JPS605537A - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法Info
- Publication number
- JPS605537A JPS605537A JP59094203A JP9420384A JPS605537A JP S605537 A JPS605537 A JP S605537A JP 59094203 A JP59094203 A JP 59094203A JP 9420384 A JP9420384 A JP 9420384A JP S605537 A JPS605537 A JP S605537A
- Authority
- JP
- Japan
- Prior art keywords
- monitoring
- oxidized film
- region
- covered
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P74/00—
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59094203A JPS605537A (ja) | 1984-05-11 | 1984-05-11 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59094203A JPS605537A (ja) | 1984-05-11 | 1984-05-11 | 半導体装置の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50145473A Division JPS5268376A (en) | 1975-12-05 | 1975-12-05 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS605537A true JPS605537A (ja) | 1985-01-12 |
| JPS6310579B2 JPS6310579B2 (enExample) | 1988-03-08 |
Family
ID=14103741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59094203A Granted JPS605537A (ja) | 1984-05-11 | 1984-05-11 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS605537A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63220537A (ja) * | 1987-03-09 | 1988-09-13 | Nec Corp | 半導体基板 |
| US4992850A (en) * | 1989-02-15 | 1991-02-12 | Micron Technology, Inc. | Directly bonded simm module |
| US4992849A (en) * | 1989-02-15 | 1991-02-12 | Micron Technology, Inc. | Directly bonded board multiple integrated circuit module |
| US4992767A (en) * | 1989-02-03 | 1991-02-12 | Hitachi Metals, Ltd. | Magnet roll |
| US5236857A (en) * | 1991-10-30 | 1993-08-17 | Texas Instruments Incorporated | Resistor structure and process |
| USRE36325E (en) * | 1988-09-30 | 1999-10-05 | Micron Technology, Inc. | Directly bonded SIMM module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492485A (enExample) * | 1972-04-19 | 1974-01-10 |
-
1984
- 1984-05-11 JP JP59094203A patent/JPS605537A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS492485A (enExample) * | 1972-04-19 | 1974-01-10 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63220537A (ja) * | 1987-03-09 | 1988-09-13 | Nec Corp | 半導体基板 |
| USRE36325E (en) * | 1988-09-30 | 1999-10-05 | Micron Technology, Inc. | Directly bonded SIMM module |
| US4992767A (en) * | 1989-02-03 | 1991-02-12 | Hitachi Metals, Ltd. | Magnet roll |
| US4992850A (en) * | 1989-02-15 | 1991-02-12 | Micron Technology, Inc. | Directly bonded simm module |
| US4992849A (en) * | 1989-02-15 | 1991-02-12 | Micron Technology, Inc. | Directly bonded board multiple integrated circuit module |
| US5236857A (en) * | 1991-10-30 | 1993-08-17 | Texas Instruments Incorporated | Resistor structure and process |
| US5465005A (en) * | 1991-10-30 | 1995-11-07 | Texas Instruments Incorporated | Polysilicon resistor structure including polysilicon contacts |
| US6261915B1 (en) | 1991-10-30 | 2001-07-17 | Texas Instruments Incorporated | Process of making polysilicon resistor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6310579B2 (enExample) | 1988-03-08 |
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