JPS61106207A - ウエハー製造方法並びに装置 - Google Patents

ウエハー製造方法並びに装置

Info

Publication number
JPS61106207A
JPS61106207A JP22935684A JP22935684A JPS61106207A JP S61106207 A JPS61106207 A JP S61106207A JP 22935684 A JP22935684 A JP 22935684A JP 22935684 A JP22935684 A JP 22935684A JP S61106207 A JPS61106207 A JP S61106207A
Authority
JP
Japan
Prior art keywords
cutting
wafer
ingot
face
grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22935684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0212729B2 (en, 2012
Inventor
寺沢　進
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP22935684A priority Critical patent/JPS61106207A/ja
Publication of JPS61106207A publication Critical patent/JPS61106207A/ja
Publication of JPH0212729B2 publication Critical patent/JPH0212729B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP22935684A 1984-10-31 1984-10-31 ウエハー製造方法並びに装置 Granted JPS61106207A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22935684A JPS61106207A (ja) 1984-10-31 1984-10-31 ウエハー製造方法並びに装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22935684A JPS61106207A (ja) 1984-10-31 1984-10-31 ウエハー製造方法並びに装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP3018086A Division JP2537573B2 (ja) 1991-02-08 1991-02-08 半導体ウエハ―製造方法
JP3018085A Division JPH0613173B2 (ja) 1991-02-08 1991-02-08 ウエハー製造装置

Publications (2)

Publication Number Publication Date
JPS61106207A true JPS61106207A (ja) 1986-05-24
JPH0212729B2 JPH0212729B2 (en, 2012) 1990-03-26

Family

ID=16890879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22935684A Granted JPS61106207A (ja) 1984-10-31 1984-10-31 ウエハー製造方法並びに装置

Country Status (1)

Country Link
JP (1) JPS61106207A (en, 2012)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6296400A (ja) * 1985-10-23 1987-05-02 Mitsubishi Metal Corp ウエハの製造方法
JPS6411754A (en) * 1987-07-06 1989-01-17 Mitsubishi Metal Corp Manufacture for mirror surfaced wafer
EP0313714A1 (en) * 1987-10-29 1989-05-03 Tokyo Seimitsu Co.,Ltd. Apparatus and method for slicing a wafer
JPH01210313A (ja) * 1988-02-18 1989-08-23 Tokyo Seimitsu Co Ltd ウエハの切断装置
DE3908153A1 (de) * 1988-03-11 1989-09-21 Mitsubishi Metal Corp Innenwirksame schneidscheibe
EP0398467A3 (en) * 1989-05-18 1992-01-02 Silicon Technology Corporation A slicing and grinding system for a wafer slicing machine
US5218948A (en) * 1988-03-11 1993-06-15 Mitsubishi Kinzoku Kabushiki Kaisha Inside diameter blade
US5285597A (en) * 1991-11-07 1994-02-15 Gmn Georg Muller Nurnberg Ag Method and arrangement for subdividing semiconductor bars into semiconductor wafers
EP0750972A1 (en) * 1995-06-30 1997-01-02 Tokyo Seimitsu Co.,Ltd. Ingot slicing machine with built-in grinder

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2382257A (en) * 1943-04-21 1945-08-14 Albert Ramsay Manufacture of piezoelectric oscillator blanks

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2382257A (en) * 1943-04-21 1945-08-14 Albert Ramsay Manufacture of piezoelectric oscillator blanks

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6296400A (ja) * 1985-10-23 1987-05-02 Mitsubishi Metal Corp ウエハの製造方法
JPS6411754A (en) * 1987-07-06 1989-01-17 Mitsubishi Metal Corp Manufacture for mirror surfaced wafer
EP0313714A1 (en) * 1987-10-29 1989-05-03 Tokyo Seimitsu Co.,Ltd. Apparatus and method for slicing a wafer
EP0534499A3 (en) * 1987-10-29 1993-04-21 Tokyo Seimitsu Co.,Ltd. Method for slicing a wafer
JPH01210313A (ja) * 1988-02-18 1989-08-23 Tokyo Seimitsu Co Ltd ウエハの切断装置
DE3908153A1 (de) * 1988-03-11 1989-09-21 Mitsubishi Metal Corp Innenwirksame schneidscheibe
US5218948A (en) * 1988-03-11 1993-06-15 Mitsubishi Kinzoku Kabushiki Kaisha Inside diameter blade
EP0398467A3 (en) * 1989-05-18 1992-01-02 Silicon Technology Corporation A slicing and grinding system for a wafer slicing machine
US5285597A (en) * 1991-11-07 1994-02-15 Gmn Georg Muller Nurnberg Ag Method and arrangement for subdividing semiconductor bars into semiconductor wafers
EP0750972A1 (en) * 1995-06-30 1997-01-02 Tokyo Seimitsu Co.,Ltd. Ingot slicing machine with built-in grinder
US5836808A (en) * 1995-06-30 1998-11-17 Tokyo Seimitsu Co., Ltd. Slicing machine with built-in grinder

Also Published As

Publication number Publication date
JPH0212729B2 (en, 2012) 1990-03-26

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees