JPS6092614A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6092614A
JPS6092614A JP58201316A JP20131683A JPS6092614A JP S6092614 A JPS6092614 A JP S6092614A JP 58201316 A JP58201316 A JP 58201316A JP 20131683 A JP20131683 A JP 20131683A JP S6092614 A JPS6092614 A JP S6092614A
Authority
JP
Japan
Prior art keywords
substrate
opening
diffusion layer
manufacturing
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58201316A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0476208B2 (enrdf_load_stackoverflow
Inventor
Hideki Shibata
英毅 柴田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58201316A priority Critical patent/JPS6092614A/ja
Publication of JPS6092614A publication Critical patent/JPS6092614A/ja
Publication of JPH0476208B2 publication Critical patent/JPH0476208B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
JP58201316A 1983-10-27 1983-10-27 半導体装置の製造方法 Granted JPS6092614A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58201316A JPS6092614A (ja) 1983-10-27 1983-10-27 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58201316A JPS6092614A (ja) 1983-10-27 1983-10-27 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6092614A true JPS6092614A (ja) 1985-05-24
JPH0476208B2 JPH0476208B2 (enrdf_load_stackoverflow) 1992-12-03

Family

ID=16438984

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58201316A Granted JPS6092614A (ja) 1983-10-27 1983-10-27 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6092614A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4969295A (en) * 1988-08-08 1990-11-13 Mazda Motor Corporation Door structure of vehicle
JPH06216064A (ja) * 1993-01-18 1994-08-05 Nec Corp Ａｌコンタクト構造およびその製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53166222U (enrdf_load_stackoverflow) * 1977-06-01 1978-12-26
JPH0396234U (enrdf_load_stackoverflow) * 1990-01-23 1991-10-01
JP2006192961A (ja) * 2005-01-11 2006-07-27 Seirei Ind Co Ltd シート支持構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53166222U (enrdf_load_stackoverflow) * 1977-06-01 1978-12-26
JPH0396234U (enrdf_load_stackoverflow) * 1990-01-23 1991-10-01
JP2006192961A (ja) * 2005-01-11 2006-07-27 Seirei Ind Co Ltd シート支持構造

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4969295A (en) * 1988-08-08 1990-11-13 Mazda Motor Corporation Door structure of vehicle
JPH06216064A (ja) * 1993-01-18 1994-08-05 Nec Corp Ａｌコンタクト構造およびその製造方法

Also Published As

Publication number Publication date
JPH0476208B2 (enrdf_load_stackoverflow) 1992-12-03

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