JPS605550A - 電子部品 - Google Patents

電子部品

Info

Publication number
JPS605550A
JPS605550A JP11281383A JP11281383A JPS605550A JP S605550 A JPS605550 A JP S605550A JP 11281383 A JP11281383 A JP 11281383A JP 11281383 A JP11281383 A JP 11281383A JP S605550 A JPS605550 A JP S605550A
Authority
JP
Japan
Prior art keywords
alloy
solder
lead frame
weight
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11281383A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6349380B2 (enrdf_load_stackoverflow
Inventor
Michihiko Inaba
道彦 稲葉
Koichi Tejima
手島　光一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP11281383A priority Critical patent/JPS605550A/ja
Publication of JPS605550A publication Critical patent/JPS605550A/ja
Publication of JPS6349380B2 publication Critical patent/JPS6349380B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Conductive Materials (AREA)
  • Die Bonding (AREA)
JP11281383A 1983-06-24 1983-06-24 電子部品 Granted JPS605550A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11281383A JPS605550A (ja) 1983-06-24 1983-06-24 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11281383A JPS605550A (ja) 1983-06-24 1983-06-24 電子部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP31226487A Division JPS63158859A (ja) 1987-12-11 1987-12-11 電子部品

Publications (2)

Publication Number Publication Date
JPS605550A true JPS605550A (ja) 1985-01-12
JPS6349380B2 JPS6349380B2 (enrdf_load_stackoverflow) 1988-10-04

Family

ID=14596170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11281383A Granted JPS605550A (ja) 1983-06-24 1983-06-24 電子部品

Country Status (1)

Country Link
JP (1) JPS605550A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6299429A (ja) * 1985-10-25 1987-05-08 Kobe Steel Ltd 剪断加工性に優れるリ−ドフレ−ム材
JPS63158859A (ja) * 1987-12-11 1988-07-01 Toshiba Corp 電子部品
JP2013258355A (ja) * 2012-06-14 2013-12-26 Denso Corp 電子装置
JP2014007227A (ja) * 2012-06-22 2014-01-16 Murata Mfg Co Ltd 電子部品モジュールおよびその製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5654376A (en) * 1979-10-11 1981-05-14 Hitachi Medical Corp Scanning type scintillation camera
JPS575836A (en) * 1980-06-16 1982-01-12 Nippon Mining Co Ltd High strength copper alloy having excellent heat resistance for use as conductive material
JPS5768061A (en) * 1980-10-15 1982-04-26 Furukawa Electric Co Ltd:The Lead material for semiconductor device
JPS5793555A (en) * 1980-12-02 1982-06-10 Tamagawa Kikai Kinzoku Kk Lead material for semiconductor
JPS59153853A (ja) * 1983-02-21 1984-09-01 Hitachi Metals Ltd リ−ドフレ−ム材

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5654376A (en) * 1979-10-11 1981-05-14 Hitachi Medical Corp Scanning type scintillation camera
JPS575836A (en) * 1980-06-16 1982-01-12 Nippon Mining Co Ltd High strength copper alloy having excellent heat resistance for use as conductive material
JPS5768061A (en) * 1980-10-15 1982-04-26 Furukawa Electric Co Ltd:The Lead material for semiconductor device
JPS5793555A (en) * 1980-12-02 1982-06-10 Tamagawa Kikai Kinzoku Kk Lead material for semiconductor
JPS59153853A (ja) * 1983-02-21 1984-09-01 Hitachi Metals Ltd リ−ドフレ−ム材

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6299429A (ja) * 1985-10-25 1987-05-08 Kobe Steel Ltd 剪断加工性に優れるリ−ドフレ−ム材
JPS63158859A (ja) * 1987-12-11 1988-07-01 Toshiba Corp 電子部品
JP2013258355A (ja) * 2012-06-14 2013-12-26 Denso Corp 電子装置
JP2014007227A (ja) * 2012-06-22 2014-01-16 Murata Mfg Co Ltd 電子部品モジュールおよびその製造方法

Also Published As

Publication number Publication date
JPS6349380B2 (enrdf_load_stackoverflow) 1988-10-04

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