JPS6023983Y2 - 半導体装置用パッケ−ジ - Google Patents

半導体装置用パッケ−ジ

Info

Publication number
JPS6023983Y2
JPS6023983Y2 JP6527878U JP6527878U JPS6023983Y2 JP S6023983 Y2 JPS6023983 Y2 JP S6023983Y2 JP 6527878 U JP6527878 U JP 6527878U JP 6527878 U JP6527878 U JP 6527878U JP S6023983 Y2 JPS6023983 Y2 JP S6023983Y2
Authority
JP
Japan
Prior art keywords
bonding
package
pad
bonding pad
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP6527878U
Other languages
English (en)
Japanese (ja)
Other versions
JPS54167664U (enExample
Inventor
英二 萩本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP6527878U priority Critical patent/JPS6023983Y2/ja
Publication of JPS54167664U publication Critical patent/JPS54167664U/ja
Application granted granted Critical
Publication of JPS6023983Y2 publication Critical patent/JPS6023983Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP6527878U 1978-05-15 1978-05-15 半導体装置用パッケ−ジ Expired JPS6023983Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6527878U JPS6023983Y2 (ja) 1978-05-15 1978-05-15 半導体装置用パッケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6527878U JPS6023983Y2 (ja) 1978-05-15 1978-05-15 半導体装置用パッケ−ジ

Publications (2)

Publication Number Publication Date
JPS54167664U JPS54167664U (enExample) 1979-11-26
JPS6023983Y2 true JPS6023983Y2 (ja) 1985-07-17

Family

ID=28970191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6527878U Expired JPS6023983Y2 (ja) 1978-05-15 1978-05-15 半導体装置用パッケ−ジ

Country Status (1)

Country Link
JP (1) JPS6023983Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125258Y2 (enExample) * 1980-08-20 1986-07-29

Also Published As

Publication number Publication date
JPS54167664U (enExample) 1979-11-26

Similar Documents

Publication Publication Date Title
US5716889A (en) Method of arranging alignment marks
JPH02177277A (ja) 多接点コネクタの案内構造
JPS6023983Y2 (ja) 半導体装置用パッケ−ジ
JPH0233979A (ja) 光半導体装置
JPS63187657A (ja) 半導体装置の製造方法
JPS59175145A (ja) リ−ドフレ−ム
JPS6214690Y2 (enExample)
JPS62188350A (ja) リ−ドフレ−ム
JPH0687472B2 (ja) フィルムキャリアテープ
JPH06275736A (ja) 半導体装置
JP2578704Y2 (ja) Ｉｃソケット
JPS6260223A (ja) 半導体装置
JPS5844593Y2 (ja) ビ−ム・リ−ド型半導体装置
JPH10223705A (ja) プローブカード
JPH0623014Y2 (ja) 混成集積回路用基板
JPS62167252U (enExample)
JPH02295144A (ja) 集積回路
KR19990024743A (ko) 반도체 웨이퍼 제조용 얼라인 키 형성구조
JPS6366942A (ja) 基板上への素子の実装方法
JPS6252454B2 (enExample)
JPS61111531A (ja) 半導体装置のマスク合わせ精度検出方法
JPH01258436A (ja) Ｔａｂ　ｉｃのリードフレーム
JP2004259876A (ja) パッケージの位置決め方法及びその装置
JPS6332955A (ja) 半導体集積回路装置
JPH08330464A (ja) ピン・グリッド・アレイ構造ｌｓｉ