JPS56131925A - Shape of semiconductor wafer - Google Patents

Shape of semiconductor wafer

Info

Publication number
JPS56131925A
JPS56131925A JP3493280A JP3493280A JPS56131925A JP S56131925 A JPS56131925 A JP S56131925A JP 3493280 A JP3493280 A JP 3493280A JP 3493280 A JP3493280 A JP 3493280A JP S56131925 A JPS56131925 A JP S56131925A
Authority
JP
Japan
Prior art keywords
shape
wafer
square
semiconductor wafer
crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3493280A
Other languages
Japanese (ja)
Inventor
Tatsuaki Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP3493280A priority Critical patent/JPS56131925A/en
Publication of JPS56131925A publication Critical patent/JPS56131925A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To improve wafer yielding ratio from a crystal and enlarge effective dimension for photomask, by making a shape of a semiconductor wafer a square. CONSTITUTION:A wafer shape 10 is to be a square. A square-shaped wafer can be easily obtained by cutting vertically to the side of ribbon like crystal body obtained from a dendritic lifting method for instance. When the crystal is of the shape of ribbon, wafer yielding ratio can be improved and effective dimension for photomask can be enlarged.
JP3493280A 1980-03-19 1980-03-19 Shape of semiconductor wafer Pending JPS56131925A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3493280A JPS56131925A (en) 1980-03-19 1980-03-19 Shape of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3493280A JPS56131925A (en) 1980-03-19 1980-03-19 Shape of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS56131925A true JPS56131925A (en) 1981-10-15

Family

ID=12427962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3493280A Pending JPS56131925A (en) 1980-03-19 1980-03-19 Shape of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS56131925A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6088536U (en) * 1983-11-24 1985-06-18 住友電気工業株式会社 compound semiconductor wafer
EP1463115A2 (en) * 2003-03-28 2004-09-29 Sumitomo Electric Industries, Ltd. Rectangular Nitride Compound Semiconductor Wafer with Obverse/Reverse Discriminative Marks

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6088536U (en) * 1983-11-24 1985-06-18 住友電気工業株式会社 compound semiconductor wafer
JPS6317244Y2 (en) * 1983-11-24 1988-05-16
EP1463115A2 (en) * 2003-03-28 2004-09-29 Sumitomo Electric Industries, Ltd. Rectangular Nitride Compound Semiconductor Wafer with Obverse/Reverse Discriminative Marks
EP1463115A3 (en) * 2003-03-28 2006-02-01 Sumitomo Electric Industries, Ltd. Rectangular Nitride Compound Semiconductor Wafer with Obverse/Reverse Discriminative Marks

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