JPS60244034A - ワイヤボンデイング用雰囲気形成装置 - Google Patents

ワイヤボンデイング用雰囲気形成装置

Info

Publication number
JPS60244034A
JPS60244034A JP59098484A JP9848484A JPS60244034A JP S60244034 A JPS60244034 A JP S60244034A JP 59098484 A JP59098484 A JP 59098484A JP 9848484 A JP9848484 A JP 9848484A JP S60244034 A JPS60244034 A JP S60244034A
Authority
JP
Japan
Prior art keywords
wire
bonding
cylindrical cover
ball
reducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59098484A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0428136B2 (cg-RX-API-DMAC10.html
Inventor
Hideo Ichimura
英男 市村
Masamitsu Okamura
将光 岡村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59098484A priority Critical patent/JPS60244034A/ja
Publication of JPS60244034A publication Critical patent/JPS60244034A/ja
Publication of JPH0428136B2 publication Critical patent/JPH0428136B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07173—
    • H10W72/075—
    • H10W72/07511—
    • H10W72/07541—
    • H10W72/50—
    • H10W72/5522—
    • H10W72/5524—

Landscapes

  • Wire Bonding (AREA)
JP59098484A 1984-05-18 1984-05-18 ワイヤボンデイング用雰囲気形成装置 Granted JPS60244034A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59098484A JPS60244034A (ja) 1984-05-18 1984-05-18 ワイヤボンデイング用雰囲気形成装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59098484A JPS60244034A (ja) 1984-05-18 1984-05-18 ワイヤボンデイング用雰囲気形成装置

Publications (2)

Publication Number Publication Date
JPS60244034A true JPS60244034A (ja) 1985-12-03
JPH0428136B2 JPH0428136B2 (cg-RX-API-DMAC10.html) 1992-05-13

Family

ID=14220921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59098484A Granted JPS60244034A (ja) 1984-05-18 1984-05-18 ワイヤボンデイング用雰囲気形成装置

Country Status (1)

Country Link
JP (1) JPS60244034A (cg-RX-API-DMAC10.html)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
JP2008130825A (ja) * 2006-11-21 2008-06-05 Kaijo Corp ワイヤボンディング装置
US7628307B2 (en) * 2006-10-30 2009-12-08 Asm Technology Singapore Pte Ltd. Apparatus for delivering shielding gas during wire bonding
US7644852B2 (en) * 2006-07-03 2010-01-12 Kabushiki Kaisha Shinkawa Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus
US7658313B2 (en) * 2006-07-03 2010-02-09 Kabushiki Kaisha Shinkawa Ball forming device in a bonding apparatus and ball forming method
US20120031877A1 (en) * 2008-06-10 2012-02-09 Kulicke And Soffa Industries, Inc. Gas delivery system for reducing oxidation in wire bonding operations
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
US8586416B2 (en) 2011-05-24 2013-11-19 Renesas Electronics Corporation Method of manufacturing semiconductor device
JPWO2013111452A1 (ja) * 2012-01-26 2015-05-11 株式会社新川 酸化防止ガス吹き出しユニット

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5031821A (en) * 1988-08-19 1991-07-16 Hitachi, Ltd. Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method
US7644852B2 (en) * 2006-07-03 2010-01-12 Kabushiki Kaisha Shinkawa Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus
US7658313B2 (en) * 2006-07-03 2010-02-09 Kabushiki Kaisha Shinkawa Ball forming device in a bonding apparatus and ball forming method
US7628307B2 (en) * 2006-10-30 2009-12-08 Asm Technology Singapore Pte Ltd. Apparatus for delivering shielding gas during wire bonding
JP2008130825A (ja) * 2006-11-21 2008-06-05 Kaijo Corp ワイヤボンディング装置
JP2012504317A (ja) * 2008-06-10 2012-02-16 クリック アンド ソッファ インダストリーズ、インク． ワイヤーボンディング作業における酸化軽減のためのガス配送システム
US20120031877A1 (en) * 2008-06-10 2012-02-09 Kulicke And Soffa Industries, Inc. Gas delivery system for reducing oxidation in wire bonding operations
US8313015B2 (en) 2008-06-10 2012-11-20 Kulicke And Soffa Industries, Inc. Gas delivery system for reducing oxidation in wire bonding operations
KR101434001B1 (ko) * 2008-06-10 2014-08-25 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 와이어 본딩 작업에서 산화 감소를 위한 가스 전달 시스템
US8186562B1 (en) * 2010-12-14 2012-05-29 Asm Technology Singapore Pte Ltd Apparatus for increasing coverage of shielding gas during wire bonding
KR101409731B1 (ko) * 2010-12-14 2014-06-19 에이에스엠 테크놀러지 싱가포르 피티이 엘티디 와이어 본딩 동안 차폐 가스의 커버리지를 증가시키기 위한 장치
US8586416B2 (en) 2011-05-24 2013-11-19 Renesas Electronics Corporation Method of manufacturing semiconductor device
JPWO2013111452A1 (ja) * 2012-01-26 2015-05-11 株式会社新川 酸化防止ガス吹き出しユニット

Also Published As

Publication number Publication date
JPH0428136B2 (cg-RX-API-DMAC10.html) 1992-05-13

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