JPS6088483A - 超電導集積回路の配線基板組立法 - Google Patents

超電導集積回路の配線基板組立法

Info

Publication number
JPS6088483A
JPS6088483A JP58196055A JP19605583A JPS6088483A JP S6088483 A JPS6088483 A JP S6088483A JP 58196055 A JP58196055 A JP 58196055A JP 19605583 A JP19605583 A JP 19605583A JP S6088483 A JPS6088483 A JP S6088483A
Authority
JP
Japan
Prior art keywords
integrated circuit
superconducting
chip
electrode
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58196055A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6260836B2 (enExample
Inventor
Mikio Hirano
幹夫 平野
Shinichiro Yano
振一郎 矢野
Ushio Kawabe
川辺　潮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP58196055A priority Critical patent/JPS6088483A/ja
Publication of JPS6088483A publication Critical patent/JPS6088483A/ja
Publication of JPS6260836B2 publication Critical patent/JPS6260836B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/524—Bond wires having multiple distinct cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Wire Bonding (AREA)
JP58196055A 1983-10-21 1983-10-21 超電導集積回路の配線基板組立法 Granted JPS6088483A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58196055A JPS6088483A (ja) 1983-10-21 1983-10-21 超電導集積回路の配線基板組立法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58196055A JPS6088483A (ja) 1983-10-21 1983-10-21 超電導集積回路の配線基板組立法

Publications (2)

Publication Number Publication Date
JPS6088483A true JPS6088483A (ja) 1985-05-18
JPS6260836B2 JPS6260836B2 (enExample) 1987-12-18

Family

ID=16351444

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58196055A Granted JPS6088483A (ja) 1983-10-21 1983-10-21 超電導集積回路の配線基板組立法

Country Status (1)

Country Link
JP (1) JPS6088483A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63228696A (ja) * 1987-03-18 1988-09-22 Hitachi Ltd 電子装置
US5041188A (en) * 1989-03-02 1991-08-20 Santa Barbara Research Center High temperature superconductor detector fabrication process
US5283465A (en) * 1987-08-13 1994-02-01 Semiconductor Energy Laboratory Co., Ltd. Superconducting lead on integrated circuit

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6569194B1 (en) 2000-12-28 2003-05-27 Advanced Cardiovascular Systems, Inc. Thermoelastic and superelastic Ni-Ti-W alloy
JP7126235B2 (ja) * 2017-02-10 2022-08-26 国立研究開発法人物質・材料研究機構 超伝導線材接合構造及びこれを用いた装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63228696A (ja) * 1987-03-18 1988-09-22 Hitachi Ltd 電子装置
US5283465A (en) * 1987-08-13 1994-02-01 Semiconductor Energy Laboratory Co., Ltd. Superconducting lead on integrated circuit
US5041188A (en) * 1989-03-02 1991-08-20 Santa Barbara Research Center High temperature superconductor detector fabrication process

Also Published As

Publication number Publication date
JPS6260836B2 (enExample) 1987-12-18

Similar Documents

Publication Publication Date Title
KR940001149B1 (ko) 반도체 장치의 칩 본딩 방법
US6822336B2 (en) Semiconductor device
EP0208494B1 (en) Method of fabricating a semiconductor apparatus comprising two semiconductor devices
US4360142A (en) Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate
JP3489811B2 (ja) 半導体デバイスの製造方法
CN103123916B (zh) 半导体器件、电子器件以及半导体器件制造方法
JP3337461B2 (ja) 高温超伝導体回路および他の脆い材料への高周波接続を形成させる方法
US20080258277A1 (en) Semiconductor Device Comprising a Semiconductor Chip Stack and Method for Producing the Same
JPS5831729B2 (ja) 接合方法
WO1993000703A1 (en) Fabricating electronic circuitry unit containing stacked ic layers having lead rerouting
JPH08213427A (ja) 半導体チップおよびマルチチップ半導体モジュール
EP3688797B1 (en) Under-bump metallization structure comprising superconducting material
US4290079A (en) Improved solder interconnection between a semiconductor device and a supporting substrate
JP2001110957A (ja) パワー半導体モジュールの製造方法
US5946597A (en) Semiconductor chip mounting method
JPS6088483A (ja) 超電導集積回路の配線基板組立法
JP3502056B2 (ja) 半導体装置およびこれを用いた積層構造体
JP3279470B2 (ja) 半導体装置およびその製造方法
US6930383B2 (en) Electronic component including a housing and a substrate
JP3284055B2 (ja) 半導体素子、半導体装置、および半導体装置の検査方法
JP3296344B2 (ja) 半導体装置およびその製造方法
JP2615744B2 (ja) 半田バンプの形成方法
JPH0158875B2 (enExample)
JPH10308415A (ja) 電極、電子部品、電子装置および電子部品の実装方法
JPH07226400A (ja) 半導体装置及びその製造方法