JPS6045046A - 放熱構造 - Google Patents

放熱構造

Info

Publication number
JPS6045046A
JPS6045046A JP58153851A JP15385183A JPS6045046A JP S6045046 A JPS6045046 A JP S6045046A JP 58153851 A JP58153851 A JP 58153851A JP 15385183 A JP15385183 A JP 15385183A JP S6045046 A JPS6045046 A JP S6045046A
Authority
JP
Japan
Prior art keywords
heat
thermal expansion
post
heat dissipation
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58153851A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0126542B2 (OSRAM
Inventor
Norio Yabe
谷辺　範夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58153851A priority Critical patent/JPS6045046A/ja
Publication of JPS6045046A publication Critical patent/JPS6045046A/ja
Publication of JPH0126542B2 publication Critical patent/JPH0126542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58153851A 1983-08-22 1983-08-22 放熱構造 Granted JPS6045046A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58153851A JPS6045046A (ja) 1983-08-22 1983-08-22 放熱構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58153851A JPS6045046A (ja) 1983-08-22 1983-08-22 放熱構造

Publications (2)

Publication Number Publication Date
JPS6045046A true JPS6045046A (ja) 1985-03-11
JPH0126542B2 JPH0126542B2 (OSRAM) 1989-05-24

Family

ID=15571485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58153851A Granted JPS6045046A (ja) 1983-08-22 1983-08-22 放熱構造

Country Status (1)

Country Link
JP (1) JPS6045046A (OSRAM)

Also Published As

Publication number Publication date
JPH0126542B2 (OSRAM) 1989-05-24

Similar Documents

Publication Publication Date Title
JP3273505B2 (ja) 放熱フィンを備えたヒートシンクおよび放熱フィンの固定方法
US6321452B1 (en) Method for manufacturing the heat pipe integrated into the heat sink
US6789609B2 (en) Heat sink assembly structure
JP3449604B2 (ja) 冷却フィン
JP2000269676A (ja) 電子機器の放熱装置
KR101930239B1 (ko) 방진 및 방수기능이 향상된 엘이디 모듈
JP2002289750A (ja) マルチチップモジュールおよびその放熱構造
JPH10322062A (ja) 放熱器
US7779638B2 (en) Localized microelectronic cooling apparatuses and associated methods and systems
JPH0210800A (ja) 放熱体
JPS6045046A (ja) 放熱構造
US7040389B2 (en) Integrated heat dissipation apparatus
US7430870B2 (en) Localized microelectronic cooling
JP3011579B2 (ja) 半導体パッケージ用放熱板
JP2005203385A (ja) ヒートシンク
JPS60257157A (ja) 放熱器
JP2000018852A (ja) ヒートパイプ付きヒートシンクおよびその製造方法
JP4460791B2 (ja) 半導体装置用ヒートシンク
JP3217757B2 (ja) ヒートシンクとそれを用いた冷却構造
JP3953211B2 (ja) 電子素子の放熱構造
JPH05136585A (ja) 発熱体の放熱構造
JP2813376B2 (ja) ヒートパイプ内蔵型実装基板
JPH08222663A (ja) ヒートシンク
JPH0333072Y2 (OSRAM)
JP2010142101A (ja) ブスバー