JPS60257511A - Heat treatment and apparatus therefor - Google Patents

Heat treatment and apparatus therefor

Info

Publication number
JPS60257511A
JPS60257511A JP11430684A JP11430684A JPS60257511A JP S60257511 A JPS60257511 A JP S60257511A JP 11430684 A JP11430684 A JP 11430684A JP 11430684 A JP11430684 A JP 11430684A JP S60257511 A JPS60257511 A JP S60257511A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
energy density
laser beam
density distribution
obtained
split
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11430684A
Inventor
Yasuo Kano
Setsuo Usui
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H5/00Feeding articles separated from piles; Feeding articles to machines
    • B65H5/06Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers
    • B65H5/062Feeding articles separated from piles; Feeding articles to machines by rollers or balls, e.g. between rollers between rollers or balls
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D43/00Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
    • B21D43/02Advancing work in relation to the stroke of the die or tool
    • B21D43/04Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work
    • B21D43/08Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work by rollers
    • B21D43/09Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work by rollers by one or more pairs of rollers for feeding sheet or strip material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2511/00Dimension; Position; Number; Identification; Occurence
    • B65H2511/20Location in space
    • B65H2511/22Distance
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2511/00Dimension; Position; Number; Identification; Occurence
    • B65H2511/20Location in space
    • B65H2511/22Distance
    • B65H2511/224Nip between rollers, between belts or between rollers and belts

Abstract

PURPOSE:To obtain a crystal thin film over a widened area and with excellent reproducibility, by a method wherein an object of treatment is heat-treated using an energy beam shaped by a split semicylindrical lens and a semicylindrical lens disposed so that their longitudinal axes directions cross perpendicularly to each other. CONSTITUTION:At a focal plane fb, a laser beam having Gaussian distribution is split at the center, and the split portions overlap with each other, whereby a linear laser beam B04 shown at D is obtained which has a substantially uniform energy density distribution. At a focal plane fa, two linear laser beams B06 are obtained which have a Gaussian energy density distribution. Between the focal planes fa and fb, a laser beam B05 is obtained which has such a beam spot configuration that two cut elliptical beams face each other, that is, a double-humped energy density distribution. Employment of the linear laser beam B04 having a uniform energy density distribution enables crystallization to be obtained over a widened area and with excellent reproducibility. When the laser beam having a double-humped energy density distribution is applied to a polycrystalline silicon film so as to be recrystallized, it is also possible to obtain a silicon crystal film with excellent crystallizability.
JP11430684A 1984-06-04 1984-06-04 Heat treatment and apparatus therefor Pending JPS60257511A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11430684A JPS60257511A (en) 1984-06-04 1984-06-04 Heat treatment and apparatus therefor
JP11430684U JPH024739Y2 (en) 1984-07-27 1984-07-27

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11430684A JPS60257511A (en) 1984-06-04 1984-06-04 Heat treatment and apparatus therefor
DE19853526846 DE3526846C2 (en) 1984-06-04 1985-07-26

Publications (1)

Publication Number Publication Date
JPS60257511A true true JPS60257511A (en) 1985-12-19

Family

ID=26453083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11430684A Pending JPS60257511A (en) 1984-06-04 1984-06-04 Heat treatment and apparatus therefor

Country Status (2)

Country Link
JP (1) JPS60257511A (en)
DE (1) DE3526846C2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01246826A (en) * 1988-03-28 1989-10-02 Tokyo Electron Ltd Beam annealing
JPH0242717A (en) * 1988-08-03 1990-02-13 Hitachi Ltd Method of applying energy beam
US5968383A (en) * 1992-06-26 1999-10-19 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus having beam expander
US6149988A (en) * 1986-09-26 2000-11-21 Semiconductor Energy Laboratory Co., Ltd. Method and system of laser processing
US6159777A (en) * 1993-02-04 2000-12-12 Semiconductor Energy Laboratory Co., Ltd. Method of forming a TFT semiconductor device
US6261856B1 (en) 1987-09-16 2001-07-17 Semiconductor Energy Laboratory Co., Ltd. Method and system of laser processing
US6500704B1 (en) 1995-07-03 2002-12-31 Sanyo Electric Co., Ltd Semiconductor device, display device and method of fabricating the same
US6558991B2 (en) 1996-02-13 2003-05-06 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and laser irradiation method
US6790714B2 (en) 1995-07-03 2004-09-14 Sanyo Electric Co., Ltd. Semiconductor device, display device and method of fabricating the same
US6919533B2 (en) 1995-05-31 2005-07-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a display device including irradiating overlapping regions
WO2009015945A1 (en) * 2007-08-02 2009-02-05 Robert Bosch Gmbh Radar sensor for motor vehicles
US7513949B2 (en) 1995-07-19 2009-04-07 Semiconductor Energy Laboratory Co., Ltd. Method and apparatus for producing semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2946588A (en) * 1958-01-03 1960-07-26 Albert F Pityo Web feeding mechanism
JPS5867831A (en) * 1981-10-19 1983-04-22 Sumitomo Metal Ind Ltd Method for heating steel strip in direct firing type heating furnace
JPS63662Y2 (en) * 1981-10-29 1988-01-08

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6149988A (en) * 1986-09-26 2000-11-21 Semiconductor Energy Laboratory Co., Ltd. Method and system of laser processing
US6261856B1 (en) 1987-09-16 2001-07-17 Semiconductor Energy Laboratory Co., Ltd. Method and system of laser processing
JPH01246826A (en) * 1988-03-28 1989-10-02 Tokyo Electron Ltd Beam annealing
JPH0242717A (en) * 1988-08-03 1990-02-13 Hitachi Ltd Method of applying energy beam
US6991975B1 (en) 1992-06-26 2006-01-31 Semiconductor Energy Laboratory Co., Ltd. Laser process
US6002101A (en) * 1992-06-26 1999-12-14 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device by using a homogenized rectangular laser beam
US5968383A (en) * 1992-06-26 1999-10-19 Semiconductor Energy Laboratory Co., Ltd. Laser processing apparatus having beam expander
US6440785B1 (en) 1992-06-26 2002-08-27 Semiconductor Energy Laboratory Co., Ltd Method of manufacturing a semiconductor device utilizing a laser annealing process
US7985635B2 (en) 1992-06-26 2011-07-26 Semiconductor Energy Laboratory Co., Ltd. Laser process
US6159777A (en) * 1993-02-04 2000-12-12 Semiconductor Energy Laboratory Co., Ltd. Method of forming a TFT semiconductor device
US7223938B2 (en) 1995-05-31 2007-05-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a display device including irradiating overlapping regions
US6919533B2 (en) 1995-05-31 2005-07-19 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a display device including irradiating overlapping regions
US6982396B2 (en) * 1995-05-31 2006-01-03 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a display device including irradiating overlapping regions
US8835801B2 (en) 1995-05-31 2014-09-16 Semiconductor Energy Laboratory Co., Ltd. Laser processing method
US7084052B2 (en) 1995-07-03 2006-08-01 Sanyo Electric Co., Ltd. Semiconductor device, display device and method of fabricating the same
US6500704B1 (en) 1995-07-03 2002-12-31 Sanyo Electric Co., Ltd Semiconductor device, display device and method of fabricating the same
US6790714B2 (en) 1995-07-03 2004-09-14 Sanyo Electric Co., Ltd. Semiconductor device, display device and method of fabricating the same
US7513949B2 (en) 1995-07-19 2009-04-07 Semiconductor Energy Laboratory Co., Ltd. Method and apparatus for producing semiconductor device
US6558991B2 (en) 1996-02-13 2003-05-06 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and laser irradiation method
WO2009015945A1 (en) * 2007-08-02 2009-02-05 Robert Bosch Gmbh Radar sensor for motor vehicles
US8344939B2 (en) 2007-08-02 2013-01-01 Robert Bosch Gmbh Radar sensor for motor vehicles

Also Published As

Publication number Publication date Type
DE3526846A1 (en) 1986-02-06 application
DE3526846C2 (en) 1989-07-27 grant

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