JPS6076150A - 半導体装置の金属パツケ−ジ - Google Patents

半導体装置の金属パツケ−ジ

Info

Publication number
JPS6076150A
JPS6076150A JP58184850A JP18485083A JPS6076150A JP S6076150 A JPS6076150 A JP S6076150A JP 58184850 A JP58184850 A JP 58184850A JP 18485083 A JP18485083 A JP 18485083A JP S6076150 A JPS6076150 A JP S6076150A
Authority
JP
Japan
Prior art keywords
section
diameter
small
large diameter
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58184850A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0160947B2 (OSRAM
Inventor
Yukio Saito
幸夫 斎藤
Akira Isono
磯野　彰
Shigenobu Aihara
相原　重信
Kazuo Hataki
畑木　和男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58184850A priority Critical patent/JPS6076150A/ja
Publication of JPS6076150A publication Critical patent/JPS6076150A/ja
Publication of JPH0160947B2 publication Critical patent/JPH0160947B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58184850A 1983-10-03 1983-10-03 半導体装置の金属パツケ−ジ Granted JPS6076150A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58184850A JPS6076150A (ja) 1983-10-03 1983-10-03 半導体装置の金属パツケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58184850A JPS6076150A (ja) 1983-10-03 1983-10-03 半導体装置の金属パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS6076150A true JPS6076150A (ja) 1985-04-30
JPH0160947B2 JPH0160947B2 (OSRAM) 1989-12-26

Family

ID=16160396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58184850A Granted JPS6076150A (ja) 1983-10-03 1983-10-03 半導体装置の金属パツケ−ジ

Country Status (1)

Country Link
JP (1) JPS6076150A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4951011A (en) * 1986-07-24 1990-08-21 Harris Corporation Impedance matched plug-in package for high speed microwave integrated circuits
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4951011A (en) * 1986-07-24 1990-08-21 Harris Corporation Impedance matched plug-in package for high speed microwave integrated circuits
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages

Also Published As

Publication number Publication date
JPH0160947B2 (OSRAM) 1989-12-26

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