JPS6053083A - 不揮発性メモリの製造方法 - Google Patents
不揮発性メモリの製造方法Info
- Publication number
- JPS6053083A JPS6053083A JP58160360A JP16036083A JPS6053083A JP S6053083 A JPS6053083 A JP S6053083A JP 58160360 A JP58160360 A JP 58160360A JP 16036083 A JP16036083 A JP 16036083A JP S6053083 A JPS6053083 A JP S6053083A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- drain
- high concentration
- channel
- concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
Landscapes
- Non-Volatile Memory (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58160360A JPS6053083A (ja) | 1983-09-02 | 1983-09-02 | 不揮発性メモリの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58160360A JPS6053083A (ja) | 1983-09-02 | 1983-09-02 | 不揮発性メモリの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6053083A true JPS6053083A (ja) | 1985-03-26 |
| JPH0478025B2 JPH0478025B2 (cg-RX-API-DMAC7.html) | 1992-12-10 |
Family
ID=15713287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58160360A Granted JPS6053083A (ja) | 1983-09-02 | 1983-09-02 | 不揮発性メモリの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6053083A (cg-RX-API-DMAC7.html) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5464785A (en) * | 1994-11-30 | 1995-11-07 | United Microelectronics Corporation | Method of making a flash EPROM device having a drain edge P+ implant |
| EP0717448A1 (en) * | 1994-12-16 | 1996-06-19 | Sun Microsystems, Inc. | Asymmetric low power MOS devices |
| WO2000036642A1 (en) * | 1998-12-18 | 2000-06-22 | Lattice Semiconductor Corporation | Method of forming a non-volatile memory device |
| US6215700B1 (en) | 1999-01-07 | 2001-04-10 | Vantis Corporation | PMOS avalanche programmed floating gate memory cell structure |
| US6232631B1 (en) | 1998-12-21 | 2001-05-15 | Vantis Corporation | Floating gate memory cell structure with programming mechanism outside the read path |
| US6282123B1 (en) | 1998-12-21 | 2001-08-28 | Lattice Semiconductor Corporation | Method of fabricating, programming, and erasing a dual pocket two sided program/erase non-volatile memory cell |
| US6294809B1 (en) | 1998-12-28 | 2001-09-25 | Vantis Corporation | Avalanche programmed floating gate memory cell structure with program element in polysilicon |
| US6326663B1 (en) | 1999-03-26 | 2001-12-04 | Vantis Corporation | Avalanche injection EEPROM memory cell with P-type control gate |
| US6424000B1 (en) | 1999-05-11 | 2002-07-23 | Vantis Corporation | Floating gate memory apparatus and method for selected programming thereof |
-
1983
- 1983-09-02 JP JP58160360A patent/JPS6053083A/ja active Granted
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5464785A (en) * | 1994-11-30 | 1995-11-07 | United Microelectronics Corporation | Method of making a flash EPROM device having a drain edge P+ implant |
| EP0717448A1 (en) * | 1994-12-16 | 1996-06-19 | Sun Microsystems, Inc. | Asymmetric low power MOS devices |
| WO2000036642A1 (en) * | 1998-12-18 | 2000-06-22 | Lattice Semiconductor Corporation | Method of forming a non-volatile memory device |
| US6214666B1 (en) | 1998-12-18 | 2001-04-10 | Vantis Corporation | Method of forming a non-volatile memory device |
| US6232631B1 (en) | 1998-12-21 | 2001-05-15 | Vantis Corporation | Floating gate memory cell structure with programming mechanism outside the read path |
| US6282123B1 (en) | 1998-12-21 | 2001-08-28 | Lattice Semiconductor Corporation | Method of fabricating, programming, and erasing a dual pocket two sided program/erase non-volatile memory cell |
| US6294809B1 (en) | 1998-12-28 | 2001-09-25 | Vantis Corporation | Avalanche programmed floating gate memory cell structure with program element in polysilicon |
| US6215700B1 (en) | 1999-01-07 | 2001-04-10 | Vantis Corporation | PMOS avalanche programmed floating gate memory cell structure |
| US6326663B1 (en) | 1999-03-26 | 2001-12-04 | Vantis Corporation | Avalanche injection EEPROM memory cell with P-type control gate |
| US6424000B1 (en) | 1999-05-11 | 2002-07-23 | Vantis Corporation | Floating gate memory apparatus and method for selected programming thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0478025B2 (cg-RX-API-DMAC7.html) | 1992-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0513923B1 (en) | Protected programmable transistor with reduced parasitic capacitances and method of fabrication | |
| US4642881A (en) | Method of manufacturing nonvolatile semiconductor memory device by forming additional impurity doped region under the floating gate | |
| US6812104B2 (en) | MIS semiconductor device and method of fabricating the same | |
| US7670911B2 (en) | Method for manufacturing vertical MOS transistor | |
| US6468863B2 (en) | Split gate field effect transistor (FET) device employing dielectric barrier layer and method for fabrication thereof | |
| US6492231B2 (en) | Method of making triple self-aligned split-gate non-volatile memory device | |
| JPS614240A (ja) | 半導体装置の製造方法 | |
| JPS6053083A (ja) | 不揮発性メモリの製造方法 | |
| JPS6323328A (ja) | 酸化シリコン膜の製造方法 | |
| JPH0734477B2 (ja) | 半導体装置の製造方法 | |
| JP2617477B2 (ja) | フローティングゲート型メモリデバイスおよび不揮発性メモリセルの製造方法 | |
| JP2624709B2 (ja) | 半導体装置の製造方法 | |
| US6596587B1 (en) | Shallow junction EEPROM device and process for fabricating the device | |
| KR20050058613A (ko) | 메모리 소자 및 그 제조 방법 | |
| JP4365568B2 (ja) | ドーピング方法およびそれを用いた半導体素子 | |
| JPH0412629B2 (cg-RX-API-DMAC7.html) | ||
| JPH0770543B2 (ja) | トランジスタの製造方法 | |
| JP3920383B2 (ja) | 2重厚さフローティングゲート酸化物フラッシュメモリセルの製造方法 | |
| JPH0629543A (ja) | 半導体装置の製造方法 | |
| JPS627164A (ja) | 半導体装置の製造方法 | |
| JPS63271972A (ja) | 薄膜トランジスタの製法 | |
| JPH03231456A (ja) | 半導体装置の製造方法 | |
| JPS6376481A (ja) | 半導体装置及びその製造方法 | |
| JPH06268178A (ja) | 半導体装置の製造方法 | |
| JPH0521788A (ja) | Mosトランジスタとその製造方法 |