JPS60260626A - アラミッド系不織布で補強された樹脂シ−ト - Google Patents

アラミッド系不織布で補強された樹脂シ−ト

Info

Publication number
JPS60260626A
JPS60260626A JP11800784A JP11800784A JPS60260626A JP S60260626 A JPS60260626 A JP S60260626A JP 11800784 A JP11800784 A JP 11800784A JP 11800784 A JP11800784 A JP 11800784A JP S60260626 A JPS60260626 A JP S60260626A
Authority
JP
Japan
Prior art keywords
resin
aramid
nonwoven fabric
resin sheet
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11800784A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0425970B2 (enrdf_load_stackoverflow
Inventor
Keiichi Uno
敬一 宇野
Riyouzou Ishinami
石浪　諒三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo Co Ltd
Original Assignee
Toyobo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyobo Co Ltd filed Critical Toyobo Co Ltd
Priority to JP11800784A priority Critical patent/JPS60260626A/ja
Publication of JPS60260626A publication Critical patent/JPS60260626A/ja
Publication of JPH0425970B2 publication Critical patent/JPH0425970B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Reinforced Plastic Materials (AREA)
JP11800784A 1984-06-07 1984-06-07 アラミッド系不織布で補強された樹脂シ−ト Granted JPS60260626A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11800784A JPS60260626A (ja) 1984-06-07 1984-06-07 アラミッド系不織布で補強された樹脂シ−ト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11800784A JPS60260626A (ja) 1984-06-07 1984-06-07 アラミッド系不織布で補強された樹脂シ−ト

Publications (2)

Publication Number Publication Date
JPS60260626A true JPS60260626A (ja) 1985-12-23
JPH0425970B2 JPH0425970B2 (enrdf_load_stackoverflow) 1992-05-06

Family

ID=14725738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11800784A Granted JPS60260626A (ja) 1984-06-07 1984-06-07 アラミッド系不織布で補強された樹脂シ−ト

Country Status (1)

Country Link
JP (1) JPS60260626A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61170089A (ja) * 1985-01-23 1986-07-31 東洋紡績株式会社 フレキシブルプリント配線板
JPS62198186A (ja) * 1986-02-25 1987-09-01 松下電器産業株式会社 プリント配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61170089A (ja) * 1985-01-23 1986-07-31 東洋紡績株式会社 フレキシブルプリント配線板
JPS62198186A (ja) * 1986-02-25 1987-09-01 松下電器産業株式会社 プリント配線板

Also Published As

Publication number Publication date
JPH0425970B2 (enrdf_load_stackoverflow) 1992-05-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees