーハ切断方法及びその装置
JP2001334452A (ja) 円柱状ワークの切断方法
JPH02274460A (ja) ワイヤ式切断装置の切断速度制御方法およびその装置
JP4302979B2 (ja) 材料の分割のための装置および方法
JPH1177510A (ja) 固定砥粒ワイヤソー及びその被加工物切断方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees