JPS6027151A - 半導体素子搭載用複合金属条 - Google Patents

半導体素子搭載用複合金属条

Info

Publication number
JPS6027151A
JPS6027151A JP58134266A JP13426683A JPS6027151A JP S6027151 A JPS6027151 A JP S6027151A JP 58134266 A JP58134266 A JP 58134266A JP 13426683 A JP13426683 A JP 13426683A JP S6027151 A JPS6027151 A JP S6027151A
Authority
JP
Japan
Prior art keywords
strip
present
semiconductor element
mounting semiconductor
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58134266A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0420269B2 (cg-RX-API-DMAC10.html
Inventor
Nobuo Ogasa
小笠　伸夫
Akira Otsuka
昭 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58134266A priority Critical patent/JPS6027151A/ja
Publication of JPS6027151A publication Critical patent/JPS6027151A/ja
Publication of JPH0420269B2 publication Critical patent/JPH0420269B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W40/255—
    • H10W70/461—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58134266A 1983-07-25 1983-07-25 半導体素子搭載用複合金属条 Granted JPS6027151A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58134266A JPS6027151A (ja) 1983-07-25 1983-07-25 半導体素子搭載用複合金属条

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58134266A JPS6027151A (ja) 1983-07-25 1983-07-25 半導体素子搭載用複合金属条

Publications (2)

Publication Number Publication Date
JPS6027151A true JPS6027151A (ja) 1985-02-12
JPH0420269B2 JPH0420269B2 (cg-RX-API-DMAC10.html) 1992-04-02

Family

ID=15124277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58134266A Granted JPS6027151A (ja) 1983-07-25 1983-07-25 半導体素子搭載用複合金属条

Country Status (1)

Country Link
JP (1) JPS6027151A (cg-RX-API-DMAC10.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0167762U (cg-RX-API-DMAC10.html) * 1987-10-23 1989-05-01
JPH0170353U (cg-RX-API-DMAC10.html) * 1987-10-28 1989-05-10
JPH0247054U (cg-RX-API-DMAC10.html) * 1988-09-26 1990-03-30
JPH02283053A (ja) * 1989-03-03 1990-11-20 Delco Electron Corp 集積回路／ヒートシンク中間部材
JPH06188324A (ja) * 1992-12-16 1994-07-08 Kyocera Corp 半導体装置
EP0634794A3 (cg-RX-API-DMAC10.html) * 1989-12-12 1995-02-15 Sumitomo Spec Metals

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0167762U (cg-RX-API-DMAC10.html) * 1987-10-23 1989-05-01
JPH0170353U (cg-RX-API-DMAC10.html) * 1987-10-28 1989-05-10
JPH0247054U (cg-RX-API-DMAC10.html) * 1988-09-26 1990-03-30
JPH02283053A (ja) * 1989-03-03 1990-11-20 Delco Electron Corp 集積回路／ヒートシンク中間部材
EP0634794A3 (cg-RX-API-DMAC10.html) * 1989-12-12 1995-02-15 Sumitomo Spec Metals
JPH06188324A (ja) * 1992-12-16 1994-07-08 Kyocera Corp 半導体装置

Also Published As

Publication number Publication date
JPH0420269B2 (cg-RX-API-DMAC10.html) 1992-04-02

Similar Documents

Publication Publication Date Title
US4556899A (en) Insulated type semiconductor devices
US4482912A (en) Stacked structure having matrix-fibered composite layers and a metal layer
JP2018037684A (ja) パワー半導体装置
JPS6370498A (ja) セラミック基板と熱放散器の組合せ
US3295089A (en) Semiconductor device
JPS6337496B2 (cg-RX-API-DMAC10.html)
JPS60242653A (ja) リ−ドフレ−ム用複合材
JPS6027151A (ja) 半導体素子搭載用複合金属条
US3950142A (en) Lead assembly for semiconductive device
JPS6318687A (ja) 回路基板
JPH06216167A (ja) 半導体装置及びその製造方法
JP4407521B2 (ja) 絶縁伝熱構造体及びパワーモジュール用基板
JPH03227621A (ja) 熱伝導複合材料
JPS63102326A (ja) クラツド材
JPH05109947A (ja) 熱伝導材料とその製造方法
JPH05218226A (ja) 多層配線基板
JP2602161B2 (ja) 高放熱性集積回路パッケージ
JPH04230063A (ja) 多層ヒートシンク
JPS63224242A (ja) 熱伝達装置
JPS61150253A (ja) 半導体リ−ドフレ−ム
CN218955559U (zh) 石墨烯金属复合散热翅片
JPS6053037A (ja) 半導体素子臀載用多層複合金属条
JPS5835956A (ja) 混成集積回路装置
JPH1041443A (ja) 半導体装置
JPS59186332A (ja) 半導体装置