JPS6255376U - - Google Patents
Info
- Publication number
- JPS6255376U JPS6255376U JP14608485U JP14608485U JPS6255376U JP S6255376 U JPS6255376 U JP S6255376U JP 14608485 U JP14608485 U JP 14608485U JP 14608485 U JP14608485 U JP 14608485U JP S6255376 U JPS6255376 U JP S6255376U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- printed wiring
- wiring body
- chip component
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive effect Effects 0.000 claims 5
- 239000003292 glue Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Description
第１図及び第２図はこの考案に係るプリント配
線体に於けるチツプ部品のプリント基板への仮固
定構造を示す部分平面図及び要部断面図、第３図
乃至第６図はプリント配線体に於けるチツプ部品
のプリント基板への仮固定構造の従来例を示す図
面である。
４……チツプ部品、４ａ……部品本体、４ｂ，
４ｂ……電極、５……プリント基板、５ａ……絶
縁基板、５ｂ，５ｂ……導電ランド、６，６……
接着剤。
1 and 2 are a partial plan view and a cross-sectional view of essential parts showing the structure for temporarily fixing chip components to a printed circuit board in a printed wiring body according to this invention, and FIGS. 3 to 6 are a printed wiring body 1 is a drawing showing a conventional example of a structure for temporarily fixing a chip component to a printed circuit board in a semiconductor device; 4...Chip part, 4a...Part body, 4b,
4b... Electrode, 5... Printed circuit board, 5a... Insulating board, 5b, 5b... Conductive land, 6, 6...
glue.
Claims (1)
定するプリント配線体に於いて、上記チツプ部品
をその電極が対面するプリント基板の導電ランド
の一部分に接着剤を塗布して仮固定したことを特
徴とするプリント配線体。 (2) 接着剤をチツプ部品に於ける最長距離に相
当する複数個所に選択的に塗布したことを特徴と
する上記実用新案登録請求の範囲第１項に記載す
るプリント配線体。 (3) 接着剤が導電性接着剤である実用新案登録
請求の範囲第１項及び第２項に記載するプリント
配線体。[Claims for Utility Model Registration] (1) In a printed wiring body in which a chip component is temporarily fixed to a printed circuit board with an adhesive, adhesive is applied to a part of the conductive land of the printed circuit board where the chip component faces its electrode. A printed wiring body characterized by being coated and temporarily fixed. (2) The printed wiring body according to claim 1 of the above-mentioned utility model registration claim, characterized in that adhesive is selectively applied to a plurality of locations corresponding to the longest distance in the chip component. (3) The printed wiring body described in claims 1 and 2 of the utility model registration claim, wherein the adhesive is a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14608485U JPS6255376U (en) | 1985-09-25 | 1985-09-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14608485U JPS6255376U (en) | 1985-09-25 | 1985-09-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6255376U true JPS6255376U (en) | 1987-04-06 |
Family
ID=31058222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14608485U Pending JPS6255376U (en) | 1985-09-25 | 1985-09-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6255376U (en) |
-
1985
- 1985-09-25 JP JP14608485U patent/JPS6255376U/ja active Pending
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