JPS6085548A - 集積回路装置 - Google Patents
集積回路装置Info
- Publication number
- JPS6085548A JPS6085548A JP58193798A JP19379883A JPS6085548A JP S6085548 A JPS6085548 A JP S6085548A JP 58193798 A JP58193798 A JP 58193798A JP 19379883 A JP19379883 A JP 19379883A JP S6085548 A JPS6085548 A JP S6085548A
- Authority
- JP
- Japan
- Prior art keywords
- film
- integrated circuit
- circuit device
- si3n4
- sio2
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W74/01—
-
- H10W72/00—
-
- H10W72/01515—
-
- H10W72/075—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
-
- H10W72/5522—
-
- H10W72/59—
-
- H10W72/952—
-
- H10W72/983—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58193798A JPS6085548A (ja) | 1983-10-17 | 1983-10-17 | 集積回路装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58193798A JPS6085548A (ja) | 1983-10-17 | 1983-10-17 | 集積回路装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6085548A true JPS6085548A (ja) | 1985-05-15 |
| JPH0219625B2 JPH0219625B2 (show.php) | 1990-05-02 |
Family
ID=16313950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58193798A Granted JPS6085548A (ja) | 1983-10-17 | 1983-10-17 | 集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6085548A (show.php) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6411337A (en) * | 1987-07-03 | 1989-01-13 | Nec Corp | Semiconductor device |
-
1983
- 1983-10-17 JP JP58193798A patent/JPS6085548A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6411337A (en) * | 1987-07-03 | 1989-01-13 | Nec Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0219625B2 (show.php) | 1990-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4472730A (en) | Semiconductor device having an improved moisture resistance | |
| KR940008373B1 (ko) | 반도체 장치의 제조방법 | |
| US4791465A (en) | Field effect transistor type semiconductor sensor and method of manufacturing the same | |
| JPS6085548A (ja) | 集積回路装置 | |
| JPS6140137B2 (show.php) | ||
| JPH0680695B2 (ja) | 半導体装置 | |
| US4974052A (en) | Plastic packaged semiconductor device | |
| JPS61102758A (ja) | 樹脂封止型半導体装置 | |
| JPS63216352A (ja) | 半導体装置の製造方法 | |
| JPS61148824A (ja) | 半導体装置の製造方法 | |
| JPS62245655A (ja) | 半導体装置 | |
| JPH04318944A (ja) | 樹脂封止型半導体装置 | |
| JPS62219541A (ja) | 半導体装置 | |
| JP2751274B2 (ja) | 半導体装置 | |
| JPS5974651A (ja) | 半導体装置 | |
| JPS58166748A (ja) | 半導体装置 | |
| JPS60140739A (ja) | パツシベ−シヨン構造を備えたプラスチツクicパツケ−ジ | |
| JPH06349814A (ja) | 半導体集積回路装置 | |
| JPS5949687B2 (ja) | 半導体装置 | |
| JPH08167634A (ja) | 半導体装置 | |
| JPS59119862A (ja) | 半導体装置 | |
| JPS62217624A (ja) | 半導体装置のボンデイング構造およびその製造方法 | |
| JPH035657B2 (show.php) | ||
| JPS643340B2 (show.php) | ||
| JPH0277131A (ja) | 樹脂封止型半導体装置 |