JPS61162962U - - Google Patents

Info

Publication number
JPS61162962U
JPS61162962U JP1985028176U JP2817685U JPS61162962U JP S61162962 U JPS61162962 U JP S61162962U JP 1985028176 U JP1985028176 U JP 1985028176U JP 2817685 U JP2817685 U JP 2817685U JP S61162962 U JPS61162962 U JP S61162962U
Authority
JP
Japan
Prior art keywords
hard
substrate
substrates
hard substrates
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985028176U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985028176U priority Critical patent/JPS61162962U/ja
Publication of JPS61162962U publication Critical patent/JPS61162962U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図乃至第４図は本考案の硬質基板の接着構
造を実現する工程図、第５図は従来の硬質基板の
接着構造を示す図である。 １，１′……硬質基板、２……端子、３……導
電性異方テープ、４……塗料。 1 to 4 are process diagrams for realizing the hard substrate bonding structure of the present invention, and FIG. 5 is a diagram showing a conventional hard substrate bonding structure. 1, 1'...Hard substrate, 2...Terminal, 3...Conductive anisotropic tape, 4...Paint.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 端子が形成された硬質基板同志を相対向させ、
両硬質基板を接着した構造において、端子が形成
された箇所を除く表面に層体が形成された硬質基
板と、該硬質基板間に介在する異方性導電テープ
とから成ることを特徴とする硬質基板の接着構造
。 The hard substrates on which the terminals are formed are placed facing each other,
A hard substrate having a structure in which both hard substrates are bonded together, and comprising a hard substrate on which a layer is formed on the surface except for a portion where a terminal is formed, and an anisotropic conductive tape interposed between the hard substrates. Adhesive structure of substrate.
JP1985028176U 1985-02-26 1985-02-26 Pending JPS61162962U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985028176U JPS61162962U (en) 1985-02-26 1985-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985028176U JPS61162962U (en) 1985-02-26 1985-02-26

Publications (1)

Publication Number Publication Date
JPS61162962U true JPS61162962U (en) 1986-10-08

Family

ID=30525818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985028176U Pending JPS61162962U (en) 1985-02-26 1985-02-26

Country Status (1)

Country Link
JP (1) JPS61162962U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0773739A (en) * 1993-09-03 1995-03-17 Nippon Kokuen Kogyo Kk Flexible circuit board and its manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0773739A (en) * 1993-09-03 1995-03-17 Nippon Kokuen Kogyo Kk Flexible circuit board and its manufacture

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