JPS6068614A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6068614A
JPS6068614A JP17724583A JP17724583A JPS6068614A JP S6068614 A JPS6068614 A JP S6068614A JP 17724583 A JP17724583 A JP 17724583A JP 17724583 A JP17724583 A JP 17724583A JP S6068614 A JPS6068614 A JP S6068614A
Authority
JP
Japan
Prior art keywords
silicon
aluminum
layer
wiring layer
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17724583A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0441510B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Hajime Kamioka
上岡　元
Kazunari Shirai
白井　一成
Shigeo Kashiwagi
柏木　茂雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17724583A priority Critical patent/JPS6068614A/ja
Publication of JPS6068614A publication Critical patent/JPS6068614A/ja
Publication of JPH0441510B2 publication Critical patent/JPH0441510B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
JP17724583A 1983-09-26 1983-09-26 半導体装置の製造方法 Granted JPS6068614A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17724583A JPS6068614A (ja) 1983-09-26 1983-09-26 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17724583A JPS6068614A (ja) 1983-09-26 1983-09-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6068614A true JPS6068614A (ja) 1985-04-19
JPH0441510B2 JPH0441510B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-07-08

Family

ID=16027687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17724583A Granted JPS6068614A (ja) 1983-09-26 1983-09-26 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6068614A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5843843A (en) * 1992-09-07 1998-12-01 Samsung Electronics Co., Ltd. Method for forming a wiring layer a semiconductor device
US5843842A (en) * 1991-07-08 1998-12-01 Samsung Electronics Co., Ltd. Method for manufacturing a semiconductor device having a wiring layer without producing silicon precipitates

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186357A (en) * 1981-05-11 1982-11-16 Yamagata Nippon Denki Kk Semiconductor element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186357A (en) * 1981-05-11 1982-11-16 Yamagata Nippon Denki Kk Semiconductor element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5843842A (en) * 1991-07-08 1998-12-01 Samsung Electronics Co., Ltd. Method for manufacturing a semiconductor device having a wiring layer without producing silicon precipitates
DE4222142B4 (de) * 1991-07-08 2006-08-03 Samsung Electronics Co., Ltd., Suwon Halbleiterbauelement mit einer Verdrahtungsschicht und Verfahren zu dessen Herstellung
US5843843A (en) * 1992-09-07 1998-12-01 Samsung Electronics Co., Ltd. Method for forming a wiring layer a semiconductor device

Also Published As

Publication number Publication date
JPH0441510B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-07-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees