JPS60183434U - Wafer for integrated circuit formation - Google Patents
Wafer for integrated circuit formationInfo
- Publication number
- JPS60183434U JPS60183434U JP7110284U JP7110284U JPS60183434U JP S60183434 U JPS60183434 U JP S60183434U JP 7110284 U JP7110284 U JP 7110284U JP 7110284 U JP7110284 U JP 7110284U JP S60183434 U JPS60183434 U JP S60183434U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- integrated circuit
- substrate
- fixed
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Registering Or Overturning Sheets (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の第１実施例を示す斜視図、第２図はそ
の一部断面図、第３図はチップ形ＬＳＩの −実装態様
を示す斜視図、第４図はその■−■矢視断面図、第５図
□はフルウェハ形ＬＳＩの実装態様を示す斜視図、第６
図は本考案の第２実施例を示す斜視図、第７図はその一
部断面図、第８図は本考案の第３実施例を示す斜視図、
第９図はその一部断面図である。Fig. 1 is a perspective view showing the first embodiment of the present invention, Fig. 2 is a partial cross-sectional view thereof, Fig. 3 is a perspective view showing a mounting mode of a chip type LSI, and Fig. 4 is its ■-■ A sectional view taken in the direction of arrows, FIG.
The figure is a perspective view showing a second embodiment of the present invention, FIG. 7 is a partial sectional view thereof, and FIG. 8 is a perspective view showing a third embodiment of the present invention.
FIG. 9 is a partial sectional view thereof.
Claims (1)
集積回路形成用ウェハにおいて、ウェハ１を固定台上に
磁力で固定するに足りる質量の磁性材料２を基板１ａに
固着し、固定台側に設けた電磁石と基板１ａに固着した
磁性材料２との間に生ずる磁力により固定台上にウェハ
１を固定できるように構成した事を特徴とする集積回路
形成用ウェハ。 ２ 基板１ａの裏面３のほぼ全面に亘って磁性材料２を
固着した事を特徴とする実用新案登録請求の範囲第１項
に記載した集積回路形成用ウエノ１゜[Claims for Utility Model Registration] 1. In a wafer for forming an integrated circuit in which an integrated circuit forming layer 1b is provided on the upper surface of a substrate 1a, a magnetic material 2 having a mass sufficient to magnetically fix the wafer 1 on a fixing table is attached to the substrate. For forming an integrated circuit, the wafer 1 is fixed to the substrate 1a and is configured to be fixed on the fixing table by the magnetic force generated between the electromagnet provided on the fixing table side and the magnetic material 2 fixed to the substrate 1a. wafer. 2. Ueno 1° for forming an integrated circuit as described in claim 1 of the utility model registration claim, characterized in that a magnetic material 2 is fixed over almost the entire back surface 3 of the substrate 1a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7110284U JPS60183434U (en) | 1984-05-15 | 1984-05-15 | Wafer for integrated circuit formation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7110284U JPS60183434U (en) | 1984-05-15 | 1984-05-15 | Wafer for integrated circuit formation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60183434U true JPS60183434U (en) | 1985-12-05 |
Family
ID=30608292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7110284U Pending JPS60183434U (en) | 1984-05-15 | 1984-05-15 | Wafer for integrated circuit formation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60183434U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6351244A (en) * | 1986-08-20 | 1988-03-04 | Disco Abrasive Syst Ltd | Magnet method tape frame positioning device |
| WO2003054943A1 (en) * | 2001-12-21 | 2003-07-03 | Disco Corporation | Support substrate for thin-sheet work |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5844848B2 (en) * | 1976-05-25 | 1983-10-05 | 株式会社デンソー | Engine exhaust gas purification device |
| JPS594654B2 (en) * | 1975-04-11 | 1984-01-31 | ベックマン・インストルメンツ・インコ−ポレ−テツド | I can't wait to see you |
-
1984
- 1984-05-15 JP JP7110284U patent/JPS60183434U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS594654B2 (en) * | 1975-04-11 | 1984-01-31 | ベックマン・インストルメンツ・インコ−ポレ−テツド | I can't wait to see you |
| JPS5844848B2 (en) * | 1976-05-25 | 1983-10-05 | 株式会社デンソー | Engine exhaust gas purification device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6351244A (en) * | 1986-08-20 | 1988-03-04 | Disco Abrasive Syst Ltd | Magnet method tape frame positioning device |
| WO2003054943A1 (en) * | 2001-12-21 | 2003-07-03 | Disco Corporation | Support substrate for thin-sheet work |
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