JPS6064454A - チツプキヤリアおよびその製造方法 - Google Patents

チツプキヤリアおよびその製造方法

Info

Publication number
JPS6064454A
JPS6064454A JP58172603A JP17260383A JPS6064454A JP S6064454 A JPS6064454 A JP S6064454A JP 58172603 A JP58172603 A JP 58172603A JP 17260383 A JP17260383 A JP 17260383A JP S6064454 A JPS6064454 A JP S6064454A
Authority
JP
Japan
Prior art keywords
package
metal plate
conductive path
chip
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58172603A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6352469B2 (cs
Inventor
Tomoji Watanabe
智司 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamamoto Seisakusho Inc
Original Assignee
Yamamoto Seisakusho Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamamoto Seisakusho Inc filed Critical Yamamoto Seisakusho Inc
Priority to JP58172603A priority Critical patent/JPS6064454A/ja
Publication of JPS6064454A publication Critical patent/JPS6064454A/ja
Publication of JPS6352469B2 publication Critical patent/JPS6352469B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58172603A 1983-09-19 1983-09-19 チツプキヤリアおよびその製造方法 Granted JPS6064454A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58172603A JPS6064454A (ja) 1983-09-19 1983-09-19 チツプキヤリアおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58172603A JPS6064454A (ja) 1983-09-19 1983-09-19 チツプキヤリアおよびその製造方法

Publications (2)

Publication Number Publication Date
JPS6064454A true JPS6064454A (ja) 1985-04-13
JPS6352469B2 JPS6352469B2 (cs) 1988-10-19

Family

ID=15944917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58172603A Granted JPS6064454A (ja) 1983-09-19 1983-09-19 チツプキヤリアおよびその製造方法

Country Status (1)

Country Link
JP (1) JPS6064454A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63246852A (ja) * 1987-04-02 1988-10-13 Ibiden Co Ltd 半導体塔載用基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63246852A (ja) * 1987-04-02 1988-10-13 Ibiden Co Ltd 半導体塔載用基板の製造方法

Also Published As

Publication number Publication date
JPS6352469B2 (cs) 1988-10-19

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