JPS6050161A - 拡散浸透処理による表面硬化層を有するCu合金部材 - Google Patents
拡散浸透処理による表面硬化層を有するCu合金部材Info
- Publication number
- JPS6050161A JPS6050161A JP15823083A JP15823083A JPS6050161A JP S6050161 A JPS6050161 A JP S6050161A JP 15823083 A JP15823083 A JP 15823083A JP 15823083 A JP15823083 A JP 15823083A JP S6050161 A JPS6050161 A JP S6050161A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- strength
- diffused
- penetrated
- corrosion resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C12/00—Solid state diffusion of at least one non-metal element other than silicon and at least one metal element or silicon into metallic material surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15823083A JPS6050161A (ja) | 1983-08-30 | 1983-08-30 | 拡散浸透処理による表面硬化層を有するCu合金部材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15823083A JPS6050161A (ja) | 1983-08-30 | 1983-08-30 | 拡散浸透処理による表面硬化層を有するCu合金部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6050161A true JPS6050161A (ja) | 1985-03-19 |
| JPS6146549B2 JPS6146549B2 (enExample) | 1986-10-15 |
Family
ID=15667115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15823083A Granted JPS6050161A (ja) | 1983-08-30 | 1983-08-30 | 拡散浸透処理による表面硬化層を有するCu合金部材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6050161A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7416620B2 (en) | 1996-08-29 | 2008-08-26 | Luvata Oy | Copper alloy and method for its manufacture |
| CN108138262A (zh) * | 2015-10-15 | 2018-06-08 | 三菱综合材料株式会社 | 铸造用模具材料及Cu-Cr-Zr-Al合金原材料 |
| US10421122B2 (en) | 2015-05-13 | 2019-09-24 | Daihen Corporation | Metal powder, method of producing additively-manufactured article, and additively-manufactured article |
| US10981226B2 (en) | 2016-10-25 | 2021-04-20 | Daihen Corporation | Copper alloy powder, method of producing additively-manufactured article, and additively-manufactured article |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02126147U (enExample) * | 1989-03-25 | 1990-10-17 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58126946A (ja) * | 1982-01-25 | 1983-07-28 | Toyota Central Res & Dev Lab Inc | 硼化物分散銅合金の製造方法 |
-
1983
- 1983-08-30 JP JP15823083A patent/JPS6050161A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58126946A (ja) * | 1982-01-25 | 1983-07-28 | Toyota Central Res & Dev Lab Inc | 硼化物分散銅合金の製造方法 |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7416620B2 (en) | 1996-08-29 | 2008-08-26 | Luvata Oy | Copper alloy and method for its manufacture |
| US10421122B2 (en) | 2015-05-13 | 2019-09-24 | Daihen Corporation | Metal powder, method of producing additively-manufactured article, and additively-manufactured article |
| US10843260B2 (en) | 2015-05-13 | 2020-11-24 | Daihen Corporation | Metal powder, method of producing additively-manufactured article, and additively-manufactured article |
| US11077495B2 (en) | 2015-05-13 | 2021-08-03 | Daihen Corporation | Metal powder, method of producing additively-manufactured article, and additively-manufactured article |
| CN108138262A (zh) * | 2015-10-15 | 2018-06-08 | 三菱综合材料株式会社 | 铸造用模具材料及Cu-Cr-Zr-Al合金原材料 |
| CN108138262B (zh) * | 2015-10-15 | 2021-07-09 | 三菱综合材料株式会社 | 铸造用模具材料及Cu-Cr-Zr-Al合金原材料 |
| US10981226B2 (en) | 2016-10-25 | 2021-04-20 | Daihen Corporation | Copper alloy powder, method of producing additively-manufactured article, and additively-manufactured article |
| US12084745B2 (en) | 2016-10-25 | 2024-09-10 | Daihen Corporation | Copper alloy powder, method of producing additively-manufactured article, and additively-manufactured article |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6146549B2 (enExample) | 1986-10-15 |
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