JPH0417920B2 - - Google Patents
Info
- Publication number
- JPH0417920B2 JPH0417920B2 JP3656385A JP3656385A JPH0417920B2 JP H0417920 B2 JPH0417920 B2 JP H0417920B2 JP 3656385 A JP3656385 A JP 3656385A JP 3656385 A JP3656385 A JP 3656385A JP H0417920 B2 JPH0417920 B2 JP H0417920B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cooling plate
- cooling
- front surface
- protrusions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 50
- 238000001816 cooling Methods 0.000 claims description 43
- 238000005468 ion implantation Methods 0.000 claims description 5
- 239000000498 cooling water Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 7
- 239000012528 membrane Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3656385A JPS61197500A (ja) | 1985-02-27 | 1985-02-27 | 基板の冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3656385A JPS61197500A (ja) | 1985-02-27 | 1985-02-27 | 基板の冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61197500A JPS61197500A (ja) | 1986-09-01 |
| JPH0417920B2 true JPH0417920B2 (enrdf_load_stackoverflow) | 1992-03-26 |
Family
ID=12473225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3656385A Granted JPS61197500A (ja) | 1985-02-27 | 1985-02-27 | 基板の冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61197500A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3687877B2 (ja) * | 1996-12-18 | 2005-08-24 | 信越化学工業株式会社 | イオン注入機用プラテン |
| WO2001026141A2 (en) * | 1999-10-01 | 2001-04-12 | Varian Semiconductor Equipment Associates, Inc. | Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure |
-
1985
- 1985-02-27 JP JP3656385A patent/JPS61197500A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61197500A (ja) | 1986-09-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR960000949B1 (ko) | 반도체 웨이퍼 처리 시스템용 열 전달 장치 | |
| JPH0718438A (ja) | 静電チャック装置 | |
| GB2126418A (en) | Method for reflow of phosphosilicate glass | |
| JPH0417920B2 (enrdf_load_stackoverflow) | ||
| KR960035866A (ko) | 반도체장치의 제조방법 및 반도체장치의 제조장치 | |
| KR100250636B1 (ko) | 반도체 장치 제조용 가열챔버의 원형 가열판 | |
| JPS61264649A (ja) | 基板冷却装置 | |
| JPH0648831Y2 (ja) | 基板冷却装置用パッド | |
| HK1000613B (en) | Coplanar die to a silicon substrate bond method | |
| US20010001437A1 (en) | Holding unit vacuum machining device and method of manufacturing element | |
| JPS6156843A (ja) | 静電吸着板 | |
| JPH09217172A (ja) | 基板保持装置 | |
| JPH09260029A (ja) | 冷却機能を備えている加熱装置 | |
| JPS626138Y2 (enrdf_load_stackoverflow) | ||
| JPH06216020A (ja) | 基板熱処理装置 | |
| JPS60236223A (ja) | 基板の冷却装置 | |
| JPH0313703B2 (enrdf_load_stackoverflow) | ||
| JPS63193447A (ja) | 試料保持装置 | |
| EP0469299A2 (en) | Electrically well insulated support element for a silicon wafer used as a component in electrical and electronic circuits | |
| JPS63285928A (ja) | 半導体製造装置 | |
| JPH0665468U (ja) | 基板保持装置 | |
| JP3218759B2 (ja) | 基体保持装置 | |
| JPS6037122A (ja) | 半導体基板のアニ−ル方法 | |
| JPS61172357A (ja) | 半導体基板の冷却装置 | |
| JPS63263741A (ja) | 板状物の固定機構 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |