JPS611212U - low inductance ground wire - Google Patents
low inductance ground wireInfo
- Publication number
- JPS611212U JPS611212U JP8684684U JP8684684U JPS611212U JP S611212 U JPS611212 U JP S611212U JP 8684684 U JP8684684 U JP 8684684U JP 8684684 U JP8684684 U JP 8684684U JP S611212 U JPS611212 U JP S611212U
- Authority
- JP
- Japan
- Prior art keywords
- insulating coating
- low inductance
- tape
- grounding wire
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulated Conductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図乃至第3図はいずれも本考案に係る低インダクタ
ンス接地線の実施例の横断面図である。
l at 1 be 1 c・・・導体、2・・・
絶縁被覆層、21・・・絶縁被覆層の連結部、3・・・
接着剤層、5・・・クッション層。1 to 3 are cross-sectional views of embodiments of the low inductance grounding wire according to the present invention. l at 1 be 1 c...conductor, 2...
Insulating coating layer, 21... Connecting portion of insulating coating layer, 3...
Adhesive layer, 5... cushion layer.
Claims (4)
絶縁被覆層を有し、該絶縁被覆層は互に連結されて片面
がテープ状の平面を形成し、他面に突起が形成されてい
ることを特徴とする低インダクタンス接地線。(1) An insulating coating layer is provided on a plurality of conductors arranged in parallel at intervals, and the insulating coating layers are interconnected to form a tape-shaped plane on one side and a protrusion on the other side. A low inductance grounding wire characterized by a
ことを特徴とする実用新案登録請求の範囲第1項記栽の
低インダクタンス接地線。(2) A low inductance grounding wire as described in Claim 1 of the Utility Model Registration Claim, characterized in that the tape-shaped flat surface of the insulating coating layer is curved inward.
ことを特徴とする実用新案登録請求の範囲第1項又は第
2項記載の低インダクタンス接地線。(3) A low-inductance grounding wire according to claim 1 or 2, characterized in that an adhesive layer is provided on the tape-shaped flat surface of the insulating coating layer.
を設けたことを特徴とする実用新案登録請求の範囲第1
項又は第2項記載の低インダクタンス接地線。(4) Utility model registration claim 1 characterized in that a cushion layer is provided on the tape-shaped flat surface of the insulating coating layer
The low inductance grounding wire described in item 2 or item 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8684684U JPS611212U (en) | 1984-06-11 | 1984-06-11 | low inductance ground wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8684684U JPS611212U (en) | 1984-06-11 | 1984-06-11 | low inductance ground wire |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS611212U true JPS611212U (en) | 1986-01-07 |
Family
ID=30638518
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8684684U Pending JPS611212U (en) | 1984-06-11 | 1984-06-11 | low inductance ground wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS611212U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0314208U (en) * | 1989-06-26 | 1991-02-13 |
-
1984
- 1984-06-11 JP JP8684684U patent/JPS611212U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0314208U (en) * | 1989-06-26 | 1991-02-13 |
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