JPS6096832U - electrostatic chuck - Google Patents
electrostatic chuckInfo
- Publication number
- JPS6096832U JPS6096832U JP18956183U JP18956183U JPS6096832U JP S6096832 U JPS6096832 U JP S6096832U JP 18956183 U JP18956183 U JP 18956183U JP 18956183 U JP18956183 U JP 18956183U JP S6096832 U JPS6096832 U JP S6096832U
- Authority
- JP
- Japan
- Prior art keywords
- electrostatic chuck
- chuck according
- substrate body
- dielectric material
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の静電チャックを示す要部概要側
。
面図、第２図は本考案による静電チャックの一実。
流側を示す要部概要側面図である。
１０・・・基板本体、１，１１・・・電極、２，１２・
・・誘電体、３・・・被チャック物（ウェハ）、４・・
・直流電源。Figure 1 shows an overview of the main parts of a conventional electrostatic chuck.
. The top view and Figure 2 show an example of the electrostatic chuck according to the present invention. FIG. 2 is a schematic side view of the main parts showing the flow side. 10... Substrate body, 1, 11... Electrode, 2, 12...
...Dielectric, 3...Object to be chucked (wafer), 4...
・DC power supply.
Claims (1)
からなる板または膜状の誘電体と、前記基板本体の表面
または誘電体の裏面に形成された膜状の電極とからなり
、前記基板本体と誘電体とが前記電極を介して接着固定
されていることを特徴とする静電チャック。 ２ 誘電体が、石英ガラスであることを特徴とする実用
新案登録請求の範囲第１項記載の静電チャック。 ３ 電極が、誘電体の裏面に蒸着により成形された被膜
であることを特徴とする実用新案登録請求の範囲第１ま
たは２項記載の静電チャック。 ４ 基板本体が、石英ガラスであることを特徴とする実
用新案登録請求の範囲第１，２または３項記載の静電チ
ャック。 ５ 基板本体が、アルミナセラミックであること番特徴
とする実用新案登録請求の範囲第１，２または３項記載
の静電チャック。[Claims for Utility Model Registration] 1. A substrate body made of an electrical insulating material, a plate or film-like dielectric material also made of an electrical insulating material, and a film-like material formed on the surface of the substrate main body or the back surface of the dielectric material. An electrostatic chuck comprising an electrode, the substrate body and a dielectric being adhesively fixed via the electrode. 2. The electrostatic chuck according to claim 1, wherein the dielectric material is quartz glass. 3. The electrostatic chuck according to claim 1 or 2, wherein the electrode is a film formed by vapor deposition on the back surface of a dielectric material. 4. The electrostatic chuck according to claim 1, 2 or 3 of the utility model registration, characterized in that the substrate body is made of quartz glass. 5. The electrostatic chuck according to claim 1, 2 or 3 of the utility model registration, characterized in that the substrate body is made of alumina ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18956183U JPS6096832U (en) | 1983-12-08 | 1983-12-08 | electrostatic chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18956183U JPS6096832U (en) | 1983-12-08 | 1983-12-08 | electrostatic chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6096832U true JPS6096832U (en) | 1985-07-02 |
Family
ID=30408666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18956183U Pending JPS6096832U (en) | 1983-12-08 | 1983-12-08 | electrostatic chuck |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6096832U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142567A (en) * | 2001-10-31 | 2003-05-16 | Kyocera Corp | Wafer mounting stage |
| JP2008034496A (en) * | 2006-07-27 | 2008-02-14 | Covalent Materials Corp | Electrostatic chuck |
| JP2009032718A (en) * | 2007-07-24 | 2009-02-12 | Covalent Materials Corp | Glass-made electrostatic chuck and method of manufacturing the same |
-
1983
- 1983-12-08 JP JP18956183U patent/JPS6096832U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003142567A (en) * | 2001-10-31 | 2003-05-16 | Kyocera Corp | Wafer mounting stage |
| JP2008034496A (en) * | 2006-07-27 | 2008-02-14 | Covalent Materials Corp | Electrostatic chuck |
| JP2009032718A (en) * | 2007-07-24 | 2009-02-12 | Covalent Materials Corp | Glass-made electrostatic chuck and method of manufacturing the same |
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