JPS60257511A - 熱処理方法及びそれに用いる熱処理装置 - Google Patents

熱処理方法及びそれに用いる熱処理装置

Info

Publication number
JPS60257511A
JPS60257511A JP59114306A JP11430684A JPS60257511A JP S60257511 A JPS60257511 A JP S60257511A JP 59114306 A JP59114306 A JP 59114306A JP 11430684 A JP11430684 A JP 11430684A JP S60257511 A JPS60257511 A JP S60257511A
Authority
JP
Japan
Prior art keywords
laser beam
density distribution
energy density
split
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59114306A
Other languages
English (en)
Japanese (ja)
Inventor
Yasuo Kano
狩野　靖夫
Setsuo Usui
碓井　節夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP59114306A priority Critical patent/JPS60257511A/ja
Priority claimed from JP1984114306U external-priority patent/JPS6132150U/ja
Priority to DE19853526846 priority patent/DE3526846A1/de
Publication of JPS60257511A publication Critical patent/JPS60257511A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00—Feeding articles separated from piles; Feeding articles to machines
    • B65H5/06—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers
    • B65H5/062—Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers between rollers or balls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/02—Advancing work in relation to the stroke of the die or tool
    • B21D43/04—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work
    • B21D43/08—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work by rollers
    • B21D43/09—Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work by rollers by one or more pairs of rollers for feeding sheet or strip material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
    • B65H2511/20—Location in space
    • B65H2511/22—Distance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2511/00—Dimensions; Position; Numbers; Identification; Occurrences
    • B65H2511/20—Location in space
    • B65H2511/22—Distance
    • B65H2511/224—Nip between rollers, between belts or between rollers and belts

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)
  • Advancing Webs (AREA)
  • Recrystallisation Techniques (AREA)
JP59114306A 1984-06-04 1984-06-04 熱処理方法及びそれに用いる熱処理装置 Pending JPS60257511A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP59114306A JPS60257511A (ja) 1984-06-04 1984-06-04 熱処理方法及びそれに用いる熱処理装置
DE19853526846 DE3526846A1 (de) 1984-06-04 1985-07-26 Walzenzufuehrungseinrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59114306A JPS60257511A (ja) 1984-06-04 1984-06-04 熱処理方法及びそれに用いる熱処理装置
JP1984114306U JPS6132150U (ja) 1984-07-27 1984-07-27 ロ−ルフイ−ド装置

Publications (1)

Publication Number Publication Date
JPS60257511A true JPS60257511A (ja) 1985-12-19

Family

ID=26453083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59114306A Pending JPS60257511A (ja) 1984-06-04 1984-06-04 熱処理方法及びそれに用いる熱処理装置

Country Status (2)

Country Link
JP (1) JPS60257511A (enrdf_load_stackoverflow)
DE (1) DE3526846A1 (enrdf_load_stackoverflow)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01246826A (ja) * 1988-03-28 1989-10-02 Tokyo Electron Ltd ビームアニール方法およびビームアニール装置
JPH0242717A (ja) * 1988-08-03 1990-02-13 Hitachi Ltd エネルギービーム照射方法
JPH0963984A (ja) * 1995-08-18 1997-03-07 Semiconductor Energy Lab Co Ltd レーザーアニール方法およびレーザーアニール装置
US5968383A (en) * 1992-06-26 1999-10-19 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus having beam expander
US6149988A (en) * 1986-09-26 2000-11-21 Semiconductor Energy Laboratory Co., Ltd. Method and system of laser processing
US6159777A (en) * 1993-02-04 2000-12-12 Semiconductor Energy Laboratory Co., Ltd. Method of forming a TFT semiconductor device
US6261856B1 (en) 1987-09-16 2001-07-17 Semiconductor Energy Laboratory Co., Ltd. Method and system of laser processing
US6500704B1 (en) 1995-07-03 2002-12-31 Sanyo Electric Co., Ltd Semiconductor device, display device and method of fabricating the same
US6558991B2 (en) 1996-02-13 2003-05-06 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and laser irradiation method
US6790714B2 (en) 1995-07-03 2004-09-14 Sanyo Electric Co., Ltd. Semiconductor device, display device and method of fabricating the same
US6919533B2 (en) 1995-05-31 2005-07-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a display device including irradiating overlapping regions
WO2009015945A1 (de) * 2007-08-02 2009-02-05 Robert Bosch Gmbh Radarsensor für kraftfahrzeuge
US7513949B2 (en) 1995-07-19 2009-04-07 Semiconductor Energy Laboratory Co., Ltd. Method and apparatus for producing semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH677328A5 (enrdf_load_stackoverflow) * 1988-10-26 1991-05-15 Bruderer Ag

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2946588A (en) * 1958-01-03 1960-07-26 Albert F Pityo Web feeding mechanism
JPS5867831A (ja) * 1981-10-19 1983-04-22 Sumitomo Metal Ind Ltd 直火式加熱炉における鋼帯の加熱方法
JPS5867831U (ja) * 1981-10-29 1983-05-09 株式会社三共製作所 ロ−ルフイ−ド装置

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6149988A (en) * 1986-09-26 2000-11-21 Semiconductor Energy Laboratory Co., Ltd. Method and system of laser processing
US6261856B1 (en) 1987-09-16 2001-07-17 Semiconductor Energy Laboratory Co., Ltd. Method and system of laser processing
JPH01246826A (ja) * 1988-03-28 1989-10-02 Tokyo Electron Ltd ビームアニール方法およびビームアニール装置
JPH0242717A (ja) * 1988-08-03 1990-02-13 Hitachi Ltd エネルギービーム照射方法
US7985635B2 (en) 1992-06-26 2011-07-26 Semiconductor Energy Laboratory Co., Ltd. Laser process
US6002101A (en) * 1992-06-26 1999-12-14 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device by using a homogenized rectangular laser beam
US5968383A (en) * 1992-06-26 1999-10-19 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus having beam expander
US6440785B1 (en) 1992-06-26 2002-08-27 Semiconductor Energy Laboratory Co., Ltd Method of manufacturing a semiconductor device utilizing a laser annealing process
US6991975B1 (en) 1992-06-26 2006-01-31 Semiconductor Energy Laboratory Co., Ltd. Laser process
US6159777A (en) * 1993-02-04 2000-12-12 Semiconductor Energy Laboratory Co., Ltd. Method of forming a TFT semiconductor device
US7223938B2 (en) 1995-05-31 2007-05-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a display device including irradiating overlapping regions
US8835801B2 (en) 1995-05-31 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Laser processing method
US6919533B2 (en) 1995-05-31 2005-07-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a display device including irradiating overlapping regions
US6982396B2 (en) * 1995-05-31 2006-01-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a display device including irradiating overlapping regions
US7084052B2 (en) 1995-07-03 2006-08-01 Sanyo Electric Co., Ltd. Semiconductor device, display device and method of fabricating the same
US6790714B2 (en) 1995-07-03 2004-09-14 Sanyo Electric Co., Ltd. Semiconductor device, display device and method of fabricating the same
US6500704B1 (en) 1995-07-03 2002-12-31 Sanyo Electric Co., Ltd Semiconductor device, display device and method of fabricating the same
US7513949B2 (en) 1995-07-19 2009-04-07 Semiconductor Energy Laboratory Co., Ltd. Method and apparatus for producing semiconductor device
JPH0963984A (ja) * 1995-08-18 1997-03-07 Semiconductor Energy Lab Co Ltd レーザーアニール方法およびレーザーアニール装置
US6558991B2 (en) 1996-02-13 2003-05-06 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and laser irradiation method
WO2009015945A1 (de) * 2007-08-02 2009-02-05 Robert Bosch Gmbh Radarsensor für kraftfahrzeuge
US8344939B2 (en) 2007-08-02 2013-01-01 Robert Bosch Gmbh Radar sensor for motor vehicles

Also Published As

Publication number Publication date
DE3526846C2 (enrdf_load_stackoverflow) 1989-07-27
DE3526846A1 (de) 1986-02-06

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