JPS6257387U - - Google Patents

Info

Publication number
JPS6257387U
JPS6257387U JP1985149262U JP14926285U JPS6257387U JP S6257387 U JPS6257387 U JP S6257387U JP 1985149262 U JP1985149262 U JP 1985149262U JP 14926285 U JP14926285 U JP 14926285U JP S6257387 U JPS6257387 U JP S6257387U
Authority
JP
Japan
Prior art keywords
fine particles
substrates
electronic device
adhesive layer
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985149262U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985149262U priority Critical patent/JPS6257387U/ja
Publication of JPS6257387U publication Critical patent/JPS6257387U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例の電子装置の要部断面図
で、第２図は異本性導電シートの特性図である。 １，２……第１、第２の基板、１１，１１…２
１，２１……電極、３……接着剤層、３１，３１
……導電性微粒子、３２，３２……絶縁性微粒子
。 FIG. 1 is a sectional view of a main part of an electronic device according to an embodiment of the present invention, and FIG. 2 is a characteristic diagram of a non-conductive conductive sheet. 1, 2...first, second substrate, 11,11...2
1, 21... Electrode, 3... Adhesive layer, 31, 31
...Conductive fine particles, 32,32...Insulating fine particles.

Claims (1)

【実用新案登録請求の範囲】 (1) 複数の電極を有する第１、第２の基板と、
第１、第２の基板の間に介在し前記電極の間隔よ
り小さい直径を有する導電性微粒子と、前記導電
性微粒子と略等して直径を有する絶縁性微粒子と
を混入した接着剤層とを有した事を特徴とする電
子装置。 (2) 前記接着剤層は紫外線硬化型樹脂を主剤と
する事を特徴とする前記実用新案登録請求の範囲
第１項記載の電子装置。 (3) 前記接着剤層又は第１、第２の基板の貼合
部の周辺にはエポキシ樹脂層が設けてある事を特
徴とする前記実用新案登録請求の範囲第１項記載
の電子装置。[Claims for Utility Model Registration] (1) First and second substrates having a plurality of electrodes;
An adhesive layer is interposed between the first and second substrates and contains conductive fine particles having a diameter smaller than the spacing between the electrodes, and insulating fine particles having approximately the same diameter as the conductive fine particles. An electronic device characterized by having (2) The electronic device according to claim 1, wherein the adhesive layer is mainly composed of an ultraviolet curable resin. (3) The electronic device according to claim 1, wherein an epoxy resin layer is provided around the adhesive layer or the bonding portion of the first and second substrates.
JP1985149262U 1985-09-30 1985-09-30 Pending JPS6257387U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985149262U JPS6257387U (en) 1985-09-30 1985-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985149262U JPS6257387U (en) 1985-09-30 1985-09-30

Publications (1)

Publication Number Publication Date
JPS6257387U true JPS6257387U (en) 1987-04-09

Family

ID=31064304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985149262U Pending JPS6257387U (en) 1985-09-30 1985-09-30

Country Status (1)

Country Link
JP (1) JPS6257387U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183588A (en) * 2003-12-18 2005-07-07 Fujikura Ltd Junction and its production process
JP2005183451A (en) * 2003-12-16 2005-07-07 Fujikura Ltd Bonding body and manufacturing method thereof
WO2009031262A1 (en) * 2007-09-03 2009-03-12 Panasonic Corporation Wiring board
JP2009060015A (en) * 2007-09-03 2009-03-19 Panasonic Corp Solid printed circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5287663A (en) * 1975-10-23 1977-07-21 Chomerics Inc Separate current path connector
JPS6084718A (en) * 1983-10-14 1985-05-14 日立化成工業株式会社 Conductive anisotropic adhesive sheet

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5287663A (en) * 1975-10-23 1977-07-21 Chomerics Inc Separate current path connector
JPS6084718A (en) * 1983-10-14 1985-05-14 日立化成工業株式会社 Conductive anisotropic adhesive sheet

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183451A (en) * 2003-12-16 2005-07-07 Fujikura Ltd Bonding body and manufacturing method thereof
JP4526813B2 (en) * 2003-12-16 2010-08-18 株式会社フジクラ Manufacturing method of joined body
JP2005183588A (en) * 2003-12-18 2005-07-07 Fujikura Ltd Junction and its production process
JP4526814B2 (en) * 2003-12-18 2010-08-18 株式会社フジクラ Manufacturing method of joined body
WO2009031262A1 (en) * 2007-09-03 2009-03-12 Panasonic Corporation Wiring board
JP2009060015A (en) * 2007-09-03 2009-03-19 Panasonic Corp Solid printed circuit board
TWI422301B (en) * 2007-09-03 2014-01-01 Panasonic Corp Wiring board

Similar Documents

Publication Publication Date Title
JPS6257387U (en)
JPH02189U (en)
JPS5849638Y2 (en) semiconductor equipment
JPS61203503U (en)
JPH022835U (en)
JPS6142858U (en) Thick film circuit device
JPS61730U (en) membrane switch
JPH0224429U (en)
JPS6255375U (en)
JPS61240U (en) semiconductor equipment
JPS62149857U (en)
JPS61129376U (en)
JPS6255376U (en)
JPS61162962U (en)
JPS58148903U (en) chip resistor
JPS6118628U (en) piezoelectric vibrating parts
JPS58159764U (en) magnetoelectric conversion element
JPS6298260U (en)
JPS643215U (en)
JPS5933397U (en) piezoelectric sounding body
JPS58139622U (en) switch panel
JPS6074073U (en) semiconductor x-ray detector
JPS5967908U (en) flat coil
JPS5918391U (en) Series gap of lightning arrester
JPS6163872U (en)