JPS61111181A - ポリイミド−金属箔複合フイルムの製法 - Google Patents

ポリイミド−金属箔複合フイルムの製法

Info

Publication number
JPS61111181A
JPS61111181A JP23432184A JP23432184A JPS61111181A JP S61111181 A JPS61111181 A JP S61111181A JP 23432184 A JP23432184 A JP 23432184A JP 23432184 A JP23432184 A JP 23432184A JP S61111181 A JPS61111181 A JP S61111181A
Authority
JP
Japan
Prior art keywords
polyimide
metal foil
composite film
film
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23432184A
Other languages
English (en)
Japanese (ja)
Other versions
JPH046431B2 (enrdf_load_stackoverflow
Inventor
Masanori Imai
正則 今井
Ken Noda
謙 野田
Toshio Nakajima
中島　登志雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP23432184A priority Critical patent/JPS61111181A/ja
Publication of JPS61111181A publication Critical patent/JPS61111181A/ja
Publication of JPH046431B2 publication Critical patent/JPH046431B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)
JP23432184A 1984-11-07 1984-11-07 ポリイミド−金属箔複合フイルムの製法 Granted JPS61111181A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23432184A JPS61111181A (ja) 1984-11-07 1984-11-07 ポリイミド−金属箔複合フイルムの製法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23432184A JPS61111181A (ja) 1984-11-07 1984-11-07 ポリイミド−金属箔複合フイルムの製法

Publications (2)

Publication Number Publication Date
JPS61111181A true JPS61111181A (ja) 1986-05-29
JPH046431B2 JPH046431B2 (enrdf_load_stackoverflow) 1992-02-05

Family

ID=16969174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23432184A Granted JPS61111181A (ja) 1984-11-07 1984-11-07 ポリイミド−金属箔複合フイルムの製法

Country Status (1)

Country Link
JP (1) JPS61111181A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05145229A (ja) * 1991-11-18 1993-06-11 Reiko Co Ltd フレキシブル導電体及びその製造法
US6998455B1 (en) 1999-10-21 2006-02-14 Nippon Steel Chemical Co., Ltd. Laminate and process for producing the same
US7070864B2 (en) 2001-04-19 2006-07-04 Nippon Steel Chemical Co., Ltd. Laminate for electronic materials
JP2006183040A (ja) * 2004-12-03 2006-07-13 Ube Ind Ltd ポリイミド、ポリイミドフィルム及び積層体
WO2006112523A1 (ja) * 2005-04-19 2006-10-26 Ube Industries, Ltd. ポリイミドフィルム積層体
JP2006321229A (ja) * 2005-04-19 2006-11-30 Ube Ind Ltd ポリイミドフィルム積層体
WO2014129464A1 (ja) * 2013-02-19 2014-08-28 新日鉄住金化学株式会社 積層体、太陽電池用部材、太陽電池、表示装置用部材、表示装置及び積層体の製造方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05145229A (ja) * 1991-11-18 1993-06-11 Reiko Co Ltd フレキシブル導電体及びその製造法
US6998455B1 (en) 1999-10-21 2006-02-14 Nippon Steel Chemical Co., Ltd. Laminate and process for producing the same
US7070864B2 (en) 2001-04-19 2006-07-04 Nippon Steel Chemical Co., Ltd. Laminate for electronic materials
JP2006183040A (ja) * 2004-12-03 2006-07-13 Ube Ind Ltd ポリイミド、ポリイミドフィルム及び積層体
WO2006112523A1 (ja) * 2005-04-19 2006-10-26 Ube Industries, Ltd. ポリイミドフィルム積層体
JP2006321229A (ja) * 2005-04-19 2006-11-30 Ube Ind Ltd ポリイミドフィルム積層体
US8043697B2 (en) 2005-04-19 2011-10-25 Ube Industries, Ltd. Polyimide film-laminated body
WO2014129464A1 (ja) * 2013-02-19 2014-08-28 新日鉄住金化学株式会社 積層体、太陽電池用部材、太陽電池、表示装置用部材、表示装置及び積層体の製造方法

Also Published As

Publication number Publication date
JPH046431B2 (enrdf_load_stackoverflow) 1992-02-05

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