JPS6031102B2 - 集積回路パツケージおよびその製作方法 - Google Patents
集積回路パツケージおよびその製作方法Info
- Publication number
- JPS6031102B2 JPS6031102B2 JP51004554A JP455476A JPS6031102B2 JP S6031102 B2 JPS6031102 B2 JP S6031102B2 JP 51004554 A JP51004554 A JP 51004554A JP 455476 A JP455476 A JP 455476A JP S6031102 B2 JPS6031102 B2 JP S6031102B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- integrated circuit
- lead
- window frame
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000919 ceramic Substances 0.000 claims description 44
- 239000005355 lead glass Substances 0.000 claims description 22
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000012299 nitrogen atmosphere Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 17
- 238000000151 deposition Methods 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000011241 protective layer Substances 0.000 claims 1
- 239000010931 gold Substances 0.000 description 10
- 229910052737 gold Inorganic materials 0.000 description 10
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 5
- 230000002411 adverse Effects 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000005322 wire mesh glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Die Bonding (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/545,387 US4025716A (en) | 1975-01-30 | 1975-01-30 | Dual in-line package with window frame |
| US545387 | 1975-01-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5197979A JPS5197979A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-08-28 |
| JPS6031102B2 true JPS6031102B2 (ja) | 1985-07-20 |
Family
ID=24176007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP51004554A Expired JPS6031102B2 (ja) | 1975-01-30 | 1976-01-16 | 集積回路パツケージおよびその製作方法 |
Country Status (6)
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4572924A (en) * | 1983-05-18 | 1986-02-25 | Spectrum Ceramics, Inc. | Electronic enclosures having metal parts |
| JPS60208847A (ja) * | 1984-04-02 | 1985-10-21 | Oki Electric Ind Co Ltd | 表面実装型ｉｃに内在する水分の排出方法 |
| FR2575331B1 (fr) * | 1984-12-21 | 1987-06-05 | Labo Electronique Physique | Boitier pour composant electronique |
| US4651415A (en) * | 1985-03-22 | 1987-03-24 | Diacon, Inc. | Leaded chip carrier |
| US5106784A (en) * | 1987-04-16 | 1992-04-21 | Texas Instruments Incorporated | Method of making a post molded cavity package with internal dam bar for integrated circuit |
| US4979289A (en) * | 1989-02-10 | 1990-12-25 | Honeywell Inc. | Method of die bonding semiconductor chip by using removable non-wettable by solder frame |
| US5014418A (en) * | 1989-07-13 | 1991-05-14 | Gte Products Corporation | Method of forming a two piece chip carrier |
| US4990719A (en) * | 1989-07-13 | 1991-02-05 | Gte Products Corporation | Hermetically sealed chip carrier with metal cover having pre-poured glass window |
| US5334874A (en) * | 1991-09-13 | 1994-08-02 | Metzler Richard A | Electronic device package |
| US5465008A (en) * | 1993-10-08 | 1995-11-07 | Stratedge Corporation | Ceramic microelectronics package |
| US5753972A (en) * | 1993-10-08 | 1998-05-19 | Stratedge Corporation | Microelectronics package |
| US5736783A (en) * | 1993-10-08 | 1998-04-07 | Stratedge Corporation. | High frequency microelectronics package |
| US6011294A (en) * | 1996-04-08 | 2000-01-04 | Eastman Kodak Company | Low cost CCD packaging |
| SE517944C2 (sv) * | 2000-04-06 | 2002-08-06 | Ericsson Telefon Ab L M | Förfarande och styrelement för fastsättning av ett mönsterkort på ett element |
| SE518778C2 (sv) * | 2000-04-19 | 2002-11-19 | Ericsson Telefon Ab L M | Förfarande och anordning för montering av en elektronisk eller mekanisk komponent på ett mönsterkort samt ett styrelement anordnat att ytmonteras på ett mönsterkort |
| JP4785017B2 (ja) * | 2001-03-26 | 2011-10-05 | 古河電気工業株式会社 | 余長入り自己支持型ケーブル用引取り方法及び引取り機 |
| US20050093119A1 (en) * | 2003-10-31 | 2005-05-05 | Abounion Technology, Corp. | Window type case for memory card |
| KR101103429B1 (ko) * | 2009-03-20 | 2012-01-09 | 장영진 | 냉매관 이송장치 |
| US9502269B2 (en) * | 2014-04-03 | 2016-11-22 | Bae Systems Information And Electronic Systems Integration Inc. | Method and apparatus for cooling electonic components |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3435516A (en) * | 1959-05-06 | 1969-04-01 | Texas Instruments Inc | Semiconductor structure fabrication |
| DE1514273B2 (de) * | 1964-08-21 | 1974-08-22 | Nippon Electric Co., Ltd., Tokio | Halbleiteranordmng |
| US3537175A (en) * | 1966-11-09 | 1970-11-03 | Advalloy Inc | Lead frame for semiconductor devices and method for making same |
| US3502786A (en) * | 1967-06-14 | 1970-03-24 | Milton Stoll | Flat pack spacer of low thermal diffusivity |
| US3509430A (en) * | 1968-01-31 | 1970-04-28 | Micro Science Associates | Mount for electronic component |
| US3495023A (en) * | 1968-06-14 | 1970-02-10 | Nat Beryllia Corp | Flat pack having a beryllia base and an alumina ring |
| US3535486A (en) * | 1968-07-16 | 1970-10-20 | Lucas Industries Ltd | Electrical printed circuit assemblies |
| US3698073A (en) * | 1970-10-13 | 1972-10-17 | Motorola Inc | Contact bonding and packaging of integrated circuits |
| US3793064A (en) * | 1971-11-15 | 1974-02-19 | Du Pont | Product and process for cavity metallization of semiconductor packages |
| US3809797A (en) * | 1971-11-16 | 1974-05-07 | Du Pont | Seal ring compositions and electronic packages made therewith |
-
1975
- 1975-01-30 US US05/545,387 patent/US4025716A/en not_active Expired - Lifetime
- 1975-11-12 IN IN2164/CAL/75A patent/IN144904B/en unknown
- 1975-12-12 GB GB50947/75A patent/GB1499358A/en not_active Expired
- 1975-12-18 FR FR7538915A patent/FR2299725A1/fr active Granted
-
1976
- 1976-01-13 BR BR7600170A patent/BR7600170A/pt unknown
- 1976-01-16 JP JP51004554A patent/JPS6031102B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4025716A (en) | 1977-05-24 |
| IN144904B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1978-07-22 |
| FR2299725A1 (fr) | 1976-08-27 |
| BR7600170A (pt) | 1976-08-31 |
| JPS5197979A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1976-08-28 |
| FR2299725B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1982-04-02 |
| GB1499358A (en) | 1978-02-01 |
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