JPS6032326A - 半導体ウエハの乾燥方法 - Google Patents

半導体ウエハの乾燥方法

Info

Publication number
JPS6032326A
JPS6032326A JP14046883A JP14046883A JPS6032326A JP S6032326 A JPS6032326 A JP S6032326A JP 14046883 A JP14046883 A JP 14046883A JP 14046883 A JP14046883 A JP 14046883A JP S6032326 A JPS6032326 A JP S6032326A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
vacuum nozzle
vacuum
drying
high speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14046883A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6240849B2 (enrdf_load_stackoverflow
Inventor
Hideo Tadokoro
田所　秀夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP14046883A priority Critical patent/JPS6032326A/ja
Priority to US06/633,134 priority patent/US4559718A/en
Publication of JPS6032326A publication Critical patent/JPS6032326A/ja
Publication of JPS6240849B2 publication Critical patent/JPS6240849B2/ja
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B5/00—Drying solid materials or objects by processes not involving the application of heat
    • F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP14046883A 1983-08-02 1983-08-02 半導体ウエハの乾燥方法 Granted JPS6032326A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP14046883A JPS6032326A (ja) 1983-08-02 1983-08-02 半導体ウエハの乾燥方法
US06/633,134 US4559718A (en) 1983-08-02 1984-07-23 Method and apparatus for drying semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14046883A JPS6032326A (ja) 1983-08-02 1983-08-02 半導体ウエハの乾燥方法

Publications (2)

Publication Number Publication Date
JPS6032326A true JPS6032326A (ja) 1985-02-19
JPS6240849B2 JPS6240849B2 (enrdf_load_stackoverflow) 1987-08-31

Family

ID=15269294

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14046883A Granted JPS6032326A (ja) 1983-08-02 1983-08-02 半導体ウエハの乾燥方法

Country Status (1)

Country Link
JP (1) JPS6032326A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109442883A (zh) * 2018-11-08 2019-03-08 李伟 一种化工生产用效率高的离心干燥装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109442883A (zh) * 2018-11-08 2019-03-08 李伟 一种化工生产用效率高的离心干燥装置

Also Published As

Publication number Publication date
JPS6240849B2 (enrdf_load_stackoverflow) 1987-08-31

Similar Documents

Publication Publication Date Title
KR920010730B1 (ko) 반도체기판 에칭장치
JPS6064436A (ja) スピンドライヤ
JP2894535B2 (ja) ウェーハホルダー
JPS6032326A (ja) 半導体ウエハの乾燥方法
JPS63137448A (ja) 半導体ウエハ処理装置
JPS5932056B2 (ja) 半導体装置の製造方法
JP3321658B2 (ja) 液晶表示装置の製法
JPS6242375B2 (enrdf_load_stackoverflow)
JPH08316293A (ja) レジスト処理装置用チャック、及びウエハ洗浄方法
JP3192951B2 (ja) 半導体ウエハの乾燥装置
JPS6030140A (ja) スピンドライヤ
JPS6032324A (ja) 半導体ウエハ乾燥装置
JP2000058497A (ja) スピン洗浄・乾燥方法
JPS63155622A (ja) 半導体基板洗浄装置
KR19990000274A (ko) 반도체 세정장치
JPH04264751A (ja) チップ保持治具
JPS62291926A (ja) 半導体乾燥装置
JPS61152021A (ja) 乾燥装置
JPH0471232A (ja) 洗浄装置
JP2617454B2 (ja) 裏面研削装置
JPS6323705Y2 (enrdf_load_stackoverflow)
JPH04343429A (ja) 回転乾燥装置
JP2002001254A (ja) 処理物回転処理装置
JPS62199030A (ja) 半導体ウエハ−の処理装置
KR20000017914U (ko) 반도체 제조 공정에 사용되는 스핀들 척