JPS6077421A - 位置合わせ方法 - Google Patents
位置合わせ方法Info
- Publication number
- JPS6077421A JPS6077421A JP58186150A JP18615083A JPS6077421A JP S6077421 A JPS6077421 A JP S6077421A JP 58186150 A JP58186150 A JP 58186150A JP 18615083 A JP18615083 A JP 18615083A JP S6077421 A JPS6077421 A JP S6077421A
- Authority
- JP
- Japan
- Prior art keywords
- alignment
- pattern
- mask
- pattern image
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58186150A JPS6077421A (ja) | 1983-10-05 | 1983-10-05 | 位置合わせ方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58186150A JPS6077421A (ja) | 1983-10-05 | 1983-10-05 | 位置合わせ方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6077421A true JPS6077421A (ja) | 1985-05-02 |
JPH0144009B2 JPH0144009B2 (enrdf_load_stackoverflow) | 1989-09-25 |
Family
ID=16183252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58186150A Granted JPS6077421A (ja) | 1983-10-05 | 1983-10-05 | 位置合わせ方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6077421A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60160122A (ja) * | 1984-01-30 | 1985-08-21 | Rohm Co Ltd | サーマルプリントヘッドの製造方法 |
WO1997008588A1 (en) * | 1995-08-23 | 1997-03-06 | Micrel, Inc. | Mask structure having offset patterns for alignment |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59208722A (ja) * | 1983-05-13 | 1984-11-27 | Oki Electric Ind Co Ltd | 半導体集積回路装置用合せマ−ク |
-
1983
- 1983-10-05 JP JP58186150A patent/JPS6077421A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59208722A (ja) * | 1983-05-13 | 1984-11-27 | Oki Electric Ind Co Ltd | 半導体集積回路装置用合せマ−ク |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60160122A (ja) * | 1984-01-30 | 1985-08-21 | Rohm Co Ltd | サーマルプリントヘッドの製造方法 |
WO1997008588A1 (en) * | 1995-08-23 | 1997-03-06 | Micrel, Inc. | Mask structure having offset patterns for alignment |
US5747200A (en) * | 1995-08-23 | 1998-05-05 | Micrel, Incorporated | Mask structure having offset patterns for alignment |
Also Published As
Publication number | Publication date |
---|---|
JPH0144009B2 (enrdf_load_stackoverflow) | 1989-09-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6861186B1 (en) | Method for backside alignment of photo-processes using standard front side alignment tools | |
US4397543A (en) | Mask for imaging a pattern of a photoresist layer, method of making said mask, and use thereof in a photolithographic process | |
US4610948A (en) | Electron beam peripheral patterning of integrated circuits | |
US4547446A (en) | Motion measurement and alignment method and apparatus | |
JPS5968928A (ja) | 半導体装置の製造方法 | |
JPH11191530A (ja) | アライメントマーク装置 | |
JPS6077421A (ja) | 位置合わせ方法 | |
TW200304669A (en) | Multi-exposure lithography method and system providing increased overlay accuracy | |
TW390978B (en) | Method of inspecting the mask pattern by use of vernier with separate exposure alignment | |
CN114706277A (zh) | 一种套刻匹配方法 | |
JP2647835B2 (ja) | ウェハーの露光方法 | |
JP2003248329A (ja) | 半導体装置及びその製造方法 | |
JPS63275115A (ja) | 半導体装置のパタ−ン形成方法 | |
JPH0864520A (ja) | レチクルの回転誤差測定用のレチクルおよび方法 | |
JPS588132B2 (ja) | 集積回路製造方法 | |
JPS6244740A (ja) | パタ−ン形成方法 | |
JPS63107023A (ja) | 縮小投影露光装置 | |
US20070072128A1 (en) | Method of manufacturing an integrated circuit to obtain uniform exposure in a photolithographic process | |
JP2000305276A (ja) | 露光方法および装置 | |
JP2596415B2 (ja) | 半導体装置の製造方法 | |
JPH03180017A (ja) | 半導体装置の製造方法 | |
CN115903393A (zh) | 套刻误差测量方法和设备及半导体器件制造方法 | |
JPH05134387A (ja) | 位相シフトマスクの構造、露光方式、露光装置及び半導体装置 | |
JPS593924A (ja) | 被転写パタ−ンを有する基板とウエハの位置合わせ方法 | |
JPS6215854B2 (enrdf_load_stackoverflow) |