JPS59189234U - Jig for semiconductor manufacturing - Google Patents
Jig for semiconductor manufacturingInfo
- Publication number
- JPS59189234U JPS59189234U JP8375583U JP8375583U JPS59189234U JP S59189234 U JPS59189234 U JP S59189234U JP 8375583 U JP8375583 U JP 8375583U JP 8375583 U JP8375583 U JP 8375583U JP S59189234 U JPS59189234 U JP S59189234U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- semiconductor manufacturing
- semiconductor
- semiconductor wafer
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
す 第１図は従来のサセプタの要部の平面図であ
る。
第２図は第１図のサセプタの■−■線に沿う断面図であ
る。第３図はこの考案の一実施例のサセプタの要部断面
図である。
１・・・・・・サセプタ本体、２・・・・・・炭化シリ
コン層、３・・・・・・凹所、４・・・・・・半導体ウ
ェーハ、５・・・・・・エピタキシャル層、６・・・・
・・オリエンテーションフラッ）ＯＦ、７・・・・・・
隙間、９・・・・・・多結晶（シリコン）層。FIG. 1 is a plan view of the main parts of a conventional susceptor. FIG. 2 is a cross-sectional view of the susceptor shown in FIG. 1 taken along the line ■-■. FIG. 3 is a sectional view of a main part of a susceptor according to an embodiment of this invention. DESCRIPTION OF SYMBOLS 1... Susceptor main body, 2... Silicon carbide layer, 3... Recess, 4... Semiconductor wafer, 5... Epitaxial layer , 6...
...Orientation flash) OF, 7...
Gap, 9... Polycrystalline (silicon) layer.
Claims (1)
成長によって成膜を行なう半導体製造用治具において、 その表面に成膜予定の半導体材料より多結晶層を３０μ
以上の厚さに形成したことを特徴とする半導体製造用治
具。[Claims for Utility Model Registration] In a jig for semiconductor manufacturing in which a semiconductor wafer is placed and a film is formed on the semiconductor wafer by vapor phase growth, a polycrystalline layer of 30 μm from the semiconductor material to be deposited is formed on the surface of the jig.
A jig for semiconductor manufacturing, characterized in that the jig is formed to a thickness of at least the above thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8375583U JPS59189234U (en) | 1983-05-31 | 1983-05-31 | Jig for semiconductor manufacturing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8375583U JPS59189234U (en) | 1983-05-31 | 1983-05-31 | Jig for semiconductor manufacturing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59189234U true JPS59189234U (en) | 1984-12-15 |
Family
ID=30213713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8375583U Pending JPS59189234U (en) | 1983-05-31 | 1983-05-31 | Jig for semiconductor manufacturing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59189234U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0855803A (en) * | 1994-07-28 | 1996-02-27 | Applied Materials Inc | Thin film preparation |
-
1983
- 1983-05-31 JP JP8375583U patent/JPS59189234U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0855803A (en) * | 1994-07-28 | 1996-02-27 | Applied Materials Inc | Thin film preparation |
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