JPS61119052A - 非貴金属ワイヤボンデイング方法 - Google Patents

非貴金属ワイヤボンデイング方法

Info

Publication number
JPS61119052A
JPS61119052A JP59239487A JP23948784A JPS61119052A JP S61119052 A JPS61119052 A JP S61119052A JP 59239487 A JP59239487 A JP 59239487A JP 23948784 A JP23948784 A JP 23948784A JP S61119052 A JPS61119052 A JP S61119052A
Authority
JP
Japan
Prior art keywords
bonding
wire
metal wire
capillary
noble metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59239487A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0530059B2 (cg-RX-API-DMAC10.html
Inventor
Koichiro Atsumi
幸一郎 渥美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59239487A priority Critical patent/JPS61119052A/ja
Publication of JPS61119052A publication Critical patent/JPS61119052A/ja
Publication of JPH0530059B2 publication Critical patent/JPH0530059B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/015—
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07541—
    • H10W72/50—

Landscapes

  • Wire Bonding (AREA)
JP59239487A 1984-11-15 1984-11-15 非貴金属ワイヤボンデイング方法 Granted JPS61119052A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59239487A JPS61119052A (ja) 1984-11-15 1984-11-15 非貴金属ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59239487A JPS61119052A (ja) 1984-11-15 1984-11-15 非貴金属ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS61119052A true JPS61119052A (ja) 1986-06-06
JPH0530059B2 JPH0530059B2 (cg-RX-API-DMAC10.html) 1993-05-07

Family

ID=17045506

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59239487A Granted JPS61119052A (ja) 1984-11-15 1984-11-15 非貴金属ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS61119052A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5152450A (en) * 1987-01-26 1992-10-06 Hitachi, Ltd. Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method

Also Published As

Publication number Publication date
JPH0530059B2 (cg-RX-API-DMAC10.html) 1993-05-07

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