JPS61111177U - - Google Patents

Info

Publication number
JPS61111177U
JPS61111177U JP19570784U JP19570784U JPS61111177U JP S61111177 U JPS61111177 U JP S61111177U JP 19570784 U JP19570784 U JP 19570784U JP 19570784 U JP19570784 U JP 19570784U JP S61111177 U JPS61111177 U JP S61111177U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
electric circuit
resin
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19570784U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19570784U priority Critical patent/JPS61111177U/ja
Publication of JPS61111177U publication Critical patent/JPS61111177U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例に係る印刷配線基
板の要部を示す断面図、第２図は従来の印刷配線
基板の要部を示す断面図である。 １０……絶縁基板、１１……銅箔パターン、１
２……部品挿入孔、１３……電気部品、１４……
端子、１５……ソルダーレジスト、１６……樹脂
、１７……フラツクス層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 絶縁基板に被着された金属導体をエツチングし
    て電気回路を形成してなる印刷配線基板において
    、前記電気回路の半田付け部以外に低活性エネル
    ギ表面を有した樹脂を塗布してなることを特徴と
    する印刷配線基板。
JP19570784U 1984-12-24 1984-12-24 Pending JPS61111177U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19570784U JPS61111177U (ja) 1984-12-24 1984-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19570784U JPS61111177U (ja) 1984-12-24 1984-12-24

Publications (1)

Publication Number Publication Date
JPS61111177U true JPS61111177U (ja) 1986-07-14

Family

ID=30753311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19570784U Pending JPS61111177U (ja) 1984-12-24 1984-12-24

Country Status (1)

Country Link
JP (1) JPS61111177U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63250895A (ja) * 1987-04-08 1988-10-18 日本シイエムケイ株式会社 プリント配線板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51145862A (en) * 1975-06-11 1976-12-15 Tokyo Shibaura Electric Co Solderrresisting protective material
JPS5875883A (ja) * 1981-10-30 1983-05-07 富士通株式会社 混成集積回路の保護膜形成法
JPS59151491A (ja) * 1983-02-18 1984-08-29 旭硝子株式会社 プリント回路板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51145862A (en) * 1975-06-11 1976-12-15 Tokyo Shibaura Electric Co Solderrresisting protective material
JPS5875883A (ja) * 1981-10-30 1983-05-07 富士通株式会社 混成集積回路の保護膜形成法
JPS59151491A (ja) * 1983-02-18 1984-08-29 旭硝子株式会社 プリント回路板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63250895A (ja) * 1987-04-08 1988-10-18 日本シイエムケイ株式会社 プリント配線板

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