JPS604215Y2 - 発光ダイオ−ドマトリクス表示器 - Google Patents

発光ダイオ−ドマトリクス表示器

Info

Publication number
JPS604215Y2
JPS604215Y2 JP1979073378U JP7337879U JPS604215Y2 JP S604215 Y2 JPS604215 Y2 JP S604215Y2 JP 1979073378 U JP1979073378 U JP 1979073378U JP 7337879 U JP7337879 U JP 7337879U JP S604215 Y2 JPS604215 Y2 JP S604215Y2
Authority
JP
Japan
Prior art keywords
light
light emitting
emitting diodes
emitting diode
shielding frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1979073378U
Other languages
English (en)
Japanese (ja)
Other versions
JPS55172981U (https=
Inventor
悌敬 樋口
昌昭 梅崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP1979073378U priority Critical patent/JPS604215Y2/ja
Publication of JPS55172981U publication Critical patent/JPS55172981U/ja
Application granted granted Critical
Publication of JPS604215Y2 publication Critical patent/JPS604215Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1979073378U 1979-05-31 1979-05-31 発光ダイオ−ドマトリクス表示器 Expired JPS604215Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1979073378U JPS604215Y2 (ja) 1979-05-31 1979-05-31 発光ダイオ−ドマトリクス表示器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1979073378U JPS604215Y2 (ja) 1979-05-31 1979-05-31 発光ダイオ−ドマトリクス表示器

Publications (2)

Publication Number Publication Date
JPS55172981U JPS55172981U (https=) 1980-12-11
JPS604215Y2 true JPS604215Y2 (ja) 1985-02-05

Family

ID=29306994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1979073378U Expired JPS604215Y2 (ja) 1979-05-31 1979-05-31 発光ダイオ−ドマトリクス表示器

Country Status (1)

Country Link
JP (1) JPS604215Y2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005009060A1 (de) * 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh Modul mit strahlungsemittierenden Halbleiterkörpern
TWI426594B (zh) * 2010-02-08 2014-02-11 柏友照明科技股份有限公司 能夠提高演色性之混光式發光二極體封裝結構

Also Published As

Publication number Publication date
JPS55172981U (https=) 1980-12-11

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