JPS61197500A - 基板の冷却装置 - Google Patents
基板の冷却装置Info
- Publication number
- JPS61197500A JPS61197500A JP3656385A JP3656385A JPS61197500A JP S61197500 A JPS61197500 A JP S61197500A JP 3656385 A JP3656385 A JP 3656385A JP 3656385 A JP3656385 A JP 3656385A JP S61197500 A JPS61197500 A JP S61197500A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cooling plate
- protrusions
- cooling
- front surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 238000001816 cooling Methods 0.000 claims abstract description 48
- 239000000498 cooling water Substances 0.000 claims abstract description 5
- 238000005468 ion implantation Methods 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000010703 silicon Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 239000003507 refrigerant Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- -1 polytetrafluoroethylene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3656385A JPS61197500A (ja) | 1985-02-27 | 1985-02-27 | 基板の冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3656385A JPS61197500A (ja) | 1985-02-27 | 1985-02-27 | 基板の冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61197500A true JPS61197500A (ja) | 1986-09-01 |
| JPH0417920B2 JPH0417920B2 (enrdf_load_stackoverflow) | 1992-03-26 |
Family
ID=12473225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3656385A Granted JPS61197500A (ja) | 1985-02-27 | 1985-02-27 | 基板の冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61197500A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10177964A (ja) * | 1996-12-18 | 1998-06-30 | Shin Etsu Chem Co Ltd | イオン注入機用プラテン |
| JP2003511856A (ja) * | 1999-10-01 | 2003-03-25 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | 表面構造およびその製造方法，ならびに表面構造を組み込む，静電ウエハクランプ |
-
1985
- 1985-02-27 JP JP3656385A patent/JPS61197500A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10177964A (ja) * | 1996-12-18 | 1998-06-30 | Shin Etsu Chem Co Ltd | イオン注入機用プラテン |
| JP2003511856A (ja) * | 1999-10-01 | 2003-03-25 | バリアン・セミコンダクター・エクイップメント・アソシエイツ・インコーポレイテッド | 表面構造およびその製造方法，ならびに表面構造を組み込む，静電ウエハクランプ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0417920B2 (enrdf_load_stackoverflow) | 1992-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0363687B1 (en) | Cooling structure for electronic components | |
| KR960000949B1 (ko) | 반도체 웨이퍼 처리 시스템용 열 전달 장치 | |
| EP0243710A3 (en) | Flexible finned heat exchanger | |
| GB783511A (en) | Semi-conductor devices | |
| KR19980080289A (ko) | 발열체 냉각 장치 | |
| US20240155807A1 (en) | Two-phase immersion-type heat dissipation structure having acute-angle notched structures | |
| KR960035866A (ko) | 반도체장치의 제조방법 및 반도체장치의 제조장치 | |
| JPS61197500A (ja) | 基板の冷却装置 | |
| JPH02166755A (ja) | 伝熱シート | |
| US20230266076A1 (en) | Two-phase immersion-type heat dissipation structure | |
| JPH0864662A (ja) | ウエハの固定方法 | |
| JPH0418197Y2 (enrdf_load_stackoverflow) | ||
| US3082136A (en) | Semiconductor devices and method of manufacturing them | |
| US20200296801A1 (en) | Material-removing heater device | |
| JPS5654033A (en) | Heater for substrate and chemical evaporation using said heater | |
| JPS6156843A (ja) | 静電吸着板 | |
| US8431063B2 (en) | Heat treatment for a panel and apparatus for carrying out the heat treatment method | |
| JPS6158260A (ja) | 基板の冷却装置 | |
| US20010001437A1 (en) | Holding unit vacuum machining device and method of manufacturing element | |
| US11761719B1 (en) | Two-phase immersion-type heat dissipation structure having fins with different thermal conductivities | |
| CN221486474U (zh) | 晶片固定治具 | |
| JPS60113941A (ja) | 半導体ウエ−ハ支持具 | |
| JPH09217172A (ja) | 基板保持装置 | |
| JPS6089946A (ja) | 半導体素子の冷却構造 | |
| US20250232989A1 (en) | Wafer holder device having heating function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |