JPS60236223A - 基板の冷却装置 - Google Patents

基板の冷却装置

Info

Publication number
JPS60236223A
JPS60236223A JP59091879A JP9187984A JPS60236223A JP S60236223 A JPS60236223 A JP S60236223A JP 59091879 A JP59091879 A JP 59091879A JP 9187984 A JP9187984 A JP 9187984A JP S60236223 A JPS60236223 A JP S60236223A
Authority
JP
Japan
Prior art keywords
substrate
substrate holder
holder
elasticity
fine wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59091879A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0212383B2 (enrdf_load_stackoverflow
Inventor
Takashi Matsumoto
隆 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Nihon Shinku Gijutsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc, Nihon Shinku Gijutsu KK filed Critical Ulvac Inc
Priority to JP59091879A priority Critical patent/JPS60236223A/ja
Publication of JPS60236223A publication Critical patent/JPS60236223A/ja
Publication of JPH0212383B2 publication Critical patent/JPH0212383B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP59091879A 1984-05-10 1984-05-10 基板の冷却装置 Granted JPS60236223A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59091879A JPS60236223A (ja) 1984-05-10 1984-05-10 基板の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59091879A JPS60236223A (ja) 1984-05-10 1984-05-10 基板の冷却装置

Publications (2)

Publication Number Publication Date
JPS60236223A true JPS60236223A (ja) 1985-11-25
JPH0212383B2 JPH0212383B2 (enrdf_load_stackoverflow) 1990-03-20

Family

ID=14038841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59091879A Granted JPS60236223A (ja) 1984-05-10 1984-05-10 基板の冷却装置

Country Status (1)

Country Link
JP (1) JPS60236223A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142843A (ja) * 1984-08-02 1986-03-01 Ulvac Corp 基板の冷却装置
JPH04214620A (ja) * 1990-12-12 1992-08-05 Nec Kyushu Ltd イオン注入装置用ディスク
JP2005100988A (ja) * 2003-09-24 2005-04-14 Carl Zeiss Nts Gmbh 粒子放射装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6142843A (ja) * 1984-08-02 1986-03-01 Ulvac Corp 基板の冷却装置
JPH04214620A (ja) * 1990-12-12 1992-08-05 Nec Kyushu Ltd イオン注入装置用ディスク
JP2005100988A (ja) * 2003-09-24 2005-04-14 Carl Zeiss Nts Gmbh 粒子放射装置

Also Published As

Publication number Publication date
JPH0212383B2 (enrdf_load_stackoverflow) 1990-03-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees