JPS6088536U - 化合物半導体ウエハ - Google Patents
化合物半導体ウエハInfo
- Publication number
- JPS6088536U JPS6088536U JP1983181255U JP18125583U JPS6088536U JP S6088536 U JPS6088536 U JP S6088536U JP 1983181255 U JP1983181255 U JP 1983181255U JP 18125583 U JP18125583 U JP 18125583U JP S6088536 U JPS6088536 U JP S6088536U
- Authority
- JP
- Japan
- Prior art keywords
- compound semiconductor
- semiconductor wafer
- wafer
- corner
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000001875 compounds Chemical class 0.000 title claims description 4
- 239000004065 semiconductor Substances 0.000 title claims description 4
- 239000013078 crystal Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54493—Peripheral marks on wafers, e.g. orientation flats, notches, lot number
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/102—Mask alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12681—Ga-, In-, Tl- or Group VA metal-base component
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は長方形ウェハに本考案を実施した例を示す平面
図。第2図は長方形ウエノ1の実施例であるが隅部に丸
みを形成した例を示す平面図。第3図は正方形ウェハに
本考案を実施した例を示す平面図。Cは切欠きの長辺、
Dは切欠きの短辺を示す。第4図は正方形ウェハの他の
実施例で、楕円の1/4部分に当る切欠きを一隅に形成
した例を示す平面図。第5図は角形ウェハの一隅に標識
を付した実施例を示す平面図。第6図はIII−V族化
合物半導体単結晶ウェハの表面、裏面に於て、メサ方向
、逆メサ方向が互に直交するように発生している状態を
示す斜視図。 1・・・角形ウェハ、2・・・−隅に設けた切欠き、3
・・・−過の片面に付した標識。
図。第2図は長方形ウエノ1の実施例であるが隅部に丸
みを形成した例を示す平面図。第3図は正方形ウェハに
本考案を実施した例を示す平面図。Cは切欠きの長辺、
Dは切欠きの短辺を示す。第4図は正方形ウェハの他の
実施例で、楕円の1/4部分に当る切欠きを一隅に形成
した例を示す平面図。第5図は角形ウェハの一隅に標識
を付した実施例を示す平面図。第6図はIII−V族化
合物半導体単結晶ウェハの表面、裏面に於て、メサ方向
、逆メサ方向が互に直交するように発生している状態を
示す斜視図。 1・・・角形ウェハ、2・・・−隅に設けた切欠き、3
・・・−過の片面に付した標識。
Claims (1)
- ■−■族化合物半導体単結晶の角形ウエノ1に於て、ウ
ェハの一隅を切欠き、或は−隅の面上に標識を付した事
を特徴とする化合物半導体ウエノ1゜
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983181255U JPS6088536U (ja) | 1983-11-24 | 1983-11-24 | 化合物半導体ウエハ |
US06/672,882 US4632884A (en) | 1983-11-24 | 1984-11-19 | Marked single-crystal III-V group compound semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983181255U JPS6088536U (ja) | 1983-11-24 | 1983-11-24 | 化合物半導体ウエハ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6088536U true JPS6088536U (ja) | 1985-06-18 |
JPS6317244Y2 JPS6317244Y2 (ja) | 1988-05-16 |
Family
ID=16097499
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983181255U Granted JPS6088536U (ja) | 1983-11-24 | 1983-11-24 | 化合物半導体ウエハ |
Country Status (2)
Country | Link |
---|---|
US (1) | US4632884A (ja) |
JP (1) | JPS6088536U (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60125726U (ja) * | 1984-02-02 | 1985-08-24 | 住友電気工業株式会社 | 化合物半導体ミラ−ウエハ |
JPH07101679B2 (ja) * | 1988-11-01 | 1995-11-01 | 三菱電機株式会社 | 電子デバイス用ウエハ,ウエハ用棒状基材および電子デバイス |
US5593815A (en) * | 1989-07-31 | 1997-01-14 | Goldstar Co., Ltd. | Cleaving process in manufacturing a semiconductor laser |
US5792566A (en) * | 1996-07-02 | 1998-08-11 | American Xtal Technology | Single crystal wafers |
JP3580311B1 (ja) * | 2003-03-28 | 2004-10-20 | 住友電気工業株式会社 | 表裏識別した矩形窒化物半導体基板 |
US8389099B1 (en) | 2007-06-01 | 2013-03-05 | Rubicon Technology, Inc. | Asymmetrical wafer configurations and method for creating the same |
EP2168158B1 (en) | 2007-06-13 | 2013-06-05 | Conergy AG | Method for marking wafers |
CN101354228B (zh) * | 2008-09-24 | 2010-06-09 | 友达光电股份有限公司 | 基板辨识治具与基板的辨识方法 |
JP2010192697A (ja) * | 2009-02-18 | 2010-09-02 | Sumitomo Electric Ind Ltd | 炭化珪素基板および炭化珪素基板の製造方法 |
US8128830B2 (en) * | 2009-09-17 | 2012-03-06 | Hitachi Global Storage Technologies Netherlands, B.V. | Labeling an imprint lithography template |
JP2012049285A (ja) | 2010-08-26 | 2012-03-08 | Shin Etsu Chem Co Ltd | 太陽電池用基板及び太陽電池 |
CN103489752A (zh) * | 2013-09-26 | 2014-01-01 | 中国科学院半导体研究所 | 截面为多边形的晶棒及衬底片表面取向的标识方法 |
JP6645502B2 (ja) * | 2015-07-24 | 2020-02-14 | Agc株式会社 | ガラス基板、積層基板、積層基板の製造方法、積層体、梱包体、およびガラス基板の製造方法 |
CN108074834A (zh) * | 2018-01-08 | 2018-05-25 | 中国电子科技集团公司第四十六研究所 | 一种用于具有极性的异形晶片的极性面判定方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5123071A (en) * | 1974-08-20 | 1976-02-24 | Matsushita Electronics Corp | Handotaisochino seizoho |
JPS5562736A (en) * | 1978-11-01 | 1980-05-12 | Toshiba Corp | Mask material for preparation of semiconductor device |
JPS56131925A (en) * | 1980-03-19 | 1981-10-15 | Seiko Epson Corp | Shape of semiconductor wafer |
JPS57173931A (en) * | 1981-04-17 | 1982-10-26 | Toshiba Corp | Substrate for semiconductor device |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3844858A (en) * | 1968-12-31 | 1974-10-29 | Texas Instruments Inc | Process for controlling the thickness of a thin layer of semiconductor material and semiconductor substrate |
US3710101A (en) * | 1970-10-06 | 1973-01-09 | Westinghouse Electric Corp | Apparatus and method for alignment of members to electron beams |
US3783044A (en) * | 1971-04-09 | 1974-01-01 | Motorola Inc | Photoresist keys and depth indicator |
US3742315A (en) * | 1971-10-18 | 1973-06-26 | Matsushita Electronics Corp | Schottky barrier type semiconductor device with improved backward breakdown voltage characteristic |
CA1185013A (en) * | 1981-01-14 | 1985-04-02 | Kenji Ohta | Magneto-optic memory medium |
US4468857A (en) * | 1983-06-27 | 1984-09-04 | Teletype Corporation | Method of manufacturing an integrated circuit device |
-
1983
- 1983-11-24 JP JP1983181255U patent/JPS6088536U/ja active Granted
-
1984
- 1984-11-19 US US06/672,882 patent/US4632884A/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5123071A (en) * | 1974-08-20 | 1976-02-24 | Matsushita Electronics Corp | Handotaisochino seizoho |
JPS5562736A (en) * | 1978-11-01 | 1980-05-12 | Toshiba Corp | Mask material for preparation of semiconductor device |
JPS56131925A (en) * | 1980-03-19 | 1981-10-15 | Seiko Epson Corp | Shape of semiconductor wafer |
JPS57173931A (en) * | 1981-04-17 | 1982-10-26 | Toshiba Corp | Substrate for semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6317244Y2 (ja) | 1988-05-16 |
US4632884A (en) | 1986-12-30 |
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