JPS6176988U - - Google Patents
Info
- Publication number
- JPS6176988U JPS6176988U JP16088384U JP16088384U JPS6176988U JP S6176988 U JPS6176988 U JP S6176988U JP 16088384 U JP16088384 U JP 16088384U JP 16088384 U JP16088384 U JP 16088384U JP S6176988 U JPS6176988 U JP S6176988U
- Authority
- JP
- Japan
- Prior art keywords
- metal member
- dielectric substrate
- protrusions
- integrated circuit
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000005219 brazing Methods 0.000 description 1
Description
第１図は本考案の一実施例を示す断面図、第２
図および第３図は従来例を示す断面図である。
１……金属部材、２，２′，２″……誘電体基
板、３……ロウ付、４……導体部（導体パターン
）、５……導線、６……突起。
Fig. 1 is a sectional view showing one embodiment of the present invention;
FIG. 3 and FIG. 3 are cross-sectional views showing a conventional example. DESCRIPTION OF SYMBOLS 1... Metal member, 2, 2', 2''... Dielectric substrate, 3... Brazing, 4... Conductor part (conductor pattern), 5... Conductor wire, 6... Projection.
Claims (1)
をもつ混成集積回路において、前記誘電体基板が
複数板に分割されており、前記金属部材上の前記
誘電体基板との接着面には、少なくとも１つ以上
の突起が設けられ、前記突起により、前記複数枚
の誘電体基板どうしが直接接触することなく前記
金属部材に接着されていることを特徴とする混成
集積回路。 In a hybrid integrated circuit having a structure in which a dielectric substrate is bonded onto a metal member, the dielectric substrate is divided into a plurality of plates, and the bonding surface of the metal member with the dielectric substrate has at least A hybrid integrated circuit characterized in that one or more protrusions are provided, and the plurality of dielectric substrates are bonded to the metal member without direct contact with each other by the protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16088384U JPS6176988U (en) | 1984-10-24 | 1984-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16088384U JPS6176988U (en) | 1984-10-24 | 1984-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6176988U true JPS6176988U (en) | 1986-05-23 |
Family
ID=30718796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16088384U Pending JPS6176988U (en) | 1984-10-24 | 1984-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6176988U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295393A (en) * | 2005-04-07 | 2006-10-26 | Mitsubishi Electric Corp | High frequency circuit |
-
1984
- 1984-10-24 JP JP16088384U patent/JPS6176988U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006295393A (en) * | 2005-04-07 | 2006-10-26 | Mitsubishi Electric Corp | High frequency circuit |
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