JPS61102747A - ワイヤ−ボンダ−の認識パタ−ン変更方法 - Google Patents
ワイヤ−ボンダ−の認識パタ−ン変更方法Info
- Publication number
- JPS61102747A JPS61102747A JP59225564A JP22556484A JPS61102747A JP S61102747 A JPS61102747 A JP S61102747A JP 59225564 A JP59225564 A JP 59225564A JP 22556484 A JP22556484 A JP 22556484A JP S61102747 A JPS61102747 A JP S61102747A
- Authority
- JP
- Japan
- Prior art keywords
- coordinate
- pattern
- bonding
- data
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0711—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59225564A JPS61102747A (ja) | 1984-10-26 | 1984-10-26 | ワイヤ−ボンダ−の認識パタ−ン変更方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59225564A JPS61102747A (ja) | 1984-10-26 | 1984-10-26 | ワイヤ−ボンダ−の認識パタ−ン変更方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61102747A true JPS61102747A (ja) | 1986-05-21 |
| JPH0236066B2 JPH0236066B2 (Direct) | 1990-08-15 |
Family
ID=16831275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59225564A Granted JPS61102747A (ja) | 1984-10-26 | 1984-10-26 | ワイヤ−ボンダ−の認識パタ−ン変更方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61102747A (Direct) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0262777A3 (en) * | 1986-09-02 | 1989-08-23 | Kabushiki Kaisha Toshiba | Wire bonding device wire bonding device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50100983A (Direct) * | 1973-10-29 | 1975-08-11 | ||
| JPS549580A (en) * | 1977-06-24 | 1979-01-24 | Kaijo Denki Kk | Method of matching semiconductor wire bonds |
| JPS5681950A (en) * | 1979-12-07 | 1981-07-04 | Toshiba Corp | Position detecting method |
| JPS5733852A (en) * | 1980-08-08 | 1982-02-24 | Meidensha Electric Mfg Co Ltd | Data exchanging method for loop transmission |
| JPS5749242A (en) * | 1980-09-09 | 1982-03-23 | Toshiba Corp | Wire bonding device |
-
1984
- 1984-10-26 JP JP59225564A patent/JPS61102747A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50100983A (Direct) * | 1973-10-29 | 1975-08-11 | ||
| JPS549580A (en) * | 1977-06-24 | 1979-01-24 | Kaijo Denki Kk | Method of matching semiconductor wire bonds |
| JPS5681950A (en) * | 1979-12-07 | 1981-07-04 | Toshiba Corp | Position detecting method |
| JPS5733852A (en) * | 1980-08-08 | 1982-02-24 | Meidensha Electric Mfg Co Ltd | Data exchanging method for loop transmission |
| JPS5749242A (en) * | 1980-09-09 | 1982-03-23 | Toshiba Corp | Wire bonding device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0262777A3 (en) * | 1986-09-02 | 1989-08-23 | Kabushiki Kaisha Toshiba | Wire bonding device wire bonding device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0236066B2 (Direct) | 1990-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |