JPS6079760A - リードフレームへの異種部分メツキ方法 - Google Patents

リードフレームへの異種部分メツキ方法

Info

Publication number
JPS6079760A
JPS6079760A JP58109884A JP10988483A JPS6079760A JP S6079760 A JPS6079760 A JP S6079760A JP 58109884 A JP58109884 A JP 58109884A JP 10988483 A JP10988483 A JP 10988483A JP S6079760 A JPS6079760 A JP S6079760A
Authority
JP
Japan
Prior art keywords
plating
partial
peeling
silver
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58109884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS64818B2 (index.php
Inventor
Tetsuya Hojo
徹也 北城
Akisuke Fujiwara
藤原　章祐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Plant Kogyo Kk
Original Assignee
Fuji Plant Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Plant Kogyo Kk filed Critical Fuji Plant Kogyo Kk
Priority to JP58109884A priority Critical patent/JPS6079760A/ja
Publication of JPS6079760A publication Critical patent/JPS6079760A/ja
Publication of JPS64818B2 publication Critical patent/JPS64818B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/04—
    • H10W70/457—
    • H10W72/073—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/884—
    • H10W72/952—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58109884A 1983-06-17 1983-06-17 リードフレームへの異種部分メツキ方法 Granted JPS6079760A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58109884A JPS6079760A (ja) 1983-06-17 1983-06-17 リードフレームへの異種部分メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58109884A JPS6079760A (ja) 1983-06-17 1983-06-17 リードフレームへの異種部分メツキ方法

Publications (2)

Publication Number Publication Date
JPS6079760A true JPS6079760A (ja) 1985-05-07
JPS64818B2 JPS64818B2 (index.php) 1989-01-09

Family

ID=14521601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58109884A Granted JPS6079760A (ja) 1983-06-17 1983-06-17 リードフレームへの異種部分メツキ方法

Country Status (1)

Country Link
JP (1) JPS6079760A (index.php)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63291445A (ja) * 1987-05-23 1988-11-29 Fuji Plant Kogyo Kk リ−ドフレ−ムへの２色部分メッキ方法
JPH04255258A (ja) * 1991-02-07 1992-09-10 Nec Kyushu Ltd リードフレームの製造方法
US6210548B1 (en) 1998-03-26 2001-04-03 Sumitomo Metal Mining Co., Ltd. Apparatus for partially removing plating films of leadframe

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2749107B2 (ja) * 1989-03-20 1998-05-13 株式会社日立製作所 光ヘッド

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63291445A (ja) * 1987-05-23 1988-11-29 Fuji Plant Kogyo Kk リ−ドフレ−ムへの２色部分メッキ方法
JPH04255258A (ja) * 1991-02-07 1992-09-10 Nec Kyushu Ltd リードフレームの製造方法
US6210548B1 (en) 1998-03-26 2001-04-03 Sumitomo Metal Mining Co., Ltd. Apparatus for partially removing plating films of leadframe

Also Published As

Publication number Publication date
JPS64818B2 (index.php) 1989-01-09

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