JPS6050949A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6050949A
JPS6050949A JP58159876A JP15987683A JPS6050949A JP S6050949 A JPS6050949 A JP S6050949A JP 58159876 A JP58159876 A JP 58159876A JP 15987683 A JP15987683 A JP 15987683A JP S6050949 A JPS6050949 A JP S6050949A
Authority
JP
Japan
Prior art keywords
layer
wiring
semiconductor device
metal
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58159876A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0544185B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Masahiro Yamada
正弘 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP58159876A priority Critical patent/JPS6050949A/ja
Publication of JPS6050949A publication Critical patent/JPS6050949A/ja
Publication of JPH0544185B2 publication Critical patent/JPH0544185B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/05001—Internal layers
    • H01L2224/05073—Single internal layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP58159876A 1983-08-30 1983-08-30 半導体装置 Granted JPS6050949A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58159876A JPS6050949A (ja) 1983-08-30 1983-08-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58159876A JPS6050949A (ja) 1983-08-30 1983-08-30 半導体装置

Publications (2)

Publication Number Publication Date
JPS6050949A true JPS6050949A (ja) 1985-03-22
JPH0544185B2 JPH0544185B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-07-05

Family

ID=15703130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58159876A Granted JPS6050949A (ja) 1983-08-30 1983-08-30 半導体装置

Country Status (1)

Country Link
JP (1) JPS6050949A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63252433A (ja) * 1987-04-08 1988-10-19 Fuji Electric Co Ltd 半導体装置の製造方法
JPH025473A (ja) * 1988-06-23 1990-01-10 Toshiba Corp 固体撮像装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227389A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Semiconductor device containing multi-layer wiring

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227389A (en) * 1975-08-27 1977-03-01 Hitachi Ltd Semiconductor device containing multi-layer wiring

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63252433A (ja) * 1987-04-08 1988-10-19 Fuji Electric Co Ltd 半導体装置の製造方法
JPH025473A (ja) * 1988-06-23 1990-01-10 Toshiba Corp 固体撮像装置の製造方法

Also Published As

Publication number Publication date
JPH0544185B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-07-05

Similar Documents

Publication Publication Date Title
JPH0697225A (ja) 半導体装置
JPS6318697A (ja) 多層配線基板
JPS6050949A (ja) 半導体装置
JPH01185943A (ja) 半導体集積回路装置
JPS6057649A (ja) 半導体装置の製造方法
JPS62147746A (ja) 集積回路構造
JPH0286159A (ja) 半導体装置
JPS5854646A (ja) 混成集積回路装置
JPH10270491A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPH0786281A (ja) 半導体装置および半導体装置の製造方法
JPS63312661A (ja) 半導体装置用パッケ−ジ
JP2766361B2 (ja) 半導体装置
JPH04118968A (ja) 半導体集積回路装置
JPS59193047A (ja) 半導体集積回路装置
JPS6066450A (ja) 多層配線
JPS5832440A (ja) 混成集積回路装置
JPS5886735A (ja) 多層構造半導体装置
JPS57201050A (en) Multilayer wiring structure
JPS59225587A (ja) セラミツク配線基板
JPS5895860A (ja) 多層構造半導体装置
JPH11121614A (ja) 多層接続方法及び半導体集積回路
JP2005129969A (ja) 多層接続方法及び半導体集積回路
JPS6027166A (ja) 半導体装置
JPS61189695A (ja) 多層プリント板の配線パタ−ン構造
JPS5890741A (ja) 半導体装置