JPS6055655A - 梁構造体を有する半導体装置 - Google Patents

梁構造体を有する半導体装置

Info

Publication number
JPS6055655A
JPS6055655A JP58163270A JP16327083A JPS6055655A JP S6055655 A JPS6055655 A JP S6055655A JP 58163270 A JP58163270 A JP 58163270A JP 16327083 A JP16327083 A JP 16327083A JP S6055655 A JPS6055655 A JP S6055655A
Authority
JP
Japan
Prior art keywords
movable beam
semiconductor device
film
polysilicon
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58163270A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0114711B2 (enExample
Inventor
Shigeo Hoshino
重夫 星野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Motor Co Ltd
Original Assignee
Nissan Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Motor Co Ltd filed Critical Nissan Motor Co Ltd
Priority to JP58163270A priority Critical patent/JPS6055655A/ja
Priority to US06/646,166 priority patent/US4571661A/en
Priority to DE8484110517T priority patent/DE3483764D1/de
Priority to EP84110517A priority patent/EP0138023B1/en
Publication of JPS6055655A publication Critical patent/JPS6055655A/ja
Publication of JPH0114711B2 publication Critical patent/JPH0114711B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0828—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type being suspended at one of its longitudinal ends
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Weting (AREA)
JP58163270A 1983-09-07 1983-09-07 梁構造体を有する半導体装置 Granted JPS6055655A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP58163270A JPS6055655A (ja) 1983-09-07 1983-09-07 梁構造体を有する半導体装置
US06/646,166 US4571661A (en) 1983-09-07 1984-08-31 Semiconductor vibration detection device with lever structure
DE8484110517T DE3483764D1 (de) 1983-09-07 1984-09-04 Halbleiter-schwingungs-detektor-anordnung in hebelbauweise.
EP84110517A EP0138023B1 (en) 1983-09-07 1984-09-04 Semiconductor vibration detection device with lever structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58163270A JPS6055655A (ja) 1983-09-07 1983-09-07 梁構造体を有する半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60120366A Division JPS61105861A (ja) 1985-06-05 1985-06-05 梁構造体を有する半導体装置

Publications (2)

Publication Number Publication Date
JPS6055655A true JPS6055655A (ja) 1985-03-30
JPH0114711B2 JPH0114711B2 (enExample) 1989-03-14

Family

ID=15770613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58163270A Granted JPS6055655A (ja) 1983-09-07 1983-09-07 梁構造体を有する半導体装置

Country Status (4)

Country Link
US (1) US4571661A (enExample)
EP (1) EP0138023B1 (enExample)
JP (1) JPS6055655A (enExample)
DE (1) DE3483764D1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234064A (ja) * 1985-04-10 1986-10-18 Nissan Motor Co Ltd 半導体振動検出装置
JP2001504994A (ja) * 1996-11-22 2001-04-10 シーメンス アクチエンゲゼルシヤフト マイクロメカニカル機能素子の製造方法
JP2003531017A (ja) * 2000-02-10 2003-10-21 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング マイクロマシーニング構造素子の製造法および該方法により製造された構造素子
JP2009153203A (ja) * 2000-08-11 2009-07-09 Knowles Electronics Llc 小型ブロードバンド変換器
US7578162B2 (en) 1989-12-28 2009-08-25 Kazuhiro Okada Apparatus for detecting a physical quantity acting as an external force and method for testing and manufacturing this apparatus

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6197572A (ja) * 1984-10-19 1986-05-16 Nissan Motor Co Ltd 半導体加速度センサの製造方法
US4812888A (en) * 1984-11-11 1989-03-14 Cornell Research Foundation, Inc. Suspended gate field effect semiconductor pressure transducer device
US4674319A (en) * 1985-03-20 1987-06-23 The Regents Of The University Of California Integrated circuit sensor
DE3515349A1 (de) * 1985-04-27 1986-10-30 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Elektrischer geber zur messung mechanischer groessen
FR2599833B1 (fr) * 1986-06-10 1992-02-14 Metravib Sa Capteur de grandeurs mecaniques integre sur silicium et procede de fabrication
US4948757A (en) * 1987-04-13 1990-08-14 General Motors Corporation Method for fabricating three-dimensional microstructures and a high-sensitivity integrated vibration sensor using such microstructures
US5343064A (en) * 1988-03-18 1994-08-30 Spangler Leland J Fully integrated single-crystal silicon-on-insulator process, sensors and circuits
US4996627A (en) * 1989-01-30 1991-02-26 Dresser Industries, Inc. High sensitivity miniature pressure transducer
DE4000903C1 (enExample) * 1990-01-15 1990-08-09 Robert Bosch Gmbh, 7000 Stuttgart, De
US6314823B1 (en) * 1991-09-20 2001-11-13 Kazuhiro Okada Force detector and acceleration detector and method of manufacturing the same
US5421213A (en) * 1990-10-12 1995-06-06 Okada; Kazuhiro Multi-dimensional force detector
FR2700065B1 (fr) * 1992-12-28 1995-02-10 Commissariat Energie Atomique Procédé de fabrication d'accéléromètres utilisant la technologie silicium sur isolant.
JP3213945B2 (ja) * 1993-08-03 2001-10-02 株式会社デンソー ノックセンサ
US5635629A (en) * 1993-08-03 1997-06-03 Nippondenso Co., Ltd. Knock sensor
JP3385688B2 (ja) * 1993-12-13 2003-03-10 株式会社デンソー 半導体ヨーレートセンサおよびその製造方法
DE4445553A1 (de) * 1993-12-21 1995-06-22 Nippon Denso Co Halbleiterbeschleunigungssensor
US5508231A (en) * 1994-03-07 1996-04-16 National Semiconductor Corporation Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits
JP3435844B2 (ja) * 1994-03-07 2003-08-11 株式会社デンソー 半導体加速度センサ及びその製造方法
JP3269274B2 (ja) * 1994-03-15 2002-03-25 株式会社デンソー 加速度センサ
US5578843A (en) * 1994-10-06 1996-11-26 Kavlico Corporation Semiconductor sensor with a fusion bonded flexible structure
JP3435850B2 (ja) * 1994-10-28 2003-08-11 株式会社デンソー 半導体力学量センサ及びその製造方法
US5550090A (en) * 1995-09-05 1996-08-27 Motorola Inc. Method for fabricating a monolithic semiconductor device with integrated surface micromachined structures
US5942791A (en) * 1996-03-06 1999-08-24 Gec-Marconi Limited Micromachined devices having microbridge structure
GB9604786D0 (en) * 1996-03-06 1996-09-25 Marconi Gec Ltd Micromachined devices
JPH102912A (ja) * 1996-06-14 1998-01-06 Mitsubishi Electric Corp 半導体加速度センサおよびその製造方法
US5966617A (en) * 1996-09-20 1999-10-12 Kavlico Corporation Multiple local oxidation for surface micromachining
RU2123220C1 (ru) * 1996-10-07 1998-12-10 Научно-производственный комплекс "Технологический центр" Способ изготовления интегрального датчика
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US6552469B1 (en) * 1998-06-05 2003-04-22 Knowles Electronics, Llc Solid state transducer for converting between an electrical signal and sound
US6091125A (en) * 1998-12-02 2000-07-18 Northeastern University Micromechanical electronic device
US6651504B1 (en) 1999-09-16 2003-11-25 Ut-Battelle, Llc Acoustic sensors using microstructures tunable with energy other than acoustic energy
US6710417B2 (en) * 2001-09-27 2004-03-23 Seagate Technology Llc Armor coated MEMS devices
KR100419233B1 (ko) * 2002-03-11 2004-02-21 삼성전자주식회사 멤스소자 및 그의 제작방법
US6767751B2 (en) * 2002-05-28 2004-07-27 Silicon Light Machines, Inc. Integrated driver process flow
EP1445670A1 (fr) 2003-02-06 2004-08-11 ETA SA Manufacture Horlogère Suisse Spiral de résonateur balancier-spiral et son procédé de fabrication
JP2007111831A (ja) * 2005-10-21 2007-05-10 Seiko Epson Corp Ｍｅｍｓ素子の製造方法およびｍｅｍｓ素子
EP1818736A1 (fr) * 2006-02-09 2007-08-15 The Swatch Group Research and Development Ltd. Virole anti-choc
EP2105807B1 (fr) * 2008-03-28 2015-12-02 Montres Breguet SA Spiral à élévation de courbe monobloc et son procédé de fabrication
JP6604626B2 (ja) * 2015-08-21 2019-11-13 国立大学法人東北大学 検出装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3738880A (en) * 1971-06-23 1973-06-12 Rca Corp Method of making a semiconductor device
FR2143553B1 (enExample) * 1971-06-29 1974-05-31 Sescosem
GB1417170A (en) * 1972-12-22 1975-12-10 Mullard Ltd Methods of manufacturing semiconductor devices
US4035198A (en) * 1976-06-30 1977-07-12 International Business Machines Corporation Method of fabricating field effect transistors having self-registering electrical connections between gate electrodes and metallic interconnection lines, and fabrication of integrated circuits containing the transistors
US4312680A (en) * 1980-03-31 1982-01-26 Rca Corporation Method of manufacturing submicron channel transistors
US4395438A (en) * 1980-09-08 1983-07-26 Amdahl Corporation Low pressure chemical vapor deposition of silicon nitride films

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234064A (ja) * 1985-04-10 1986-10-18 Nissan Motor Co Ltd 半導体振動検出装置
US4672849A (en) * 1985-04-10 1987-06-16 Nissan Motor Co., Ltd. Semiconductor vibration detecting structure
US7578162B2 (en) 1989-12-28 2009-08-25 Kazuhiro Okada Apparatus for detecting a physical quantity acting as an external force and method for testing and manufacturing this apparatus
JP2001504994A (ja) * 1996-11-22 2001-04-10 シーメンス アクチエンゲゼルシヤフト マイクロメカニカル機能素子の製造方法
JP2003531017A (ja) * 2000-02-10 2003-10-21 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング マイクロマシーニング構造素子の製造法および該方法により製造された構造素子
JP4838476B2 (ja) * 2000-02-10 2011-12-14 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング マイクロマシーニング構造素子の製造法および該方法により製造された構造素子
JP2009153203A (ja) * 2000-08-11 2009-07-09 Knowles Electronics Llc 小型ブロードバンド変換器

Also Published As

Publication number Publication date
EP0138023A3 (en) 1986-11-20
DE3483764D1 (de) 1991-01-31
JPH0114711B2 (enExample) 1989-03-14
EP0138023B1 (en) 1990-12-19
EP0138023A2 (en) 1985-04-24
US4571661A (en) 1986-02-18

Similar Documents

Publication Publication Date Title
JPS6055655A (ja) 梁構造体を有する半導体装置
EP0400939B1 (en) Semiconductor sensor with vibrating element
US5195371A (en) Semiconductor chip transducer
JP3367113B2 (ja) 加速度センサ
US5576250A (en) Process for the production of accelerometers using silicon on insulator technology
US7067344B1 (en) Method of manufacturing an external force detection sensor
US20050101047A1 (en) Process of making an all-silicon microphone
JPH077160A (ja) 一体型圧力変換器の製造方法および装置
JP2000155030A (ja) 角速度センサの製造方法
JP3173502B2 (ja) 可動部を有する半導体装置の処理方法
US6718824B2 (en) Semiconductor dynamic quantity detecting sensor and manufacturing method of the same
JP5122888B2 (ja) 発振子、発振子の製造方法、及び発振器
JPH10163505A (ja) 半導体慣性センサ及びその製造方法
JP4532787B2 (ja) コンデンサ型マイクロホンおよび圧力センサ
JPH10270719A (ja) 半導体慣性センサ及びその製造方法
JP2000022168A (ja) 半導体加速度センサ及びその製造方法
JPH10270718A (ja) 半導体慣性センサの製造方法
JPH10178183A (ja) 半導体慣性センサ及びその製造方法
JPS61105861A (ja) 梁構造体を有する半導体装置
JPS61212052A (ja) 梁構造体を有する半導体装置
JP2000065854A (ja) 半導体加速度センサ素子及びその製造方法
JP3405222B2 (ja) 半導体加速度センサ素子及びその製造方法
JPH0797644B2 (ja) 半導体加速度センサ及びその製造方法
JP3638469B2 (ja) 半導体加速度センサ
JPH11340189A (ja) マイクロマシン製造における凹部又は貫通孔の形成方法