JPH0228608B2 - - Google Patents
Info
- Publication number
- JPH0228608B2 JPH0228608B2 JP59239753A JP23975384A JPH0228608B2 JP H0228608 B2 JPH0228608 B2 JP H0228608B2 JP 59239753 A JP59239753 A JP 59239753A JP 23975384 A JP23975384 A JP 23975384A JP H0228608 B2 JPH0228608 B2 JP H0228608B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- electronic component
- parts
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59239753A JPS61118415A (ja) | 1984-11-13 | 1984-11-13 | 樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59239753A JPS61118415A (ja) | 1984-11-13 | 1984-11-13 | 樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61118415A JPS61118415A (ja) | 1986-06-05 |
| JPH0228608B2 true JPH0228608B2 (enExample) | 1990-06-25 |
Family
ID=17049410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59239753A Granted JPS61118415A (ja) | 1984-11-13 | 1984-11-13 | 樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61118415A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5064719A (en) * | 1989-09-26 | 1991-11-12 | E. I. Du Pont De Nemours And Company | Coating composition of acrylic polymers containing reactive groups and an epoxy organosilane |
| US4988759A (en) * | 1989-09-26 | 1991-01-29 | E. I. Du Pont De Nemours And Company | Coating composition of acrylic polymers containing reactive groups and an epoxy organosilane |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58204057A (ja) * | 1982-05-25 | 1983-11-28 | Mitsubishi Rayon Co Ltd | 床および壁面コ−テイング用プライマ−組成物 |
-
1984
- 1984-11-13 JP JP59239753A patent/JPS61118415A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61118415A (ja) | 1986-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6860000B2 (en) | Method to embed thick film components | |
| US5981043A (en) | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield | |
| KR910009127A (ko) | 인쇄 회로판, 그의 제조방법 및 인쇄 회로판에 전자 부품을 부착시키는 방법 | |
| KR20010083236A (ko) | 접속재료 | |
| US6596200B1 (en) | Electronic material composition, electronic parts and use of electronic material composition | |
| US5736070A (en) | Electroconductive coating composition, a printed circuit board fabricated by using it and a flexible printed circuit assembly with electromagnetic shield | |
| EP1129605B1 (en) | Edge connectors for printed circuit boards comprising conductive ink | |
| JP6371513B2 (ja) | フレキシブルプリント配線板、およびその製造方法 | |
| JPH0228608B2 (enExample) | ||
| JP2001335689A (ja) | 電子材料用ポリサルファイド系硬化性樹脂組成物、電子用品及び電子材料用ポリサルファイド系硬化性樹脂組成物の使用方法 | |
| JPS6312893B2 (enExample) | ||
| JPS61118414A (ja) | 樹脂組成物 | |
| JPS6258395B2 (enExample) | ||
| JPH0323091B2 (enExample) | ||
| JPS59998B2 (ja) | 印刷配線板の製造方法 | |
| JP2000091753A (ja) | プリント配線基板およびその製造方法 | |
| JPS61120863A (ja) | コ−テイング樹脂組成物 | |
| JPS59106185A (ja) | 電子回路の被覆方法 | |
| JPH0414894A (ja) | ホットメルト接着剤およびそれを用いる印刷回路配線板 | |
| JPH01159908A (ja) | 耐熱性に優れた加熱硬化型銀ペースト組成物 | |
| JP3048650B2 (ja) | 電子部品用封止材及びそれを用いた電子部品 | |
| JPS61120865A (ja) | コ−テイング樹脂組成物 | |
| JP3855220B2 (ja) | 電子材料組成物、電子用品及び電子材料組成物の使用方法 | |
| JPH0678409B2 (ja) | 樹脂組成物の混合方法 | |
| Dummer et al. | Printed and potted electronic circuits |