JPS55172981U - - Google Patents
Info
- Publication number
- JPS55172981U JPS55172981U JP1979073378U JP7337879U JPS55172981U JP S55172981 U JPS55172981 U JP S55172981U JP 1979073378 U JP1979073378 U JP 1979073378U JP 7337879 U JP7337879 U JP 7337879U JP S55172981 U JPS55172981 U JP S55172981U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979073378U JPS604215Y2 (ja) | 1979-05-31 | 1979-05-31 | 発光ダイオ−ドマトリクス表示器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979073378U JPS604215Y2 (ja) | 1979-05-31 | 1979-05-31 | 発光ダイオ−ドマトリクス表示器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55172981U true JPS55172981U (https=) | 1980-12-11 |
| JPS604215Y2 JPS604215Y2 (ja) | 1985-02-05 |
Family
ID=29306994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979073378U Expired JPS604215Y2 (ja) | 1979-05-31 | 1979-05-31 | 発光ダイオ−ドマトリクス表示器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS604215Y2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532299A (ja) * | 2005-02-28 | 2008-08-14 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 放射線を発する半導体を備えたモジュール |
| JP2011166099A (ja) * | 2010-02-08 | 2011-08-25 | Paragon Semiconductor Lighting Technology Co Ltd | 演色性を向上させることができる混光式発光ダイオードのパッケージ構造 |
-
1979
- 1979-05-31 JP JP1979073378U patent/JPS604215Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008532299A (ja) * | 2005-02-28 | 2008-08-14 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 放射線を発する半導体を備えたモジュール |
| JP2011166099A (ja) * | 2010-02-08 | 2011-08-25 | Paragon Semiconductor Lighting Technology Co Ltd | 演色性を向上させることができる混光式発光ダイオードのパッケージ構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS604215Y2 (ja) | 1985-02-05 |