JPS60242631A - 集積回路の多量製造方法 - Google Patents

集積回路の多量製造方法

Info

Publication number
JPS60242631A
JPS60242631A JP60097160A JP9716085A JPS60242631A JP S60242631 A JPS60242631 A JP S60242631A JP 60097160 A JP60097160 A JP 60097160A JP 9716085 A JP9716085 A JP 9716085A JP S60242631 A JPS60242631 A JP S60242631A
Authority
JP
Japan
Prior art keywords
conductive pattern
integrated circuits
conductive patterns
metal substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60097160A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0226390B2 (enExample
Inventor
Yoshio Miura
三浦　敬男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Sanyo Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Sanyo Electric Co Ltd, Sanyo Denki Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP60097160A priority Critical patent/JPS60242631A/ja
Publication of JPS60242631A publication Critical patent/JPS60242631A/ja
Publication of JPH0226390B2 publication Critical patent/JPH0226390B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60097160A 1985-05-07 1985-05-07 集積回路の多量製造方法 Granted JPS60242631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60097160A JPS60242631A (ja) 1985-05-07 1985-05-07 集積回路の多量製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60097160A JPS60242631A (ja) 1985-05-07 1985-05-07 集積回路の多量製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP6515679A Division JPS55157245A (en) 1979-05-25 1979-05-25 Mass producing method of integrated circuit

Publications (2)

Publication Number Publication Date
JPS60242631A true JPS60242631A (ja) 1985-12-02
JPH0226390B2 JPH0226390B2 (enExample) 1990-06-08

Family

ID=14184815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60097160A Granted JPS60242631A (ja) 1985-05-07 1985-05-07 集積回路の多量製造方法

Country Status (1)

Country Link
JP (1) JPS60242631A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804883A (en) * 1995-07-13 1998-09-08 Samsung Electronics Co., Ltd. Bonding pad in semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4528100Y1 (enExample) * 1967-09-27 1970-10-29
JPS4836983A (enExample) * 1971-09-10 1973-05-31
JPS53163062U (enExample) * 1977-05-27 1978-12-20
JPS55157245A (en) * 1979-05-25 1980-12-06 Sanyo Electric Co Ltd Mass producing method of integrated circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4528100Y1 (enExample) * 1967-09-27 1970-10-29
JPS4836983A (enExample) * 1971-09-10 1973-05-31
JPS53163062U (enExample) * 1977-05-27 1978-12-20
JPS55157245A (en) * 1979-05-25 1980-12-06 Sanyo Electric Co Ltd Mass producing method of integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5804883A (en) * 1995-07-13 1998-09-08 Samsung Electronics Co., Ltd. Bonding pad in semiconductor device

Also Published As

Publication number Publication date
JPH0226390B2 (enExample) 1990-06-08

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