JPS6023998Y2 - 加熱用圧着子 - Google Patents
加熱用圧着子Info
- Publication number
- JPS6023998Y2 JPS6023998Y2 JP17162679U JP17162679U JPS6023998Y2 JP S6023998 Y2 JPS6023998 Y2 JP S6023998Y2 JP 17162679 U JP17162679 U JP 17162679U JP 17162679 U JP17162679 U JP 17162679U JP S6023998 Y2 JPS6023998 Y2 JP S6023998Y2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed circuit
- diamond
- metal
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 title description 6
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 229910003460 diamond Inorganic materials 0.000 claims description 9
- 239000010432 diamond Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000002788 crimping Methods 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000010953 base metal Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17162679U JPS6023998Y2 (ja) | 1979-12-13 | 1979-12-13 | 加熱用圧着子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17162679U JPS6023998Y2 (ja) | 1979-12-13 | 1979-12-13 | 加熱用圧着子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5689261U JPS5689261U (enrdf_load_stackoverflow) | 1981-07-16 |
| JPS6023998Y2 true JPS6023998Y2 (ja) | 1985-07-17 |
Family
ID=29682453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17162679U Expired JPS6023998Y2 (ja) | 1979-12-13 | 1979-12-13 | 加熱用圧着子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6023998Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0314060Y2 (enrdf_load_stackoverflow) * | 1985-06-26 | 1991-03-28 |
-
1979
- 1979-12-13 JP JP17162679U patent/JPS6023998Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5689261U (enrdf_load_stackoverflow) | 1981-07-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6268691A (ja) | レ−ザビ−ムで溶接する方法 | |
| JPH0469836B2 (enrdf_load_stackoverflow) | ||
| JPS6023998Y2 (ja) | 加熱用圧着子 | |
| JPH01319993A (ja) | プリント回路基板の接続方法 | |
| JPH07118498B2 (ja) | 電気的接合部 | |
| JPS6023997Y2 (ja) | 加熱用圧着子 | |
| JPH02151095A (ja) | 基板に対するｉｃの実装方法およびｉｃ実装基板 | |
| JP2912308B2 (ja) | 表面実装部品の半田付け構造 | |
| JP2523512Y2 (ja) | フラットパッケ−ジ型ｉｃ | |
| JPH05343593A (ja) | 接続端子 | |
| JP2606273B2 (ja) | ボンディング用ヒーターチップ | |
| JPH0625017Y2 (ja) | Ｌｓｉパッケ−ジのリ−ド構造 | |
| JPH04315494A (ja) | 回路部品へのワイヤ接続方法 | |
| JPS6129159B2 (enrdf_load_stackoverflow) | ||
| JPS5919394A (ja) | 多端子素子のハンダ付方法 | |
| JPS59105347A (ja) | Ａｇろう付きストレートピンの製造方法 | |
| JPS59114849A (ja) | 混成集積回路の製造方法 | |
| JPH0467662A (ja) | パッケージリードピン | |
| JPS63132464A (ja) | 集積回路のリ−ド | |
| JPS59137174A (ja) | 予備半田付け方法 | |
| JPH05121411A (ja) | 電子部品における接続用バンプの形成方法 | |
| JPS6317581Y2 (enrdf_load_stackoverflow) | ||
| JPH0617129U (ja) | 電子部品用コンタクト | |
| JPH075680Y2 (ja) | 端子ピンの平面出し治具 | |
| JPS6225900Y2 (enrdf_load_stackoverflow) |