JPS61113611A - 樹脂組成物 - Google Patents

樹脂組成物

Info

Publication number
JPS61113611A
JPS61113611A JP59234420A JP23442084A JPS61113611A JP S61113611 A JPS61113611 A JP S61113611A JP 59234420 A JP59234420 A JP 59234420A JP 23442084 A JP23442084 A JP 23442084A JP S61113611 A JPS61113611 A JP S61113611A
Authority
JP
Japan
Prior art keywords
resin composition
parts
electronic component
resin
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59234420A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6312893B2 (enExample
Inventor
Naomichi Hata
秦 直道
Tatenobu Arai
荒井 建伸
Tetsuo Tanabe
田辺 鉄男
Wataru Sakurai
渡 桜井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59234420A priority Critical patent/JPS61113611A/ja
Publication of JPS61113611A publication Critical patent/JPS61113611A/ja
Publication of JPS6312893B2 publication Critical patent/JPS6312893B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP59234420A 1984-11-07 1984-11-07 樹脂組成物 Granted JPS61113611A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59234420A JPS61113611A (ja) 1984-11-07 1984-11-07 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59234420A JPS61113611A (ja) 1984-11-07 1984-11-07 樹脂組成物

Publications (2)

Publication Number Publication Date
JPS61113611A true JPS61113611A (ja) 1986-05-31
JPS6312893B2 JPS6312893B2 (enExample) 1988-03-23

Family

ID=16970736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59234420A Granted JPS61113611A (ja) 1984-11-07 1984-11-07 樹脂組成物

Country Status (1)

Country Link
JP (1) JPS61113611A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0571625B1 (en) * 1990-06-20 2001-06-06 Dai Nippon Printing Co., Ltd. Color filter and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0571625B1 (en) * 1990-06-20 2001-06-06 Dai Nippon Printing Co., Ltd. Color filter and method of manufacturing the same

Also Published As

Publication number Publication date
JPS6312893B2 (enExample) 1988-03-23

Similar Documents

Publication Publication Date Title
US6860000B2 (en) Method to embed thick film components
US4396666A (en) Solderable conductive employing an organic binder
US6265051B1 (en) Edge connectors for printed circuit boards comprising conductive ink
JPS61113611A (ja) 樹脂組成物
JP2001335689A (ja) 電子材料用ポリサルファイド系硬化性樹脂組成物、電子用品及び電子材料用ポリサルファイド系硬化性樹脂組成物の使用方法
JPH0228608B2 (enExample)
JPS61118414A (ja) 樹脂組成物
JPS6248001A (ja) 電気抵抗素子の製造方法
JPS6258395B2 (enExample)
JPS59998B2 (ja) 印刷配線板の製造方法
JPS59106185A (ja) 電子回路の被覆方法
JPH0323091B2 (enExample)
JPH0457688B2 (enExample)
JPH0678409B2 (ja) 樹脂組成物の混合方法
JPH0414894A (ja) ホットメルト接着剤およびそれを用いる印刷回路配線板
Dummer et al. Printed and potted electronic circuits
JPH01159908A (ja) 耐熱性に優れた加熱硬化型銀ペースト組成物
JPS62130595A (ja) 電気回路装置の製造方法
JPH05274947A (ja) 電子部品封止材およびそれを用いた電子部品
JP2757949B2 (ja) チップ状電子部品
JPS5811114B2 (ja) 微小部品のプリント基板への実装法
JPS61151278A (ja) 電気絶縁被覆用樹脂組成物及び塗料
JPH11199842A (ja) 電子部品実装用接着剤および電子部品の実装方法
JPH03287680A (ja) 有機厚膜ペースト組成物
JPS61267203A (ja) 導電性ペ−スト